Showing results: 16 - 23 of 23 items found.
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Creative Design Engineering, Inc.
*Type: Floor Standing*Wafer load: FOUP LoadPort*Wafer size: 300mm, 8" and 300mmopen cassette with adapter*Mini Environment: yes*Probe Changer: 1,2 or 4 probes*Aligner: yes*Range: 1m/ to 10M/*Accuracy:0.5%*Repeatability: 0.02% *Static Repeatability: 0.1% dynamic
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Creative Design Engineering, Inc.
*Type: EFEM*Wafer load: FOUP*Wafer size: 300mm*Mini Environment: yes*Probe Change: 1, 2 or 4 probes*Aligner: yes*Size: depends on configuration*Range: 1mΩ/☐ to 10MΩ/☐*Accuracy: 0.5%*Repeatability: 0.02% *Static Repeatability: 0.1% dynamic
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Creative Design Engineering, Inc.
*Type: Table Top*Wafer load: open cassette*Wafer size: 4" to 8"*Mini Environment: N/A *Probe Changer: N/A *Aligner: N/A*Size: 12" x 28" x 10"*Range: 1m/ to 10M/*Accuracy: 0.5%*Repeatability: 0.02% *Static Repeatability: 0.1% dynamic
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Model 656 -
OAI
OAI Model 656 Meter is designed for use with all mask aligners and flood exposure systems. For over 45 years, OAI is a world leader in UV Light & Energy Measurement Instrumentation used for reliable accurate calibrated control of the photolithography processes in the Semiconductor, MEMS, Wafer Packaging and Wafer Bumping Industries.
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Creative Design Engineering, Inc.
*Type: Table Top*Wafer load: Manual *Wafer size: 2" to 8", 152mm x 152mm*Mini Environment: N/A*Probe Changer: N/A*Aligner: N/A*Size: 12" x 19" x 10"*Range: 1m/ to 10M/*Accuracy: 0.5%*Repeatability: 0.02% *Static Repeatability: 0.1% dynamic
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Recif Technologies Inc.
RECIF Technologies 150-200mm product range is composed of various kind of table tops equipment including wafer transfer, aligners and elevators.As a result of a technology license agreement, with its European partner EMU Technologies, RECIF proposes updated designs for its equipment line, without compromising the proven performances installed on the field for years.
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EV Group
With the invention of the world’s first double sided alignment system in 1985, EV Group has revolutionized MEMS technology and set worldwide industry standards in aligned wafer bonding by separating the alignment and bonding process. This process separation results in higher flexibility and universal application of the wafer bonding equipment. The EVG bond alignment systems offer highest precision, flexibility, ease of use and modular upgrade capability and have been qualified in numerous high throughput production environments. The precision of EVG bond aligners accommodates most demanding alignment processes in MEMS production and in emerging fields like 3D integration applications.
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MiniMax™ -
Genmark Automation
Genmark’s MiniMax™ Equipment Front End Module (EFEM) is a class 1 minienvironment system designed to maximize productivity of semiconductor processing equipment tools that require the highest level of automation.The MiniMax™ can be customized to meet the automation requirements of any semiconductor manufacturing tool application and specified with one of the Genmark’s sophisticated and precise wafer and reticle handling robots, including the full line of patented GPR single or dual arm robots, GREX robot series, single and dual wafer aligners, FOUP/FOSB openers, reticle libraries, as well as any other customer specified equipment.