Showing results: 256 - 270 of 339 items found.
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Winslow Adaptics, Ltd.
Prototyping adapters breakout from any package type to 2.54mm pitch pins or a larger pitch SMT footprint to solder to your development board. Our extensive design library means that many are available for fast delivery or next day from RS Components.
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AMETEK VTI Instruments
The EMX-4xxx product family contains high-performance breakout boxes (EMX-4008 and EMX-4016), smart high density dynamic signal analyzers (EMX-4250 and EMX-4251), smart PXIe 625 KSA/s 4-channel digizers (EMX-4350), and charge and IEPE PXIe 625 KSA/s 4-channel digitizers (EMX-4380).
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EMX-4xxx -
AMETEK VTI Instruments
The EMX-4xxx product family contains high-performance breakout boxes (EMX-4008 and EMX-4016), smart high density dynamic signal analyzers (EMX-4250 and EMX-4251), smart PXIe 625 KSA/s 4-channel digizers (EMX-4350), and charge and IEPE PXIe 625 KSA/s 4-channel digitizers (EMX-4380).
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CSM Products, Inc.
The HV BM Split Modules use the proven technology of the HV Breakout Modules for fast and precise measurement of internal conductor current, voltage and power even in confined spaces. HV BM Split Modules can be used to perform measurements in HV power cables or also on busbars.
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40-592A-112 -
Pickering Interfaces Ltd.
The 40-592A FIBO (Fault Insertion Break-Out) Matrix Module is a large-scale high density switching matrix based on the Pickering BRIC format. The fault insertion BRICs are designed for applications requiring the simulation of a variety of faults in complex, high pin count, applications involving sensors and control units.
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40-592A-103 -
Pickering Interfaces Ltd.
The 40-592A FIBO (Fault Insertion Break-Out) Matrix Module is a large-scale high density switching matrix based on the Pickering BRIC format. The fault insertion BRICs are designed for applications requiring the simulation of a variety of faults in complex, high pin count, applications involving sensors and control units.
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40-592A-102 -
Pickering Interfaces Ltd.
The 40-592A FIBO (Fault Insertion Break-Out) Matrix Module is a large-scale high density switching matrix based on the Pickering BRIC format. The fault insertion BRICs are designed for applications requiring the simulation of a variety of faults in complex, high pin count, applications involving sensors and control units.
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40-592A-111 -
Pickering Interfaces Ltd.
The 40-592A FIBO (Fault Insertion Break-Out) Matrix Module is a large-scale high density switching matrix based on the Pickering BRIC format. The fault insertion BRICs are designed for applications requiring the simulation of a variety of faults in complex, high pin count, applications involving sensors and control units.
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40-592A-117 -
Pickering Interfaces Ltd.
The 40-592A FIBO (Fault Insertion Break-Out) Matrix Module is a large-scale high density switching matrix based on the Pickering BRIC format. The fault insertion BRICs are designed for applications requiring the simulation of a variety of faults in complex, high pin count, applications involving sensors and control units.
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40-592A-101 -
Pickering Interfaces Ltd.
The 40-592A FIBO (Fault Insertion Break-Out) Matrix Module is a large-scale high density switching matrix based on the Pickering BRIC format. The fault insertion BRICs are designed for applications requiring the simulation of a variety of faults in complex, high pin count, applications involving sensors and control units.
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40-592A-116 -
Pickering Interfaces Ltd.
The 40-592A FIBO (Fault Insertion Break-Out) Matrix Module is a large-scale high density switching matrix based on the Pickering BRIC format. The fault insertion BRICs are designed for applications requiring the simulation of a variety of faults in complex, high pin count, applications involving sensors and control units.
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40-592A-108 -
Pickering Interfaces Ltd.
The 40-592A FIBO (Fault Insertion Break-Out) Matrix Module is a large-scale high density switching matrix based on the Pickering BRIC format. The fault insertion BRICs are designed for applications requiring the simulation of a variety of faults in complex, high pin count, applications involving sensors and control units.
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Lepton -
Pure Engineering, llc
The FLIR Lepton™ is the most compact longwave infrared (LWIR) sensor available as an OEM product. It packs a resolution of 80 × 60 or 160x120 pixels into a camera body that is smaller than a dime. This revolutionary camera core is poised to equip a new generation of mobile and handheld devices, as well as small fixed-mount camera systems, with thermal imaging capabilities never seen before. Lepton contains a breakthrough lens fabricated in wafer form, along with a microbolometer focal plane array (FPA) and advanced thermal image processing. In order to support the lepton and make it easy to use, we have developed a breakout board to support the module along with example source code. Please see the Lepton Thermal Camera Breakout Datasheet for more information.
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EdgeSwitch -
APCON, Inc.
The IntellaView EdgeSwitch is a high-density 1RU system with 32 ports of 40G / 100G Ethernet capability, while the breakout mode can support up to 128 ports of 10G / 25G. The EdgeSwitch enables efficient traffic aggregation, filtering, load balancing, tunnel management, and port tagging standalone or as part of a larger visibility solution.
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SparkFun Electronics
The SparkFun 9DoF Sensor Stick is an easy-to-use 9 Degrees of Freedom IMU. The Sensor Stick deftly utilizes the LSM9DS1 motion-sensing system-in-a-chip, the same IC used in the SparkFun 9DoF IMU Breakout. It houses a 3-axis accelerometer, 3-axis gyroscope, and 3-axis magnetometer – nine degrees of freedom (9DoF) in a single IC!