Showing results: 1231 - 1238 of 1238 items found.
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cExpress-TL -
ADLINK Technology Inc.
ADLINK cExpress-TL,based on the 11th Gen Intel® Core™ i7/i5/i3 and Celeron™ processor, is the first COM Express module to support PCI Express Gen 4 at 16 GT/s, effectively doubling the bandwidth of previous generations. Additionally if features support for 2.5GbE Ethernet, leveraging existing Cat5e cable infrastructure being used for 1GbE Ethernet, it supports four USB 3.2 ports with transfer rates up to 10Gb/s. The modules have a configurable power range of 15 to 28 watts, which suits them for fanless space-constrained embedded applications. Typical industries in need of such high-performance/low-power characteristics are transport, medical, industrial automation and control, edge controllers, robotics and multi-camera-based AI. cExpress-TL features the Intel® Iris® Xe, a new graphics core, and supporting AVX-512 Vector Neural Net Instructions (VNNI) can significantly improve the number of elements processed per cycle, providing AI inferencing performance that is up to 3x that of previously available from non-VNNI platforms. Intel® Iris® Xe provides 96 execution units and is able to be configured to support two 8K independent displays or four 4K independent display (HDMI/DP/eDP). Additional support includes In-Band ECC (IBECC), providing ECC level error correction on DDR4 SODIMM memories for mission critical or rugged applications.
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SDS2000X-E Series -
SIGLENT Technologies
The SDS2000X-E series employs a new generation of SPO technology. With its excellent signal fidelity, background noise is lower than similar products in the industry. It has a minimum vertical input range of 500 uV/div, an innovative digital trigger system with high sensitivity and low jitter, and a waveform capture rate of 400,000 frames/sec (sequence mode). It also employs a 256-level intensity grading display function and a color temperature display mode not found in other models in this class. Siglent’s newest oscilloscope offering supports multiple powerful triggering modes including serial bus triggering and decoding. History waveform recording and sequential triggering allow for extended waveform records to be captured, stored, and analyzed. Also included is the deep memory FFT. This math function uses upto 1 M samples for the FFT calculation, providing the SDS2000X-E with very high frequency resolution. The hardware co-processor executes true fast measurement and math to all of 28M sample points so that there is minimal distortion on analysis. It also supports searching and navigating, on-screen Bode plot, 16 channel digital /MSO (optional), an external USB powered 25 MHz AWG function generator module (option), a USB WIFI adapter for wireless control and monitoring (option), and an embedded application that allows remote control via web browser. The features and high-performance of the SDS2000X-E oscilloscopes cannot be matched else anywhere at this price.
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MIC-6313 -
Advantech Co. Ltd.
The MIC-6313 is Advantech’s next generation single processor 6U VPX blade, based on the 4th/ 5th Generation Intel® Core™ and Intel® Xeon® Processor E3 Lv4 embedded platform. To enable the highest performance available in the 6U VPX form factor for workstation and compute intense applications, the four Serial RapidIO ports in the VPX data plane offer high speed up to 5Gb/s, low latency, scalable, error recoverable deterministic interconnectivity to digital front ends such as DSP and FPGA cards. In addition, two PCI Express ports x8 lanes in the VPX expansion plane, with up to PCI Express gen. 2 (5Gb/s) throughput offer a high performance interface to mainstream peripherals and I/O cards. With a SO-DIMM socket and additional soldered, onboard DRAM with ECC in a dual channel design running up to 1600MT/s, the MIC-6313 can be integrated into various harsh environments while maintaining maximum memory throughput, and supports memory expansion by using the latest SO-DIMM technology simultaneously. In addition, the 4th/ 5th generation Intel® Core™ and Xeon® E3 Lv4 embedded processors offer increased cache size and efficiency, as well as instruction set improvements, which make the MIC-6313 a high performance compute engine with outstanding floating point and vector processing performance. Tailored for harsh environments, the MIC-6313 has a native ruggedized convection cooled heat sink adaptable to various chassis environments; with the alternative optional air cooled heat sink, additional I/O is provided on the front panel. An onboard soldered, industrial SSD is included for maximum reliability, and a CFast/ SSD socket is also available for a costefficient, modular storage. By using Intel®’s powerful PCH (Lynx Point) with its advanced SATA controller, the MIC-6313 offers high storage capacity at up to 6Gbps transfer speed. An onboard XMC site with PCIe x8 gen.3 connectivity can host high speed offload or I/O mezzanines. Two USB 3.0 ports on the front panel can connect to external devices with up to 5Gbps data rate. Network and remote connectivity can be achieved via a RS-232 console (RJ-45) and two GbE RJ-45 ports, powered by Intel®’s latest Gigabit Ethernet controller. The next generation graphics engine Intel® Iris Pro offers up to 2x the graphic performance compared to previous generation solutions. Triple independent display support can be implemented by using the MIC-6313’s DVI front panel port and two DVI interfaces on rear transition modules. Audio is powered by a ALC892 controller via the backplane interface, and provides media support. Four SATA ports (SATAIII) and four USB ports (2x USB 3.0, 2x USB 3.0) are also connected to the backplane to fulfill the demand for extra IO ports or storage. Four GbE ports (two SERDES selectable) support system level IP connectivity, and four UART interfaces (RS232/422/485 selectable) can be leveraged to interface to legacy devices and consoles.
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TDEMI Mobile+ series -
Gauss Instruments
The new benchmark for your fastest product pre-certifications on the planet. The new TDEMI Mobile+ (TDEMI M+) receiver series of GAUSS INSTRUMENTS is a very compact and robust designed instrument for optimum mobility and outdoor use as well as on developers workbench in your lab. It provides a vast variety of functionalities. The TDEMI M+ receiver series is equipped with a +12V supply - so it can be easily used for on-board testing, e. g. in vehicles or aircrafts and so on. By its integrated touch-sensitive and high resolution screen and the embedded PC the TDEMI M+ is a fully stand-alone instrument independent from any control or host or display unit e. g. as a PC or laptop. Thus it provides even more flexibility for your emission measurements. Furthermore the instrument can be powered by a battery pack (Option BAT-UG) making it even more flexible and easy to carry it around without any need of an external power supply. Especially designed for your todays challenging pre-certification tasks the TDEMI M+ provides the absolutely unrivaled advantages in speed and performance of the well known and market approved GAUSS INSTRUMENTS time-domain and RF technology. Thus, your pre-certification measurements and investigations can be performed up to 16000 times faster than by conventional receivers. The instruments of the TDEMI M+ receiver series are available for the frequency ranges up to 1 GHz, 3 GHz, 6 GHz or 7 GHz starting from 9 kHz each. Additionally these blazing fast measurements can be carried out even starting from 10 Hz optionally (Option MIL/DO-UG).
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B&W Tek, Inc.
We offer a full suite of software for spectroscopic data collection and analysis designed for users at all levels, and varying applications. Our standard BWSpec® spectral data acquisition software allows for easy collection of data from our Raman systems and modular spectrometers. It includes tools for instrument control for data collection and spectral manipulation. The raw data and corrected data are stored and can be easily viewed. Data manipulation tools include smoothing, baseline correction and derivatives. Data can be saved in different formats for use in additional application software. For spectral identification against Raman spectral libraries with a simple interface for immediate identification for verification with a pass/fail result, our BWID® software provides qualitative analysis. Users of BWID software can create their own Raman spectral libraries, or select from our numerous ready to use libraries. For identification with portable Raman in regulated environments, the US FDA 21 CFR part 11- complaint version of BWID can be used. B&W Tek’s unique see-through identification using the STRam® can also be done using the BWID software operating on the embedded tablet computer of the STRam system. For quantitative analysis, data collected with BWSpec or other packages can be imported into the BWIQ® multivariate data analysis software, offering a full suite of data preprocessing, regression and classification analysis algorithms. PLS regression models from the BWIQ software an be used in rel-time in our BWAnalyst software, for use with the QTRam , as well as in Metrohm’s Vision® software. The i-Raman series portable Raman instruments can also be operated for single acquisition, or for real-time analysis in the Routine Analysis mode of the Vision software.
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AIM GmbH
AIM’s ARINC825 cards can work either with full functionality as an active CAN node for testing and simulating or in listening only mode for monitoring and recording purposes of Avionic CAN bus (ARINC825) applications on up to 4 electrically isolated CAN bus nodes concurrently. All nodes are in conformance with the ISO11898-1/-2 standard. They are accessible by software separately and can be used as 4 independent CAN bus nodes. An onboard IRIG-B time decoder allows users to accurately synchronize single or multiple modules to a common time source. All supported signals are available through front I/O and rear I/O interface. ARINC825 cards consist of FPGA based CAN interface controllers as well as a FPGA based 32-bit microcontroller core and a separate processor for IRIG-B synchronization with high resolution time stamping. All nodes are operating concurrently at CAN bus high speed bit rate of up to 1Mbit/s with the intelligence to process scheduling of CAN frames in real time onboard to significantly off-load the host processor.For embedded applications the AMC825-4 PMC module is available in a conduction cooled version. Using AIM’s family of PCI, CPCI (3U and 6U) and VMEbus carrier cards for PMC our clients have off the shelf solutions in a broad range of card formats. ARINC825 (CAN bus) modules are delivered with an Application Programming Interface (API) and Driver Software compatible with Windows, Linux and VxWorks.An ARINC825 Resource Component is available for AIM’s PBA.pro™ databus test and analysis tool including Tx and Rx simulation capabilities, a Chronological Bus Monitor and support for decoding of payload data within CAN messages. This allows to implement a powerful ARINC825 (CAN bus) analyzer or a complete test system in conjunction with other AIM avionics databus interfaces and PBA.pro™ supported 3rd party hardware.
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MIC-6330 -
Advantech Co. Ltd.
Based on the Intel® Xeon® E3 Lv5 and Lv6 embedded platform, the MIC-6330 builds on the success of Advantech’s 6U VPX boards, and is the first 3U VPX product launched by Advantech. Together with the Intel® processor, the MIC-6330 offers intense computational ability in a very compact form factor. The MIC-6330 provides configurable connectivity (up to four ports) of PCI Express via the backplane to the highest performance mainstream peripherals and I/O cards, and vast I/O functions for extended interconnectivity and controllability. The MIC-6330 meets various computing needs, including vPro™ and workstation capabilities, by using the Intel® CM236/CM238 PCH. The MIC-6330 offers high storage capacity at up to SATA 6Gbps transfer speed. Four USB2.0 ports and one USB 3.0 port to the backplane fulfill requirements for extra I/O ports or storage, up to 5Gbps data rate. Four GbE ports (two ports configurable as SERDES) support system level IP connectivity, and the UART interfaces (RS-232/422/485 selectable) can be leveraged as an interface to legacy devices and consoles. Like Advantech’s 6U VPX products, the MIC-6330 supports multiple displays, and the maximum resolution of the MIC-6330 is 4K, empowered by the Intel® integrated graphics engine. The MIC-6330 also offers a High Definition Audio to the backplane interface for media demands. With the standard ruggedized convection cooled heatsink or the optional air-cooled heatsink, the MIC-6330 is tailored for harsh environmental applications and adaptable to various chassis designs. The industrial NAND Flash, and the soldered onboard DDR4 ECC memory chips are appropriate for a variety of vehicle applications for the maximum reliability. The MIC-6330 is sophisticated and suitable for various purposes. An onboard X8D XMC site with PCIE x8 gen.3 connectivity can host high speed offload or I/O mezzanines for project-specific applications. For applications that need the maximum expandability, the XMC interface can be modified to add another DisplayPort and the 2 more UART. The optional front I/O module facilitates the development and qualification process, and also enables the possibility of the front panel access.
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MIC-6314 -
Advantech Co. Ltd.
The MIC-6314 is Advantech’s next generation single processor 6U VPX blade, based on the 4th/ 5th Generation Intel® Core™ embedded platform with increased cache size and efficiency, as well as instruction set improvements. The MIC-6314 provides two configurable PCIE x 8 ports in the VPX data plane and two PCI Express ports x8 lanes in the VPX expansion plane to enable the highest performance available in the 6U VPX form factor compute intense applications. These PCIE interfaces offer high speed up to PCIE gen. 2 (5Gb/s) throughput, low latency, scalable, error recoverable deterministic interconnectivity to the mainstream peripherals and I/O cards such as DSP and FPGA cards. The PCIE widths and ports on the data plane and the extension plane of MIC-6314 is user configurable, which make MIC-6314 capable to replace the PCIE switch blade in a small system. With a SO-DIMM socket and additional soldered, onboard DRAM with ECC in a dual channel design running up to 1600MT/s, the MIC-6314 can be integrated into various harsh environments while maintaining maximum memory throughput, and supports memory expansion by using the latest SO-DIMM technology simultaneously. Tailored for harsh environments, the MIC-6314 has a native ruggedized convection cooled heat sink adaptable to various chassis environments; with the alternated optional air cooled heat sink, additional I/O is provided on the front panel. An onboard soldered, industrial SSD is included for maximum reliability, and a SSD socket is also available for a cost-efficient, modular storage. By using Intel®’s powerful PCH (Lynx Point) with its advanced SATA controller, the MIC-6314 offers high storage capacity at up to 6Gbps transfer speed. An onboard XMC site with PCIe x8 gen.3 connectivity can host high speed offload or I/O mezzanines. Two USB 3.0 ports on the front panel can connect to external devices with up to 5Gbps data rate. Network and remote connectivity can be achieved via a RS-232 console (RJ-45) and two GbE RJ-45 ports, powered by Intel®’s latest Gigabit Ethernet controller. The Intel® next generation graphics engine Iris Pro offers up to 2x the graphic performance compared to previous generation solutions. Triple independent display support can be implemented by using VGA and 2 DVI ports on MIC6314. Audio is powered by a ALC892 controller via the backplane interface, and provides media support. A PCIEinterface is reserved for the optional M.2 high speed storage.Besides the modern M.2 storage, three SATA III one SATA II and four USB ports (2x USB 3.0, 2x USB 3.0) are also connected to the backplane to fulfill the demand for extra IO ports or storage. Four GbE ports (two SERDES selectable) support system level IP connectivity, and four UART interfaces (RS232/422/485selectable) can be leveraged to interface to legacy devices and consoles.
