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  • OpenVPX CPU Blade with Intel® Xeon® D-1500 family Processor

    MIC-6315 - Advantech Co. Ltd.

    The MIC-6315 is the 6U OpenVPX processor blade echoing to the customer’s requirements. Based on the Intel® Xeon® D-1500 processor family, the MIC-6315 supports to 12 cores/24 threads, to fulfill the computing requirements form the customer. The MIC-6315 provides various high speed interfaces to communicate with the system: dual Serial Rapid I/O on the Data Plane, a configurable PCIe gen. 3 x 16 port on the Expansion Plane, with another x8 and x4 PCie ports on the user-define plane, and there are two 40GBase-KR4 ports available on the user-define plane. These interfaces enable the possibility of high speed data communication to optimize the performance of the product. Serial Rapid I/O and PCI express have low latency, scalable, error recoverable deterministic interconnectivity to the mainstream peripherals and I/O cards to create a system with vast functions. To maintain the maximum memory throughput in the different harsh environments, the Advantech R&D teams dedicate themselves to optimize the layout of the product. The MIC-6315 is capable to support ECC in a dual channel design running up to 2133MT/s with 64GB capacity*, and has the default capacity of the onboard DDR4 with 32GB or 16GB. The MIC-6315 offers three types of the storage options: A 64GB onboard NAND flash as the native storage, and three M.2 sites with 1x SATA M.2, 2x NVME M.2 interfaces are supported at the same time. The MIC-6315 has a reinforced convection-cooled heatsink as the thermal solution. Two native ruggedized connectors are available on the front panel, and several common I/O port connectors can be used for debugging purpose at the same time. Compliant with the IPMI 2.0, the MIC-6315 uses Adavantech-code-based board management solution, and supports iKVM, remote control and upgrade. This Advantech BMC code uses the LTS kernel for stability and security, and enables the possibility of customization. The user can setup the PCIe switch configuration in the BIOS menu without any firmware or hardware modification.

  • OpenVPX CPU Blade with 4th Generation Intel® Core™ Processor

    MIC-6311 - Advantech Co. Ltd.

    Advantech’s MIC-6311 is a single processor VPX blade based on the 4th generation Intel® Core™ i3/i5/i7 platform. It enables the highest performance available in 6U VPX form factor with two SRIOx4 ports in the VPX data plane and two PCI Express x8 gen. 3 lanes in the VPX expansion plane for workstation and compute intense applications. The two Serial RapidIO ports offer the possibility to interface the MIC-6311 to digital front ends such as DSP and FPGA cards via a high speed, low latency deterministic interconnect. In addition, PCI Express ports with up to 8GB/s throughput offer a high performance interface to mainstream peripherals and IO cards. With a SO-DIMM socket and additional soldered, onboard DRAM with ECC in a dual channel design running up to 1600MT/s, the MIC-6311 offers the ability to fit harsh environments while maintaining maximum memory throughput and supporting memory expansion using the latest SO DIMM technology. Moreover, the 4th generation Intel® Core™ processors offer increased cache size and efficiency as well as instruction set improvements which make the MIC-6311 a high performance compute engine with outstanding floating point and vector processing performance. Tailored for rugged environments, MIC-6311 has been designed to support ruggedized convection cooled heat sinks. Additionally, it implements an onboard soldered, industrial SSD for maximum reliability. By using the latest powerful PCH (Lynx Point) from Intel®, with its advanced SATA controller advanced storage options are supported such as a 2.5" SATA III HDD/SSD socket offering high storage capacity with up to 6Gbps transfer speed. A CFast socket provides an alternative for implementing a cost efficient, pluggable SSD. An onboard XMC/PMC site with PCIe x8 gen.3 connectivity can host high speed offload or I/O mezzanines. Two USB 3.0 ports in front panel can connect to the external devices with up to 5Gbps data rate. Network and remote connectivity can be achieved via a RS232 console (RJ45) and two GbE RJ45 ports, powered by Intel®’s latest Gigabit Ethernet Controiller, the i350. The processor’s integrated enhanced graphics engine Iris offers up to 2x the graphic performance compared to previous generation solutions. Triple independent display support can be implemented by using the MIC-6311’s VGA front panel port and two Display port / HDMI interfaces on rear transition modules. Audio port support via the backplane interface enhances media support. Three SATA ports (SATAIII) and four USB ports (2x USB 3.0, 2x USB 3.0) are also connected to backplane to fulfill the demand for extra IO ports or storage. Two GbE/ SERDES ports support system level IP connectivity and two UART interfaces can be leveraged to interface to legacy devices and consoles.

  • SOSA-aligned, Rugged 3U VPX Processor Blade with Intel® Xeon® W-11000E

    VPX3-TL - ADLINK Technology Inc.

    ADLINK VPX3-TL 3U VPX processor blade is powered by Intel® Xeon® W-11000E Series Processor, formerly Tiger Lake-H and delivers a greater than generational improvement in performance for enhanced data and graphics and the AI acceleration capabilities required for next-generation mission-critical applications. The SOSA-aligned design of the VPX3-TL module offers embedded computing capabilities that are easily reconfigurable and upgradable, highly cost-effective, and quick to develop and deploy.

  • Rugged 3U VPX Intel® Xeon® Processor D-1500 Processor Blade

    VPX3010 - ADLINK Technology Inc.

    The VPX3010 Series is a 3U VPX processor blade featuring the Intel® Xeon® Processor D-1500 SoC with up to 12 cores. The VPX3010 provides up to 16GB DDR4-2133 dual channel ECC memory soldered onboard, one PCI Express x8 Gen3 XMC expansion slot with VITA 46.9 rear IO, and onboard soldered 32GB SLC SATA solid state drive. Rear I/O via P1 and P2 includes 2x 10GBASE-KX4, 2x 1000BASE-T (or one 1000BASE-T and two 1000BASE-BX by BOM option), 2x SATA 6 Gb/s, 1x USB 2.0, 2x USB 3.0, 6x GPIO, VGA, 1x RS-232, 1x RS-232/422, and up to PCIe x16 Gen3 supporting non-transparent bridge for peer-to-peer communication (dependent on BOM option).

  • OpenVPX CPU Blade with 4th/ 5th Generation Intel® Core™ Processor

    MIC-6314 - Advantech Co. Ltd.

    The MIC-6314 is Advantech’s next generation single processor 6U VPX blade, based on the 4th/ 5th Generation Intel® Core™ embedded platform with increased cache size and efficiency, as well as instruction set improvements. The MIC-6314 provides two configurable PCIE x 8 ports in the VPX data plane and two PCI Express ports x8 lanes in the VPX expansion plane to enable the highest performance available in the 6U VPX form factor compute intense applications. These PCIE interfaces offer high speed up to PCIE gen. 2 (5Gb/s) throughput, low latency, scalable, error recoverable deterministic interconnectivity to the mainstream peripherals and I/O cards such as DSP and FPGA cards. The PCIE widths and ports on the data plane and the extension plane of MIC-6314 is user configurable, which make MIC-6314 capable to replace the PCIE switch blade in a small system. With a SO-DIMM socket and additional soldered, onboard DRAM with ECC in a dual channel design running up to 1600MT/s, the MIC-6314 can be integrated into various harsh environments while maintaining maximum memory throughput, and supports memory expansion by using the latest SO-DIMM technology simultaneously. Tailored for harsh environments, the MIC-6314 has a native ruggedized convection cooled heat sink adaptable to various chassis environments; with the alternated optional air cooled heat sink, additional I/O is provided on the front panel. An onboard soldered, industrial SSD is included for maximum reliability, and a SSD socket is also available for a cost-efficient, modular storage. By using Intel®’s powerful PCH (Lynx Point) with its advanced SATA controller, the MIC-6314 offers high storage capacity at up to 6Gbps transfer speed. An onboard XMC site with PCIe x8 gen.3 connectivity can host high speed offload or I/O mezzanines. Two USB 3.0 ports on the front panel can connect to external devices with up to 5Gbps data rate. Network and remote connectivity can be achieved via a RS-232 console (RJ-45) and two GbE RJ-45 ports, powered by Intel®’s latest Gigabit Ethernet controller. The Intel® next generation graphics engine Iris Pro offers up to 2x the graphic performance compared to previous generation solutions. Triple independent display support can be implemented by using VGA and 2 DVI ports on MIC6314. Audio is powered by a ALC892 controller via the backplane interface, and provides media support. A PCIEinterface is reserved for the optional M.2 high speed storage.Besides the modern M.2 storage, three SATA III one SATA II and four USB ports (2x USB 3.0, 2x USB 3.0) are also connected to the backplane to fulfill the demand for extra IO ports or storage. Four GbE ports (two SERDES selectable) support system level IP connectivity, and four UART interfaces (RS232/422/485selectable) can be leveraged to interface to legacy devices and consoles.

  • OpenVPX CPU Blade with 4th/ 5th Generation Intel® Core™ Processor

    MIC-6313 - Advantech Co. Ltd.

    The MIC-6313 is Advantech’s next generation single processor 6U VPX blade, based on the 4th/ 5th Generation Intel® Core™ and Intel® Xeon® Processor E3 Lv4 embedded platform. To enable the highest performance available in the 6U VPX form factor for workstation and compute intense applications, the four Serial RapidIO ports in the VPX data plane offer high speed up to 5Gb/s, low latency, scalable, error recoverable deterministic interconnectivity to digital front ends such as DSP and FPGA cards. In addition, two PCI Express ports x8 lanes in the VPX expansion plane, with up to PCI Express gen. 2 (5Gb/s) throughput offer a high performance interface to mainstream peripherals and I/O cards. With a SO-DIMM socket and additional soldered, onboard DRAM with ECC in a dual channel design running up to 1600MT/s, the MIC-6313 can be integrated into various harsh environments while maintaining maximum memory throughput, and supports memory expansion by using the latest SO-DIMM technology simultaneously. In addition, the 4th/ 5th generation Intel® Core™ and Xeon® E3 Lv4 embedded processors offer increased cache size and efficiency, as well as instruction set improvements, which make the MIC-6313 a high performance compute engine with outstanding floating point and vector processing performance. Tailored for harsh environments, the MIC-6313 has a native ruggedized convection cooled heat sink adaptable to various chassis environments; with the alternative optional air cooled heat sink, additional I/O is provided on the front panel. An onboard soldered, industrial SSD is included for maximum reliability, and a CFast/ SSD socket is also available for a costefficient, modular storage. By using Intel®’s powerful PCH (Lynx Point) with its advanced SATA controller, the MIC-6313 offers high storage capacity at up to 6Gbps transfer speed. An onboard XMC site with PCIe x8 gen.3 connectivity can host high speed offload or I/O mezzanines. Two USB 3.0 ports on the front panel can connect to external devices with up to 5Gbps data rate. Network and remote connectivity can be achieved via a RS-232 console (RJ-45) and two GbE RJ-45 ports, powered by Intel®’s latest Gigabit Ethernet controller. The next generation graphics engine Intel® Iris Pro offers up to 2x the graphic performance compared to previous generation solutions. Triple independent display support can be implemented by using the MIC-6313’s DVI front panel port and two DVI interfaces on rear transition modules. Audio is powered by a ALC892 controller via the backplane interface, and provides media support. Four SATA ports (SATAIII) and four USB ports (2x USB 3.0, 2x USB 3.0) are also connected to the backplane to fulfill the demand for extra IO ports or storage. Four GbE ports (two SERDES selectable) support system level IP connectivity, and four UART interfaces (RS232/422/485 selectable) can be leveraged to interface to legacy devices and consoles.

  • 3U CompactPCI Intel® 6th Gen. Quad- Core™ Processor Blade

    MIC-3332 - Advantech Co. Ltd.

    MIC-3332 is using Intel® 14nm technology to provide significant performance and power efficiency. It provides an ideal solution for railway rolling stock, high-performance computing and military application. With its optimized design on EMC & thermal, it is available to meet or exceed EN50155.

  • 3U CompactPCI Serial Processor Blade with 6 COres/12 Thread Core i7 and Xeon Processor

    MIC-330 Series - Advantech Co. Ltd.

    MIC-330 is a 3U CompactPCI® serial processor blade with 6 cores/12 thread Core™ i7 and Xeon® processor and configured with Intel® CM246 PCH to support dual-channel 32GB DDR4-2666, up to 16GB on board memory for rugged applications, and another 16GB are available via the SO-DIMM socket for expansion.

  • 3U CompactPCI 4th/5th Generation Intel® Core™ i7 Processor Blade with ECC

    cPCI-3510(BL) Series - ADLINK Technology Inc.

    The ADLINK cPCI-3510(BL) Series is a 3U CompactPCI processor blade with soldered DDR3L memory up to 16GB. The ADLINK cPCI-3510 features a 4th generation Intel® Core™ i7 processor with Mobile Intel® QM87 Express Chipset. In addition, the cPCI-3510BL SKUs support the 5th generation Intel® Core™ i7 processor (cPCI-3510BL/3510BLD/3510BLG).

  • 3U OpenVPX CPU Blade with Intel® Xeon® Processor E3v5 and E3v6 family

    MIC-6330 - Advantech Co. Ltd.

    Based on the Intel® Xeon® E3 Lv5 and Lv6 embedded platform, the MIC-6330 builds on the success of Advantech’s 6U VPX boards, and is the first 3U VPX product launched by Advantech. Together with the Intel® processor, the MIC-6330 offers intense computational ability in a very compact form factor. The MIC-6330 provides configurable connectivity (up to four ports) of PCI Express via the backplane to the highest performance mainstream peripherals and I/O cards, and vast I/O functions for extended interconnectivity and controllability. The MIC-6330 meets various computing needs, including vPro™ and workstation capabilities, by using the Intel® CM236/CM238 PCH. The MIC-6330 offers high storage capacity at up to SATA 6Gbps transfer speed. Four USB2.0 ports and one USB 3.0 port to the backplane fulfill requirements for extra I/O ports or storage, up to 5Gbps data rate. Four GbE ports (two ports configurable as SERDES) support system level IP connectivity, and the UART interfaces (RS-232/422/485 selectable) can be leveraged as an interface to legacy devices and consoles. Like Advantech’s 6U VPX products, the MIC-6330 supports multiple displays, and the maximum resolution of the MIC-6330 is 4K, empowered by the Intel® integrated graphics engine. The MIC-6330 also offers a High Definition Audio to the backplane interface for media demands. With the standard ruggedized convection cooled heatsink or the optional air-cooled heatsink, the MIC-6330 is tailored for harsh environmental applications and adaptable to various chassis designs. The industrial NAND Flash, and the soldered onboard DDR4 ECC memory chips are appropriate for a variety of vehicle applications for the maximum reliability. The MIC-6330 is sophisticated and suitable for various purposes. An onboard X8D XMC site with PCIE x8 gen.3 connectivity can host high speed offload or I/O mezzanines for project-specific applications. For applications that need the maximum expandability, the XMC interface can be modified to add another DisplayPort and the 2 more UART. The optional front I/O module facilitates the development and qualification process, and also enables the possibility of the front panel access.

  • 3U CompactPCI Serial 9th Gen Intel Xeon®/Core™ i7 Processor Blade

    cPCI-A3525 Series - ADLINK Technology Inc.

    CompactPCI® Serial (PICMG CPCI-S.0) is a new modular computer standard officially adopted by PICMG in 2011. The CompactPCI Serial standard defines a completely new connector to support high-speed serial interfaces including PCI Express, SATA, USB and Ethernet. A CompactPCI Serial backplane has six high-speed connectors P1 to P6 on the system slot but only P1 is mandatory on peripheral slots, P2 to P6 being optional. A CompactPCI Serial system can comprise a total of nine blades (one system blade and eight peripheral I/O blades) through an Ethernet full mesh or single star architecture. The CompactPCI® Serial standard is the next-generation of the CompactPCI® specification and provides more flexibility and higher speed and bandwidth in modular system solutions.

  • 6U CompactPCI 5th/4th Generation Intel® Core™ Processor Blade with two PMC/XMC sites

    cPCI-6530(BL) Series - ADLINK Technology Inc.

    The cPCI-6530(BL) Series is a 6U CompactPCI processor blade in single-slot (4HP) width form factor featuring enhanced graphics, computing power, energy efficiency, system manageability and data security provided by the 5th/4th generation Intel Core i7/i5 processor (4C/2C), and soldered and socket type DDR3L-1067/1600 ECC memory up to 32GB. The cPCI-6530(BL) offers outstanding performance and is an ideal solution for defense, aviation, transportation and industrial applications.

  • Rugged Conduction Cooled 3U CompactPCI Processor Blade with Quad-Core Intel® Atom™ Processor

    CT-3620 - ADLINK Technology Inc.

    The ADLINK CT-3620 Series is a Rugged Conduction-Cooled 3U CompactPCI processor blade in single-slot (4HP) width form factor featuring a quad-core Intel® Atom™ SoC and soldered DDR3L-1333 ECC memory up to 4GB. Graphics is integrated graphics on the CPU and storage is provided by an onboard 32GB SSD. Rear IO signals include 2x GbE, 1x USB 2.0, VGA, 2x COM, and 1x SATA 3Gb/s, providing for expansion with an optional Rear Transition Module (RTM).

  • Intel® Xeon® E3 Quad-Core 10 Gigabit Ethernet AdvancedTCA® Processor Blade

    aTCA-9300 - ADLINK Technology Inc.

    The ADLINK aTCA-9300 is a high performance AdvancedTCAR (ATCA) processor blade featuring dual 4-core IntelR XeonR processor E3 1275V2 /1225V2, IntelR C216 Chipset, four channel memory up to 32 GB of DDR3 memory and 300 W power supply subsystem. Versatile connectivity includes dual 10GbE Fabric Interfaces, dual GbE Base Interfaces, quad front panel GbE egress ports, front panel dual COM and USB 2.0 ports and front panel VGA connector. An onboard SATA connector supports CFast up to 32 GB and the optional RTM (aTCA-R6270/R6280) supports an 8-channel mini-SAS port, dual 10GbE SFP+ ports, dual USB ports and dual hot-swappable SATA bays providing additional network throughput and storage capacities.

  • 6U CompactPCI Intel® 4th/5th Gen. Core™ i5/i7 Processor Blade with ECC Support

    MIC-3396MIL - Advantech Co. Ltd.

    The MIC-3396MIL is specially design for ruggedized applications, and offers three different configurations that meet a wide range of environment requirements. Using 4th and 5th generation Intel® Core™ i5/i7 and Intel® Xeon® processors, it supports up to four cores / eight threads at 2.7GHz and 6MB last level cache. Ruggedized requirements are addressed by a conduction cooled design an extended operation temperature range (-40 ~ 85° C measured at wedge lock). Shock and vibration resistances of the board are increased by using wedge locks and a single-piece CNC-milled aluminum alloy plate that conforms to the major IC packages. With highly integrated functional capabilities, the MIC-3396MIL fully utilizes the I/O features of the Intel® chipsets. It supports maximum 16GB of 1600 MHz DDR3L RAM, an onboard 2.5" Serial ATA HDD or SSD, a CFast slot, for an onboard NAND flash (as optional), one PCIex16 and a set of I/O functions brought through the backplane to a unique rear transition module, which contains eight GPIOs, two USB 2.0 and four RS-232/422/485 console ports as pin headers, two SATA Gen III and two SATA Gen II as connectors, two/four LAN ports (two LAN ports are switchable form front panel to RTM), two DVI ports, two USB 3.0, one PCIex16, one P/S2 port and one RS-232/422/485 port on the front panel.

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