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Bonding Ohmeters
bonding ohmmeter is an affordable, highly accurate, and intrinsically safe electrical bond tester. This meter is capable of performing bond measurements on a variety of components and metal-to-metal connections. The 620LK has been independently UL-913 certified, ensuring quality and safety at each step of manufacturing. Due to its safety certifications and high level of accuracy, the 620LK meter is the choice bond tester for many commercial airliners, while its sibling the 620UK-B is in countless USAF programs.
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Ground Bond Tester
264
Our 264 Model makes Ground Bond / High Continuity Testing simple with 40 Amps of current to satisfy your NRTL standard. With an intuitive interface that allows you to set-up a test in seconds and practical security settings, our 264 can easily be deployed in both laboratory and production line environments. Ensure every Ground Bond Test is accurate with our Milliohm offset function.
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Temporary Bonding andDebonding Systems
Increased demand for applications based on thin wafers and thin microelectronic-substrates result in the need for processing and handling of thin- and ultra-thin substrates during the manufacturing step. Thin substrates in the area of IC manufacturing (like memory, CMOS, 3D-TSV integration or ChipCard applications), power devices (e.g. IGBTs), compound semiconductors (e.g. for high brightness LEDs or RF-power amplifiers), as well as emerging technologies that also involve thin or flexible substrates (MEMS; RFID-tags, flexible displays, etc.) require reliable handling and support techniques in order to ensure safe processing.
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Fusion Bonded Cable Jumpers
Series 152FB
Fusion Bonded Cable Jumpers. Aries Series 152FB Fusion Bonded Cable Jumpers are flexible...plug them directly into PC boards or sockets. Stranded wire conductors are fusion bonded with an overcoat of tin for easy soldering or socketing. Each jumper is shipped with protective tabs on both ends for maintaining proper conductor spacing.
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Ground Bond Tester,
266
Our 266 Model makes Ground Bond / High Continuity Testing simple with 60 Amps of current to satisfy your toughest NRTL standard. With an intuitive interface that allows you to set-up a test in seconds and practical security settings, our 266 can easily be deployed in both laboratory and production line environments. Ensure every Ground Bond Test is accurate with our Milliohm offset function.
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Bond Tester for Wafers 2 - 12 inch
Sigma W12
Bondtester for wafers or at wafer level 2” – 12” (up to 300 mm)Precise testing and Cold Bump Pull (CBP) testingLarge X/Y stages X: 600mm, Y: 370 mmForce range from 1gf – 10 kgfBump pitch down to 20 µm
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Ground Bond Tester
HYAMP® Series
HYAMP III includes productivity-enhancing features and proven safety technology to reduce the compliance bottleneck on the production line. All models verify the integrity of your product's ground circuity with accurate 4-wire measurements and offset capability.
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Ground Bond Tester
260 Series
Our 260 Series makes Ground Bond testing simple. We offer two models so that you can have a simple and easy-to-use Ground Bond tester that provides the output current you need to satisfy NRTL specifications. With an intuitive interface that allows you to set-up a test in seconds and practical security settings, our 260 Series can easily be deployed in both laboratory and production line environments.
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Post Wire and Die Bond Inspection Machine
IV-E1700
IV-E1700 is a post wire and die bond inspection machine that is known for having a proven, effective and patented 2D+3D Inspection system. This product is best used to weed out defects with data collection for process improvement and reports for SPC quality Control.
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AC Ground Bond Testers
440 Series
The 440 Series provides advanced 4-in-1 test capability in a convenient one-box solution. This new series performs AC Hipot (448 - 500 VA), DC Hipot, Insulation Resistance and 40A AC Ground Bond tests while taking up minimal production line space. The 440 Series is simple and easy-to-use; reducing setup time and increasing production line throughput for your application. With multiple memories and an optional USB port for remote BUS communication so you can quickly perform tests on a variety of DUTs from the front panel or with a PC. Learn about our 5 Year Warranty.
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Bond Tester
Sigma
Sigma is the most advanced bond tester. It comes with game-changing automation capabilities and high specifications
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Multimode Bond Tester
BondMaster 600
The BondMaster® 600 delivers a powerful combination of multiple mode bond testing software and highly advanced digital electronics, providing consistently crisp and high-quality signals. Whether you are inspecting honeycomb composite, metal-to-metal bonds, or laminate composite, the BondMaster 600 offers exceptional ease-of-use thanks to its direct-access keys and streamlined interface that features convenient presets for common applications.
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Bond Tester
Sigma Lite
Sigma lite is a low cost of ownership bond tester that grows with your company. It gives you a low-cost entry point without sacrificing performance to meet future demands.
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High Force Large Area Bond Tester
Sigma HF
- For high force and large area- Typically for IGBT, power modules and batteries up to 1000 kgf- High axis speed- Deep access up to 80 mm- SEMI S2 safety cabinet with visual feedback- Flexible positioning of multiple work holders
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Integrated Bonding Systems
EVG offers fully integrated and highly automated production systems for wafer bonding processes. A maximum level of automation and process integration opens the door to large-scale manufacturing and guarantees a proven transition of processes from R&D stage to production.
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Protective Bonding Testers
RMO-E Series
The RMO-E instruments are designed and ideal for testing protective bonding (grounding) of equipment following the standard IEC 61010-1. Also, they can measure the resistance of high, middle and low voltage circuit breakers, high-current bus bar joints, cable splices, and welding joints. The instruments accurately measure not only in factory environments but also in high-induction fields and substations.Both models generate a true DC ripple-free (less than 1 %) current with automatically regulated test ramps. During a test, the protective bonding testers automatically generate increasing current before measuring and decreasing current after the measurement. Consequently, this significantly decreases magnetic transients and ensures great accuracy.These instruments can store up to 500 measurements in the internal memory and have a built-in thermal printer available as an option.DV Win software communicates with the RMO-E earth resistance meter via USB or RS232 interface. It allows a user to run the test remotely from PC, as well as to download test results, analyze and generate fully configurable test reports.The RMO-E series contains two models, RMO60E and RMO100E. The main difference between these two models is in the maximal test current:60 A DC for RMO60E100 A DC for RMO100E
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AC Ground Bond Tester
446
Our 446 model is a 4-in-1 tester with AC Hipot, DC Hipot, Insulation Resistance, and Ground Bond capabilities. This tester features a simple design and easy-to-use interface, reducing setup time and increasing production-line throughput for your application. The 446 is equipped with multiple memories and an optional USB port for remote BUS communication so you can quickly perform tests on a variety of DUTs from the front panel or with a PC. Add to user safety by equipping your tester with Personal Protective Equipment (PPE) via the built-in safety interlock.
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Earth Bond Test Set
EC-12
The Earth bond test is a basic safety test prescribed in many standards to test samples for the integrity of earthing continuity throughout the sample.
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Protector Conductor Test / Ground Continuity Test / Ground Bond Test
Testing the protective conductor is indispensable for assemblies, devices and systems of protection class I because it reduces the risk of life-threatening electrical accidents.The test checks whether the protective earth (PE) fulfils the criteria specified in the standards and can correctly discharge the current occurring in case of a fault.The ground continuity test checks whether the protective earth conductor is connected continuously to all metallic enclosure parts that can be touched by the user. The test can be carried out with low currents and voltages (simple continuity test).
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Post Wire and Die Bond Inspection Machine
IV-T3300
IV-T3300 is a post wire and die bond inspection machine with Dual JEDEC Tray Feeder System. It features a large inspection area of 600x500mm and a quick trays change of 5-7 seconds.
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Guardian Ground Bond Tester
19572
Chroma Systems Solutions, Inc.
Wide resistance measurement range : 0.1 ~ 510 mΩHigh performance AC current output : 45 ACompact size ground bond testerProvide reliable and stable test resultsBuilt-in resistance compensation functionStandard RS-232 interfaceOptional GPIB InterfaceCompatible with the model 19070 series Hipot Tester2-Year factory warranty
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AC Ground Bond Tester
448
Our 448 model is a 4-in-1 tester with 500VA AC Hipot, DC Hipot, Insulation Resistance and Ground Bond testing capabilities. The 448 is capable of a 500VA AC Hipot output to comply with 100mA leakage current test compliance requirements. This tester features a simple design and easy-to-use interface, reducing setup time and increasing production-line throughput for your application.
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SOI Bonding Systems
An accurate wafer bonding process is the key factor in obtaining high quality single crystalline silicon films on insulating substrates. The EVG850 SOI/Direct Wafer Bonding systems are designed to fulfill a wide range of fusion/molecular wafer bonding applications, with main focus on SOI substrates manufacturing. Ultra clean handling of wafers throughout the bonding process assures high-yield and void-free bonds. All essential steps, from cleaning and alignment to pre-bonding and IR-inspection are combined in one high volume production system. EVG850 is the only production bonding system built to operate in high throughput, high-yield environments and guarantees void-free SOI wafers up to 300 mm.The EVG300 series single wafer cleaning systems are designed for efficient removal of particles. In semiconductor processing, efficient cleaning and particles removal prior to critical process steps enables maximum yield. Wafer Bonding is a process which is strongly affected by particles: each particle on the wafer surface produces a void orders of magnitude larger than its diameter, contributing to a dramatic yield loss.
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High Voltage Pultruded Resin Bond Glass Fiber Rod
This Test Set-Up can be used to test any kind of Drive Insulator used in Circuit Breaker.
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Resistance Wire Bonding
Electronic Systems of Wisconsin, Inc.
ESW's Resistance Wire Bonding System comes equipped with the latest features the market has to offer. Our system is capable of bonding armatures, stators or coils. The on-screen display in our bonder makes it easy to read, track, and record your bonding data. If desired, ESW offers complete electrical testing of the part prior to the bonding sequence as well. This ensures only good parts that have been electrically tested are processed through bonding. It is our duty to make sure you never have to worry about losing important information again. Our Sales and Engineering staff will work closely with you to make sure that a bonding systems will meet your needs. See the slideshow below to see some of our Resistance Wire Bonding Testers.
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Bond Alignment Systems
With the invention of the world’s first double sided alignment system in 1985, EV Group has revolutionized MEMS technology and set worldwide industry standards in aligned wafer bonding by separating the alignment and bonding process. This process separation results in higher flexibility and universal application of the wafer bonding equipment. The EVG bond alignment systems offer highest precision, flexibility, ease of use and modular upgrade capability and have been qualified in numerous high throughput production environments. The precision of EVG bond aligners accommodates most demanding alignment processes in MEMS production and in emerging fields like 3D integration applications.
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xDSL with Channel Bonding Handheld Teste
The ARTISAN xDSL with Bonding handheld tester is a powerful and comprehensive ADSL and VDSL Test solution. The AutoTest feature makes testing standard and Channel Bonded lines simple and keeps training needs to a minimum. Features such as 7” colour touchscreen, Web Browser, Histograms for monitoring longer term intermittent faults and industry leading Broadcom chipset puts the Vonaq ARTISAN xDSL Tester ahead of the pack.
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Bond Testing
Our complete line of bond testing (BT) flaw detectors provides unmatched capabilities for the location of discontinuities and other flaws in composite structures. We offer a wide range of measurement features and application-specific options for flaw detection.
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Bonding Tester
PTR1102
In wire bonding in semiconductor manufacturing, electrodes are joined using gold wires of several tens of microns. In order to measure the pull (tensile) strength and ball shear (shear) strength of this gold wire, this machine has load detection accuracy and fine positioning accuracy. In addition, for the measurement of high load areas such as die shear strength and solder joint strength, this machine supports measurement in high load areas while maintaining accuracy in low load areas by replacing the sensor part.
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