Showing results: 16 - 30 of 441 items found.
-
ARIES -
Diamond Systems Corp
The Aries PC/104-Plus single board computer from Diamond Systems uses the Intel “Bay Trail” E3800 series processor to deliver an unmatched combination of performance, price and power consumption. Packed with real-world features, Aries provides a complete solution for most embedded applications in a single board, saving you space, time, and money.
-
HELIOS -
Diamond Systems Corp
Helios is a low power, mid-range performance PC/104 form factor single board computer combining a highly integrated CPU with Diamond Systems’ renowned high-accuracy data acquisition circuitry on a single board, reducing size and cost while increasing ruggedness. Helios utilizes a Vortex integrated single chip CPU operating at 800MHz or 1GHz, and 256MB of DRAM soldered on-board.
-
HELIX -
Diamond Systems Corp
The HELIX family of PC/104 SBCs combines mid-range CPU performance, standard PC I/O, and on-board data acquisition circuitry in a compact size and at a competitive price. Available PC I/O includes 3 or 6 USB 2.0 (model dependent), 4 serial ports (2 RS-232/422/485 and 2 RS-232), 1 10/100Mbps Ethernet, 1 Gigabit Ethernet, and a SATA port. The optional data acquisition circuit includes 16 16-bit analog inputs, 4 16-bit analog outputs and 27 digital I/O lines configurable as counter/timers and pulse width modulators.
-
GEMINI -
Diamond Systems Corp
GEMINI is a COM Express Compact type 6 carrier board and SBC with PCI/104-Express I/O expansion. Feature-rich GEMINI offers the highest performance in a compact 4.0 x 4.0' / 102 x 102mm size, with its combination of COM Express CPU module and full support for PCIe/104 type 1 connectivity (PCI-104 up to 4 modules, PCIe-104 x1 up to 4 modules, and PCIe/104 x16). Gemini is designed to support a variety of COM Express modules including Bay Trail, Apollo Lake to Core i7 8th generation and Xeon.
-
SCX-PCIE -
ELMA Electronic, Inc.
The SCX-PCIE is a mezzanine side card for EKF CPU boards, equipped with a PCIe® Gen3 packet switch, onboard NVMe and SATA mass storage, and high-speed front I/O.
-
VENUS -
Diamond Systems Corp
Based on the “Kaby Lake” 7th generation Core i7 processor, Venus offers high CPU performance in a small form factor rugged SBC with modest power consumption. It incorporates a full suite of rugged features such as soldered memory, latching connectors, a thicker PCB, and true -40/+85ºC operating temperature, making it suitable for the most demanding vehicle applications. High I/O density, multiple expansion sockets, rugged design, modest power consumption of 14W, and wide temperature operation combine to make Venus an extremely attractive option for applications requiring high CPU performance or ruggedness.
-
ZETA -
Diamond Systems Corp
The Zeta COM Express SBC family of ultra-small embedded computer boards combines a COM Express Mini CPU module with a same-size carrier board to create a complete embedded PC. Designed in the COM Express Mini Type 10 form factor (84 x 55mm/ 3.3 x 2.2 in), Zeta provides an ultra-compact, industry-standard form factor solution.
-
EBP-D3E1 -
ADLINK Technology Inc.
*Segment: 1*Slots: 1 PICMG® CPU, 1 PCI-E® x4*Support ATX power supplies*Dimension: 331 mm x 39 mm
-
MIC-6315 -
Advantech Co. Ltd.
The MIC-6315 is the 6U OpenVPX processor blade echoing to the customer’s requirements. Based on the Intel® Xeon® D-1500 processor family, the MIC-6315 supports to 12 cores/24 threads, to fulfill the computing requirements form the customer. The MIC-6315 provides various high speed interfaces to communicate with the system: dual Serial Rapid I/O on the Data Plane, a configurable PCIe gen. 3 x 16 port on the Expansion Plane, with another x8 and x4 PCie ports on the user-define plane, and there are two 40GBase-KR4 ports available on the user-define plane. These interfaces enable the possibility of high speed data communication to optimize the performance of the product. Serial Rapid I/O and PCI express have low latency, scalable, error recoverable deterministic interconnectivity to the mainstream peripherals and I/O cards to create a system with vast functions. To maintain the maximum memory throughput in the different harsh environments, the Advantech R&D teams dedicate themselves to optimize the layout of the product. The MIC-6315 is capable to support ECC in a dual channel design running up to 2133MT/s with 64GB capacity*, and has the default capacity of the onboard DDR4 with 32GB or 16GB. The MIC-6315 offers three types of the storage options: A 64GB onboard NAND flash as the native storage, and three M.2 sites with 1x SATA M.2, 2x NVME M.2 interfaces are supported at the same time. The MIC-6315 has a reinforced convection-cooled heatsink as the thermal solution. Two native ruggedized connectors are available on the front panel, and several common I/O port connectors can be used for debugging purpose at the same time. Compliant with the IPMI 2.0, the MIC-6315 uses Adavantech-code-based board management solution, and supports iKVM, remote control and upgrade. This Advantech BMC code uses the LTS kernel for stability and security, and enables the possibility of customization. The user can setup the PCIe switch configuration in the BIOS menu without any firmware or hardware modification.
-
MIC-6311 -
Advantech Co. Ltd.
Advantech’s MIC-6311 is a single processor VPX blade based on the 4th generation Intel® Core™ i3/i5/i7 platform. It enables the highest performance available in 6U VPX form factor with two SRIOx4 ports in the VPX data plane and two PCI Express x8 gen. 3 lanes in the VPX expansion plane for workstation and compute intense applications. The two Serial RapidIO ports offer the possibility to interface the MIC-6311 to digital front ends such as DSP and FPGA cards via a high speed, low latency deterministic interconnect. In addition, PCI Express ports with up to 8GB/s throughput offer a high performance interface to mainstream peripherals and IO cards. With a SO-DIMM socket and additional soldered, onboard DRAM with ECC in a dual channel design running up to 1600MT/s, the MIC-6311 offers the ability to fit harsh environments while maintaining maximum memory throughput and supporting memory expansion using the latest SO DIMM technology. Moreover, the 4th generation Intel® Core™ processors offer increased cache size and efficiency as well as instruction set improvements which make the MIC-6311 a high performance compute engine with outstanding floating point and vector processing performance. Tailored for rugged environments, MIC-6311 has been designed to support ruggedized convection cooled heat sinks. Additionally, it implements an onboard soldered, industrial SSD for maximum reliability. By using the latest powerful PCH (Lynx Point) from Intel®, with its advanced SATA controller advanced storage options are supported such as a 2.5" SATA III HDD/SSD socket offering high storage capacity with up to 6Gbps transfer speed. A CFast socket provides an alternative for implementing a cost efficient, pluggable SSD. An onboard XMC/PMC site with PCIe x8 gen.3 connectivity can host high speed offload or I/O mezzanines. Two USB 3.0 ports in front panel can connect to the external devices with up to 5Gbps data rate. Network and remote connectivity can be achieved via a RS232 console (RJ45) and two GbE RJ45 ports, powered by Intel®’s latest Gigabit Ethernet Controiller, the i350. The processor’s integrated enhanced graphics engine Iris offers up to 2x the graphic performance compared to previous generation solutions. Triple independent display support can be implemented by using the MIC-6311’s VGA front panel port and two Display port / HDMI interfaces on rear transition modules. Audio port support via the backplane interface enhances media support. Three SATA ports (SATAIII) and four USB ports (2x USB 3.0, 2x USB 3.0) are also connected to backplane to fulfill the demand for extra IO ports or storage. Two GbE/ SERDES ports support system level IP connectivity and two UART interfaces can be leveraged to interface to legacy devices and consoles.
-
HPCI-14S12U -
ADLINK Technology Inc.
*Supports AT, ATX power supplies*Segment: 1*Slots: 2 PICMG® CPU, 12 PCI™, 1 ISA*Dimensions: 314.7 mm x 259 mm
-
HPCI-D6S4 -
ADLINK Technology Inc.
*Supports AT and ATX power supplies*Slots: 1 PICMG® CPU, 4 PCI™, 1 ISA*Segment: 1*Dimensions: 261 mm x 79.6 mm
-
HPCI-8S4 -
ADLINK Technology Inc.
*Supports AT, ATX power supplies*Slots: 2 PICMG® CPU, 4 PCI™, 3 ISA*Segment: 1*Dimensions: 264.2 mm x 218 mm
-
HPCI-15S10 -
ADLINK Technology Inc.
*Segment: 1*Slots: 2 PICMG® CPU, 10 PCI™, 4 ISA*Supports AT, ATX power supplies*Dimensions: 317 mm x 264.2 mm
-
HPCI-13S4LU -
ADLINK Technology Inc.
*Segment: 1*Slots: 3 PICMG® CPU, 4 PCI™, 7 ISA*Supports AT, ATX power supplies*Dimensions: 314.7 mm x 259 mm