Showing results: 181 - 195 of 276 items found.
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Curtiss-Wright Defense Solutions
Our selection of rugged, embedded computing modules has been trusted and proven in defense, commercial, and industrial applications worldwide. Choose from solutions with hardened security, high-performance processing for machine learning and artificial intelligence (AI), and SWaP-optimized, miniature form factors to meet your program requirements. Our innovative solutions are designed in alignment with MOSA standards, including OpenVPX, SOSA and CMOSS, and engineered to succeed.
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P-616 NanoCube -
Physik Instrumente GmbH & Co. KG
Compact Parallel-Kinematic Piezo System for Nanopositioning and Fiber Alignment. In a parallel-kinematic multi-axis system, all actuators act directly on a single motion platform. This means that all axes can be designed with identical dynamic properties, which reduces the moved mass considerably. Further advantages: It is possible to make the parallel-kinematic system more compact than serial stacked or nested systems. The errors and masses of each individual axis do not accumulate.
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NPN244/NPN244S -
Abaco Systems Inc
The NPN244 6U VPX is a high-performance computing & GPGPU OpenVPX card that hosts dual GPUs with alignment to the VITA-65 standard. Based on the NVIDIA® Turing™ architecture using either the NVIDIA® Quadro RTX™ 5000 platform or NVIDIA® Quadro RTX™ 3000 platform, the NPN244 offers exceptional graphics and GPGPU compute capability with CUDA® support, AI, and deep learning.
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NanJing DVP OE TECH CO., LTD
*High resolution LCD display*PAS technology*Core or cladding alignment*Double heaters*30 Sec. Tube-heat time*3 magnification modes, max. 360 magnification*Four display modes, fiber core visible*8 Sec. Splice time*Li-ion battery*Max. Wind velocity of 15m/s*Splicing method: Auto, manual*Store 8000 groups of splice results*USB interface
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Firefly-IR -
M Squared Lasers
Firefly IR is available in short-wave and long-wave models, providing broad wavelength coverage from 1.4-8.5 µm. The compact and sealed design requires no manual alignment, and can be used in a variety of applications in the lab and in the field. Wavelength selection and scanning is automated and performed via web browser or using a TCP/IP command set. Pulsed operation and high repetition rate provide high peak power and rapid data acquisition.
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Broadcom Limited
We offer the world's leading companies intelligent software solutions that help transform their businesses. Our enterprise software helps organizations adopt a BizOps approach that enables collaboration, alignment and decision making across business operations and technology functions. Our products, in the domains of ValueOps, DevOps and AIOps deliver cross-correlated insights needed and key capabilities that help our customers realize better business outcomes – and better experiences for their customers.
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MC388 -
Manncorp
The MC388 features four simultaneous heads with dual-vision alignment that can achieve placement rates of 10,500 CPH. When used as an inline machine, up to 192 Smart Feeder can be attached, providing a near-zero job changeover time. Plus, it has the huge placement area, high precision, and accuracy that users have come to expect from MC-series component placers. The MC388 is ideal for LED strips, drivers, or other large, high-component panels.
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ITF -
Raytheon Company
The ITF, located in El Segundo, California, has multiple test stations to enable parallel testing and significantly streamline program test schedules. More than 25,000 square feet are available for integration and test activities, including a 10,000-square-foot Class 10K clean room. Our facilities feature thermal vacuum chambers and test stations to support optical alignment, warm optical bench testing, and hardware integration.
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PM 200 -
Scitec Instruments Ltd
In the past laser energy meters often required a whole selection of pyroelectric detectors for measuring different energies. From this point of view the PM 200 is a very modest instrument. A single detector enables monitoring of energies from the detection limit at 3 ?J up to highest energies of 200 mJ. The active sensor area with an aperture diameter of 34 mm ensures simple and reliable alignment for the detection of large beam profiles.?
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ST4 -
Panasonic Industrial Devices Sales Company of America
Panasonic's concept of connecting 6 sets of Sensor heads to 1 Controller in series offers maximum flexibility to solve a wide range of safety applications. Just configure exactly the number of Sensor heads and controllers required to protect the area in question, e.g. small openings or irregularly shaped spaces impractical for Safety Light Curtains. A beam interruption indicator is incorporated in both the emitter and receiver to indicate operation and assist with beam alignment.
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BeamTrack -
mks Ophir
Thermal sensors that measure laser power and single shot energy like standard thermal sensors but in addition measure laser beam position and laser size. This position sensing detector measures laser beam position to 0.1mm accuracy and laser size measurement of a Gaussian beam to +/-5% accuracy. Measuring laser position is important for laser alignment where the laser position sensor can provide feedback to the laser position control.
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HPX1S -
Manncorp
Produce high-quality semiconductor chips in your manufacturing facility with our HPX1S Die Attach Machine. This die bonding machine is great for high-accuracy, low-volume, die attach manufacturing needs. Customization options are also available for unique applications. It is equipped with 3 sets of CCD cameras and a bottom camera to help with component alignment. Easily and accurately handle die sizes from 1.4 x 1.4 mm to 7 x 7 mm.
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P-Series -
OPTOKON a.s.
OPTOKON offers the industry's highest quality fusion splice sleeves and holders. Standard sleeves are constructed with a stainless steel strength member, polyolefin copolymer inner tube and a polyolefin outer tube. Cut lengths are precise and all ends are free from burrs and sharp edges. Standard Sleeves are heat bonded to ensure tubes maintain perfect alignment during shipping, handling and shrinking. Sleeves are available in custom lengths, colors and diameters.
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CSP/MicroBGA -
Aries
Test & Burn-In Socket. Socket is easily mounted and removed to & from the BIB due to solderless pressure mount compression spring probes which, are accurately located by two molded plastic alignment pins and mounted with four stainless steel screws. Standard molded socket format can accommodate any device package of 13mm or smaller, by using machined (for small quantities) or custom molded (for large quantities) pressure pads and interposers.
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Celadon
The Celadon Rail System allows multi-site testing capability with flexible die to die spacing using existing Celadon VersaTiles™ to minimize cost of test with new DUT structures. The modular design allows for additional site assemblies and rail assemblies to be added after the original system purchase. With the Celadon Light-Tight Enclosure and Rail System Tool, high accuracy alignment and testing can be performed at extreme temperatures without affecting the thermal equilibrium of the system.