Showing results: 16 - 27 of 27 items found.
-
CSP-F1 -
TEGAM Inc.
TEGAM''s Humitran-C Series offers a total temperature and humidity monitoring solution for virtually any application. Each temperature/ humidity controller includes an RH & temperature duct probe, which can be placed up to thousands of feet from the controller. The C series controllers have dual set points with recorder and relay outputs for interfacing to air temperature & humidity devices.
-
DT5770 -
CAEN S.p.A.
The DT5770 is a compact portable 16k Digital MCA for Gamma Spectroscopy, integrating analog front-end with programmable gain and possible AC coupling. It is ideally suited for high energy resolution semiconductor detectors, like HPGe and Silicon, connected to a Charge Sensitive Preamplifier (CSP). The unit can also properly operate directly connected to a PMT with inorganic scintillators (e.g. Nal or Csl scintillators), provided exponential pulse shape and decay time above 200 ns.
-
Renesas Electronics Corp.
The ISL911xx buck-boost regulator family is capable of working with the ultra-small inductors and capacitors to fit within less than 14mm2 board footprint, making them the ideal 2A switching converter solution for space-constrained mobile devices. The advanced wafer-level CSP package requires only a single inductor and very few external components, which minimizes overall space requirements. The ISL911xx regulators’ 2.5MHz switching frequency further reduces the power supply solution size.
-
CSP-30TS-011 -
ECT
high frequency probes for the PCBA test market. This next generation coaxial probe provides instrumentation-quality interface for broadband RF measurements exceeding 20GHz, delivering superior performance while seamlessly mating with pads, vias, and other board features. The CSP-30TS-011 RF probe combines several innovative features to provide a truly reliable and cost-effective testing solution.
-
MV-3L -
MIRTEC Co., Ltd.
- Exclusive10MP/18MPCameraTechnology- Precision Telecentric Compound Lens Design- Eight Phase Color Lighting System- 10MP / 18MP SIDE-VIEWER® Camera System- Extremely Simple Programming and Operation- Integrated INTELLI-BEAM® Laser Inspection System- 3D Co-Planarity Inspection of BGA and CSP Devices- Enhanced 3D Solder Paste Height Measurement Capability - INTELLISYS® Industry 4.0 Intelligent Factory Automation System
-
4900 -
BPM Microsystems
The 4900 is powered by the newest BPM 9th generation technology, which delivers the fastest programming speeds in the industry for MCU’s, eMMC HS400, NAND, NOR and Serial Flash devices. BPM 9th generation technology produces 200 MHz signals, allowing each byte of data to transfer in up to 2.5 ns. Up to 9 times faster than competing programmers. 3D Vision option inspects BGA, CSP, QFP, TSOP, SOIC and J-Lead devices for coplanarity, bent lead, pitch, width, diameter, standoff and XY errors.
-
MV-6e -
MIRTEC Co., Ltd.
- Exclusive10MP/18MPCameraTechnology- Precision Telecentric Compound Lens Design- Eight Phase Color Lighting System- 10MP / 18MP SIDE-VIEWER® Camera System- Extremely Simple Programming and Operation- Integrated INTELLI-SCAN® Laser Inspection System- 3D Co-Planarity Inspection of Gull-Wing Leads, BGA and CSP - - -- Devices- Enhanced 3D Solder Paste Height Measurement Capability- INTELLISYS® Industry 4.0 Intelligent Factory Automation System
-
FH-1200 -
MCT, Inc.
Universal testing capabilities for film mounted strip handling. It works with semiconductor test devices including QFN, BGA, CSP and WLP to assure the highest first pass yields available by enabling increases from 1% to 10%+ through precise contactor alignment and device positioning accuracy. Supported by a cutting-edge data management system and analysis software, FH-1200 includes Smart-Track and Smart-EM – your “Virtual Process Engineer” – to handle electronic strip mapping, process control and data management.
-
Xeltek Inc.
Xeltek engineers work around the clock to maintain the largest device library in the industry, so new devices are being added on a daily basis for EPROM, Paged EPROM, Parallel and Serial EEPROM, FPGA Configuration PROM, FLASH memory (NOR), BPROM, NVRAM, SPLD, CPLD, EPLD, Firmware HUB, Microcontroller, and MCUs. The majority of SuperPro universal programmers come equipped with a ZIF socket supporting up to 144 pins for programming a wide range of DIP devices; other chip package supported includes SDIP, PLCC, JLCC, SOIC, QFP, TQFP, PQFP, VQFP, TSOP, SOP, TSOPII, PSOP, TSSOP, SON, EBGA, FBGA, VFBGA, uBGA, CSP, and SCSP.
-
DMC-52xx0 -
Galil Motion Control, Inc.
The DMC-52xx0 EtherCAT Master is Galil Motion Control's first 32 axis motion controller. It is a pure EtherCAT controller capable of controlling up to 32 drives and 2 IO modules on one EtherCAT Network in a small, space efficient package. The DMC-52xx0 makes configuration and programming easy with just a handful of EtherCAT configuration commands and Galil’s intuitive, two-letter programming language. The DMC-52xx0 is offered in 2, 4, 8, 16, and 32 axis formats. Coordinated moves can be done within banks of 8 allowing for minimal changes to Galil’s programming language. Galil supports a variety of EtherCAT drives to accommodate most applications. The DMC-52xx0 operates in Cyclic Synchronous Position mode (CSP). In this mode the servo control loop is closed on the EtherCAT drive while the Galil sends motion profile data at a 1 kHz rate. The DMC-52xx0 features 8 uncommitted opto-isolated inputs and 8 uncommitted opto-isolated high power outputs. It also includes 8 uncommitted analog inputs and 8 uncommitted analog outputs. One 100 Mbps Ethernet port and one USB (serial) port are provided for communication with a host PC or external devices.
-
Ironwood Electronics
SM Contact is a unique contact that has precise silver balls held together by a proprietary conductive formulation. These conductive columns (diameter optimized for 50 ohm impedance) are suspended in a non-conductive flexible elastomer substrate with a patented solid core for enhanced durability and reliable performance over time, temperature and cycles. This flexible substrate is very compliant and resilient and enables the conductive columns to revert back to original shape when the force is removed. Solutions are available for 0.25mm to 1.27mm LGA, BGA, QFN, CSP, POP, WLP and other packages. The silver ball matrix contact technology is also available with a protective plunger matrix (a gold plated copper cylinder) that sits on top of the conductive columns. This plunger matrix protects the conductive column from contamination from various solder ball interfaces. A quickly replaceable plunger matrix enables minimal downtime during final production test. The product family code for this line of sockets is SMP.
-
Xeltek
Until now,Support 401 IC manufacturer, 103004 pcs devices and keeps growing.Features:Supports 87454 types of devices from 305 IC manufacturers (by 3/15/2013) and keeps growing.Supports EPROM、Paged EPROM、Parallel and Serial EEPROM、FPGA、PROM、FLASH(NOR & NAND)、BPROM、NVRAM、SPLD、CPLD、EPLD、Firmware HUB、Microcontroller、MCU；Supports devices with Vcc as low as 1.2V. Socket Adaptors available for DIP、SDIP、PLCC、JLCC、PGA、LGA、SOIC、SOJ、SOT、QFP、TQFP、PQFP、VQFP、MQFP、LQFP、TSOP、SOP、TSOPII、PSOP、SSOP、TSSOP、SON、EBGA、FBGA、FTBGA、VFBGA、μBGA、CSP、SCSP、QFN、HVQFN etc.High programming speed.Built with 144 universal pin-drivers. Universal adaptors are available for varies packages up to 144 pins. Quick new device support. Popular NAND FLASH Platform supported including Samsung (XSR1.0/1.6), QualComm, HYNIX（HIFFS）, MTK(Solution V1.1), ICERA (v1.0/2.0), ST （7162、7141等）, AMLOGIC(IF2/0), REALTEK, PICOCHIP, DataLight ( Flash FX Pro), Marvell(310/303/920/935…), BroadCom, ZTE, Intel (CE4100)，UBI, LEADCORE(L1809OG), MSATR etc. Customer-specific NAND solution available.PC hosted mode and stand-alone dual modes. Under PC hosted mode the programmer is controlled by a PC via USB2.0 (high speed) to program a chip. Under stand-alone mode the programmer is controlled via a 6-KEY keypad and a 20 character by 4 line LCD display. A CF card is used to store the project files.User can operate multiple units to construct a concurrent multiprogramming system thank for the stand-alone mode. IC manufacturer approved programming algorithms are used for high reliability.Testing functions for logic devices.Advanced and powerful software functions.Production mode starts chip operation at the moment the chip is inserted in the socket properly.Project function simplifies processes such as device selection, file loading, device configuration setting, program option, and batch file setting into one touch step.Password can be set for project files and production volume controlBatch command combines device operations like program, verify, security into a single command at any sequence.Dynamic buffer makes it possible that each chip is programmed with different data file. Applications including serial number, MAC address etc.Log file is useful for quality tracking.Many safety mechanisms are built including self-diagnosis, wrong chip placement detection, poor-pin-contacting detection, ID checking, over-current and over-voltage protection etc.Windows XP/Vista/Win7/ Win8/Win10 compatibility.
