Showing results: 91 - 100 of 100 items found.
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NTS3700 Series -
Novtek Test Systems
FLASH memory endurance cycling systems are used to characterize and qualify the write/erase cycling endurance of FLASH memory devices, and to conduct functional testing of memory devices at extreme temperatures. A typical system consists of an environmental chamber, algorithmic pattern generator, programmable power supplies and system controller.Novtek’s systems can accommodate from 64 to 864 devices for parallel devices and . In addition to FLASH, the systems can also accommodate MRAM, EEPROM, EPROM, PROM (OUM), Mask ROM, SRAM, FeRAM, DRAM, PC Cards (PCMCIA), embedded FLASH microcontrollers and NVM based FPGA. The system's environmental chamber has a range of -55oC to +200oC and is ideal for temperature characterization of memory based devices and packages.
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783486-01 -
NI
Kintex 7 325T FPGA, 128 DIO, 512 MB DRAM, PXI Digital Reconfigurable I/O Module—The PXIe‑7822 is a reconfigurable I/O (RIO) device that features a user-programmable FPGA for onboard processing and flexible I/O operation. With LabVIEW FPGA, you can individually configure the digital lines as inputs, outputs, counter/timers, PWM, encoder inputs, or specialized communication protocols. You can also program custom onboard decision making that executes with hardware-timed speed and reliability. Each line offers software-selectable logic levels. The PXIe‑7822 supports peer‑to‑peer streaming for direct data transfer between PXI Express modules. The PXIe‑7822 is well-suited for a wide variety of applications, such as high-speed waveform generation, sensor simulation, hardware‑in‑the‑loop (HIL) test, bit error rate test, and other applications that require precise timing and control.
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CP62201 -
LinkedHope Intelligent Technologies Co.,Ltd.
CP62201 is a 6U compactPCI Express board based on Intel 4th generation core i7/i5 processors, up to 4 cores/8 threads, with base frequency at 2.4GHz, and turbo frequency up to 3.4GHz. CP62201 supports up to 16GB onboard soldered low voltage DRAM with ECC, dual channel, up to 1600MHz. CP62201 supports up to 6 SATA storage ports, one of which connects up to 128GB onboard Flash storage. The populated memory and SSD enhance the anti-shock and vibration performance.CP62201 integrates Intel® HD Graphics 4600 controller, supporting a variety of display outputs, such as eDP, DP, HDMI, DVI and VGA. The output resolution of VGA is up to 2048x1536, while it can be up to “4K” with HDMI, DP or eDP outputs. CP62201 supports one VGA and two DVI, up to three independent or cloned displays.CP62201 uses high speed ZD connectors for transferring PCIe3.0 USB3.0 and SATAIII and other high speed interfaces.
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CP62007 -
LinkedHope Intelligent Technologies Co.,Ltd.
CP62007 is a 6U processor blade based on Intel’s 4th generation core i7/i5 processors using 22nm process technology, supporting up to four cores / eight threads at 2.4GHz. CP62007 supports up to 16GB onboard soldered low voltage DRAM with ECC. It also offers up to 64/128GB SLC/MLC onboard SATA SSD for installing operating system and drivers. The onboard design of memory and SSD enhance the anti-shock and vibration performance dramatically.CP62007’s onboard processor integrates Intel® HD Graphics 4600 controller, supporting a variety of display outputs, such as eDP/DP/HDMI/DVI/VGA. And the VGA resolution is up to 2048x1536. With HDMI/DP/eDP outputs, the resolution can be up to “4K”.CP62007 supports 1x VGA and 2x DP/HDMI/DVI, up to 3 independent or cloned displays.CP62007 uses high speed CPCI connectors on J3 and J4 position for transferring high speed serial signals, such as PCIe2.0, USB3.0 and SATAIII. And the foot-print of high speed connectors are fully compliant with CompactPCI specifications.
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eBOX700-891-FL -
Axiomtek Co., Ltd.
The eBOX700-891-FL is an expansion-rich fanless embedded system powered by the 7th generation Intel® Core™ i7/i5/i3 and Celeron® processors (codename: Kaby Lake) with the Intel® H110 chipset. It supports dual DDR4-2133 SO-DIMM slots with up to 32GB system memory. This embedded box PC comes with a user-friendly mechanism design and offers great flexibility, reliability, and scalability, well suited for vision inspection (USB/PoE), motion control, security surveillance and industrial automation. The eBOX700-891-FL is designed with user friendliness in mind. Its heatsink top cover can simply be opened by unfastening the four screws for the access to the processor and DRAM. Moreover, its bottom cover adopts a convenient flip lid design along with easy-to-access brackets for securing the USB dongle and hard drive. Axiomtek has obtained patents, No. M511183 and No. M531115, for the special chassis design of the eBOX700-891-FL. Easy maintenance is one of the advantages we are offering to our customers and one of the main focuses of our product development. We will continue pursuing excellence and innovation in design and manufacturing.
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LEC-iMX6R2 -
ADLINK Technology Inc.
The SMARC ("Smart Mobility ARChitecture") is a versatile small form factor computer Module definition targeting applications that require low power, low costs, and high performance. The Modules will typically use ARM SOCs similar or the same as those used in many familiar devices such as tablet computers and smart phones. Alternative low power SOCs and CPUs, such as tablet oriented X86 devices and other RISC CPUs may be used as well. The Module power envelope is typically under 6W. The Modules are used as building blocks for portable and stationary embedded systems. The core CPU and support circuits, including DRAM, boot flash, power sequencing, CPU power supplies, GBE and a single channel LVDS display transmitter are concentrated on the Module. The Modules are used with application specific Carrier Boards that implement other features such as audio CODECs, touch controllers, wireless devices, etc. The modular approach allows scalability, fast time to market and upgradability while still maintaining low costs, low power and small physical size. To stress on its low power consumption feature, ADLINK has named SMARC products as LEC (Low Energy Computer on module) series.
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MIC-3396 -
Advantech Co. Ltd.
Using 4th generation Intel® Core™ i3/i5/i7 processors based on 22nm process technology supporting up to four cores / eight threads at 2.4GHz and 6MB last level cache, the MIC-3396 blade boosts computing performance deploying the latest virtualization, techniques and CPU enhancements. Onboard soldered low voltage DRAM (1.35V) with ECC support and optional memory expansion via an SODIMM socket extend the memory to a maximum of 16GB supporting the most demanding applications in high performance or virtualized environments. Dual channel design and memory speeds up to 1600MT/s along with increased cache size and cache algorithms guarantee maximum memory performance. Combined with the powerful Intel® QM87 chipset, the 4th generation Intel® Core™ processors offer improved I/O performance by leveraging 5GT/s DMI and 3rd generation PCIe interfaces. An onboard XMC/PMC site with PCIe x8 gen.3 connectivity can host high speed offload or I/O mezzanines such as the MIC-3666 dual 10GE XMC card. With SATA-III support and up to 7Gbps I/O. the latest enhancements in storage technology such as high speed SSDs or traditional HDDs can be used on the MIC-3396. Five gigabit Ethernet ports based on Intel® GbE controllers for front and rear,including two PICMG 2.16, ensure best in class network connectivity The processor’s integrated enhanced graphics engine (Iris) offers twice the performance over previous generations. With triple independent display support, the MIC-3396 is an ideal fit for demanding workstation applications. RASUM features integrated in the CPU and chipset combined with PICMG 2.9, IPMI-based management make the MIC-3396 a highly available and reliable computing engine. The RIO-3316 RTM module supports one PS/2 connector with both keyboard and mouse ports, one USB 3.0, two USB 2.0 ports, two RS-232 ports, two SATA ports, two DVI ports, and two Gigabit Ethernet ports. In case of the SATA disk drives and SATA RAID support of the QM87 do not meet performance and reliability requirements, the RIO-3315 SAS version supports a 4-port SAS controller with RAID and fail over support.
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MIC-6311 -
Advantech Co. Ltd.
Advantech’s MIC-6311 is a single processor VPX blade based on the 4th generation Intel® Core™ i3/i5/i7 platform. It enables the highest performance available in 6U VPX form factor with two SRIOx4 ports in the VPX data plane and two PCI Express x8 gen. 3 lanes in the VPX expansion plane for workstation and compute intense applications. The two Serial RapidIO ports offer the possibility to interface the MIC-6311 to digital front ends such as DSP and FPGA cards via a high speed, low latency deterministic interconnect. In addition, PCI Express ports with up to 8GB/s throughput offer a high performance interface to mainstream peripherals and IO cards. With a SO-DIMM socket and additional soldered, onboard DRAM with ECC in a dual channel design running up to 1600MT/s, the MIC-6311 offers the ability to fit harsh environments while maintaining maximum memory throughput and supporting memory expansion using the latest SO DIMM technology. Moreover, the 4th generation Intel® Core™ processors offer increased cache size and efficiency as well as instruction set improvements which make the MIC-6311 a high performance compute engine with outstanding floating point and vector processing performance. Tailored for rugged environments, MIC-6311 has been designed to support ruggedized convection cooled heat sinks. Additionally, it implements an onboard soldered, industrial SSD for maximum reliability. By using the latest powerful PCH (Lynx Point) from Intel®, with its advanced SATA controller advanced storage options are supported such as a 2.5" SATA III HDD/SSD socket offering high storage capacity with up to 6Gbps transfer speed. A CFast socket provides an alternative for implementing a cost efficient, pluggable SSD. An onboard XMC/PMC site with PCIe x8 gen.3 connectivity can host high speed offload or I/O mezzanines. Two USB 3.0 ports in front panel can connect to the external devices with up to 5Gbps data rate. Network and remote connectivity can be achieved via a RS232 console (RJ45) and two GbE RJ45 ports, powered by Intel®’s latest Gigabit Ethernet Controiller, the i350. The processor’s integrated enhanced graphics engine Iris offers up to 2x the graphic performance compared to previous generation solutions. Triple independent display support can be implemented by using the MIC-6311’s VGA front panel port and two Display port / HDMI interfaces on rear transition modules. Audio port support via the backplane interface enhances media support. Three SATA ports (SATAIII) and four USB ports (2x USB 3.0, 2x USB 3.0) are also connected to backplane to fulfill the demand for extra IO ports or storage. Two GbE/ SERDES ports support system level IP connectivity and two UART interfaces can be leveraged to interface to legacy devices and consoles.
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MIC-6314 -
Advantech Co. Ltd.
The MIC-6314 is Advantech’s next generation single processor 6U VPX blade, based on the 4th/ 5th Generation Intel® Core™ embedded platform with increased cache size and efficiency, as well as instruction set improvements. The MIC-6314 provides two configurable PCIE x 8 ports in the VPX data plane and two PCI Express ports x8 lanes in the VPX expansion plane to enable the highest performance available in the 6U VPX form factor compute intense applications. These PCIE interfaces offer high speed up to PCIE gen. 2 (5Gb/s) throughput, low latency, scalable, error recoverable deterministic interconnectivity to the mainstream peripherals and I/O cards such as DSP and FPGA cards. The PCIE widths and ports on the data plane and the extension plane of MIC-6314 is user configurable, which make MIC-6314 capable to replace the PCIE switch blade in a small system. With a SO-DIMM socket and additional soldered, onboard DRAM with ECC in a dual channel design running up to 1600MT/s, the MIC-6314 can be integrated into various harsh environments while maintaining maximum memory throughput, and supports memory expansion by using the latest SO-DIMM technology simultaneously. Tailored for harsh environments, the MIC-6314 has a native ruggedized convection cooled heat sink adaptable to various chassis environments; with the alternated optional air cooled heat sink, additional I/O is provided on the front panel. An onboard soldered, industrial SSD is included for maximum reliability, and a SSD socket is also available for a cost-efficient, modular storage. By using Intel®’s powerful PCH (Lynx Point) with its advanced SATA controller, the MIC-6314 offers high storage capacity at up to 6Gbps transfer speed. An onboard XMC site with PCIe x8 gen.3 connectivity can host high speed offload or I/O mezzanines. Two USB 3.0 ports on the front panel can connect to external devices with up to 5Gbps data rate. Network and remote connectivity can be achieved via a RS-232 console (RJ-45) and two GbE RJ-45 ports, powered by Intel®’s latest Gigabit Ethernet controller. The Intel® next generation graphics engine Iris Pro offers up to 2x the graphic performance compared to previous generation solutions. Triple independent display support can be implemented by using VGA and 2 DVI ports on MIC6314. Audio is powered by a ALC892 controller via the backplane interface, and provides media support. A PCIEinterface is reserved for the optional M.2 high speed storage.Besides the modern M.2 storage, three SATA III one SATA II and four USB ports (2x USB 3.0, 2x USB 3.0) are also connected to the backplane to fulfill the demand for extra IO ports or storage. Four GbE ports (two SERDES selectable) support system level IP connectivity, and four UART interfaces (RS232/422/485selectable) can be leveraged to interface to legacy devices and consoles.
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MIC-6313 -
Advantech Co. Ltd.
The MIC-6313 is Advantech’s next generation single processor 6U VPX blade, based on the 4th/ 5th Generation Intel® Core™ and Intel® Xeon® Processor E3 Lv4 embedded platform. To enable the highest performance available in the 6U VPX form factor for workstation and compute intense applications, the four Serial RapidIO ports in the VPX data plane offer high speed up to 5Gb/s, low latency, scalable, error recoverable deterministic interconnectivity to digital front ends such as DSP and FPGA cards. In addition, two PCI Express ports x8 lanes in the VPX expansion plane, with up to PCI Express gen. 2 (5Gb/s) throughput offer a high performance interface to mainstream peripherals and I/O cards. With a SO-DIMM socket and additional soldered, onboard DRAM with ECC in a dual channel design running up to 1600MT/s, the MIC-6313 can be integrated into various harsh environments while maintaining maximum memory throughput, and supports memory expansion by using the latest SO-DIMM technology simultaneously. In addition, the 4th/ 5th generation Intel® Core™ and Xeon® E3 Lv4 embedded processors offer increased cache size and efficiency, as well as instruction set improvements, which make the MIC-6313 a high performance compute engine with outstanding floating point and vector processing performance. Tailored for harsh environments, the MIC-6313 has a native ruggedized convection cooled heat sink adaptable to various chassis environments; with the alternative optional air cooled heat sink, additional I/O is provided on the front panel. An onboard soldered, industrial SSD is included for maximum reliability, and a CFast/ SSD socket is also available for a costefficient, modular storage. By using Intel®’s powerful PCH (Lynx Point) with its advanced SATA controller, the MIC-6313 offers high storage capacity at up to 6Gbps transfer speed. An onboard XMC site with PCIe x8 gen.3 connectivity can host high speed offload or I/O mezzanines. Two USB 3.0 ports on the front panel can connect to external devices with up to 5Gbps data rate. Network and remote connectivity can be achieved via a RS-232 console (RJ-45) and two GbE RJ-45 ports, powered by Intel®’s latest Gigabit Ethernet controller. The next generation graphics engine Intel® Iris Pro offers up to 2x the graphic performance compared to previous generation solutions. Triple independent display support can be implemented by using the MIC-6313’s DVI front panel port and two DVI interfaces on rear transition modules. Audio is powered by a ALC892 controller via the backplane interface, and provides media support. Four SATA ports (SATAIII) and four USB ports (2x USB 3.0, 2x USB 3.0) are also connected to the backplane to fulfill the demand for extra IO ports or storage. Four GbE ports (two SERDES selectable) support system level IP connectivity, and four UART interfaces (RS232/422/485 selectable) can be leveraged to interface to legacy devices and consoles.
