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Product
COM Express® Basic Size Type 6 Module with Hexacore Mobile 9th Gen Intel® Xeon®, Core™, Pentium® and Celeron® Processors
Express-CFR
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The Express-CFR is COM Express® COM.0 R3.0 Basic Size Type 6 module supporting the Hexa-core (6 cores) 64-bit 9th Generation Intel® Core™ and Xeon® processor (codename “Coffeelake Refresh-H”) with Mobile Intel® QM370, HM370, CM246 Chipset.
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Product
Computer-On-Module
Open Standard Module (OSM)
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OSM form factor is the first computer-on-module form factor for solderable BGA mini modules that is natively capable of supporting both ARM and x86 designs. OSM modules are significantly smaller than previously available modules, with the largest measuring 45mm x 45mm. For a growing number of IoT applications this standard helps to combine the advantages of modular embedded computing with increasing requirements regarding cost, foot print and interfaces. The BGA design makes it possible to implement more interfaces on a small footprint. The largest Size-L (Large) measures 45mm x 45mm with 662 BGA pins. The modules are completely machine processible during soldering, assembly and testing.
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Product
Computer On Modules
ETX/XTX
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ETX / XTX CPU module eqiupped with Intel Atom has great I/O capacity and meets both ISA and PCI needs, while supporting the Computer On Module concept for plug-in CPU modules. Advantech is a founding member of the ETX Industrial Group (ETX-IG).
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Product
Enclosed Fanless Industrial Embedded Computer with NXP® i.MX8M Application Processor
SYS-444Q
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The SYS-444Q is a rugged enclosed fanless embedded computer system with NXP’s i.MX8M industrial application processor with quad-core Arm Cortex®-A53 for low-power processing. This rugged system has dual Ethernet, industrial I/O, expansion options, TPM 2.0 hardware security, and options for wireless connectivity. The processor supports industry-leading video processing along with an M4 microcontroller for real-time subsystems making it an ideal fit for industrial IoT applications requiring highly reliable performance in harsh conditions such as digital signage, industrial automation, energy management, building automation, and others.
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Product
COM Express® Type 2 Reference Carrier Board in ATX Form Factor
Express-BASE
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The COM Express approach of custom carrier combined with off the shelf system cores is an excellent solution when you need to customize but lack the time or quantity for a complete redesign. It fits most system integration projects with production volumes from 500 to 10,000 pcs per year. The COM Express concept has a great many advantages over full custom designs, it reduces engineering complexity, lowers the threshold for total project quantity and last but not least brings your product to the market in no time. The average time to design a carrier board is less than half the time of a full custom OEM board.
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Product
Data Acquisition Modules
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Advantech''s data acquisition modules and ethernet I/O modules provide ideal industrial control and measurement solutions for harsh environments and demanding applications. With wide operating temperature ranges and multiple mounting methods, Advantech''s ADAM series, such as RS-485-based and ethernet I/O, can be implemented in diverse applications. The Advantech ADAM-3000 series consists of cost-efficient, field configurable, isolated signal conditioning modules that can be easily installed to protect instruments and signals from the harmful effects of electrical interference.
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Product
3-CH RTD Input Module
ND-6013
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ADLINK's NuDAM data acquisition modules make up a total acquisition network and control system. Up to 256 NuDAM modules an be romotely controlled on any RS-485 network from a host computer, via a single serial RS-232, allowing communication from as far as 4000 feet from the host. Based on the RS-485 multi-drop network system, each module has a unique address ID, whereby simple ASCII command & response protocols through the standard RS-485 interface can control all the NuDAM modules in the RS-485 network. The NuDAM modules provide direct communications with a wide variety of sensors, perform all signal conditioning, scaling, linearization and conversion, and can acquire measurements of temperature, pressure, flow, voltage, current, and multiple digital signal types.
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Product
8DI/8DO Modbus RTU Remote I/O
ND-6150
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The NuDAM modules provide direct communications with a wide variety of sensors; perform signal conditioning, scaling, linearization and conversion; can acquire measurements of temperature, pressure, flow, voltage, current; and handle multiple digital signal types broadly used in IoT and other industrial applications, such as facility monitoring, environment monitoring, and industrial process control. The new ND-6117, ND-6124, ND-6150, and ND-6160 modules feature Modbus/RTU as the best remote data transmission protocol, which provides customers a comprehensive product offering.
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Product
8-CH Thermocouple Input Module
ND-6018
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- Channels: 6 Differential & 2 Single-ended- Input Type: Thermocouple, mV, V and mA- Thermocouple Type: J, K, T, E, R, S, B, N,C- Voltage Range: ± 15 mV, ± 50 mV, ± 100 mV, ± 500 mV, ± 1 V, ± 2.5 V- Current Range: ± 20 mA- Isolation Voltage: 2500 VRMS
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Product
48-Ch TTL DI/O IDAQ Module
iDAQ-751
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Hot-swappable in iDAQ systemDetachable Euro-type spring terminal connectors48-channel TTL digital I/OsConfigurable digital I/O directionIsolation protection of 60 VDCSupports buffered acquisition/update rates up to 200kHz
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Product
SMARC Short Size Module with Rockchip PX30 Quad-Core ARM Cortex A35
LEC-PX30
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LEC-PX30 based on power-efficient quad-core Arm® Cortex®-A35 SoC is a low-power, low-cost, entry-level, small-sized SMARC rev 2.0 module. For applications, such as IoT controllers, IoT gateways, wearable and mobile industrial devices, basic HMI, sensor concentrators, requiring good computing performance at low power consumption (1.5W- 5W) and Linux Yocto capability, LEC-PX30 is an ideal solution.
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Product
SMARC Short Size Module with Freescale i.MX6 Solo, DualLite, Dual or Quad Core Processor
LEC-iMX6
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The SMARC ("Smart Mobility ARChitecture") is a versatile small form factor computer Module definition targeting applications that require low power, low costs, and high performance. The Modules will typically use ARM SOCs similar or the same as those used in many familiar devices such as tablet computers and smart phones. Alternative low power SOCs and CPUs, such as tablet oriented X86 devices and other RISC CPUs may be used as well. The Module power envelope is typically under 6W.
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Product
COM Express Rev. 3.1 Basic Size Type 7 Module with AMD Embedded Ryzen™ V3000
Express-VR7
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ADLINK’s Express-VR7 COM Express Type 7 Basic size module is based on AMD Embedded Ryzen™ V3000 series processor. Offering up to 8 cores and 16 threads at 15W/45W TDP, the module exhibits the best performance per watt in its class, along with 14x PCIe Gen4 lanes with enterprise level reliability and extreme rugged temperature option (-40°C to 85°C).
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Product
SMARC Short Size Module with NXP i.MX 8M
LEC-iMX8M
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- Quad Arm® Cortex®-A53 and Cortex-M4- Cryptographic co-processor for end-to-end IOT security- Full 4K UltraHD resolution HDMI 2.0a and dual channel LVDS- Two MIPI-CSI-2 camera inputs- 2x GbE LAN (optional TSN support), USB 3.0/2.0 and OTG- Standard or rugged support: 0°C to 60°C or -40°C to 85°C- 15 year product availability
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Product
19” Rackmount Data Collection System
DCS-211
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- Intel Atom® x5-E3930 processor- Up to 8x DI and 6x DO with two 2A relays- 3x M12 GbE, 1x RJ-45 GbE, 2x isolated RS232/422/485, 2x USB and one lockable HDMI port- Up to 3x PCI Express mini slots with one USIM card slot each- Storage: up to 64GB eMMC 5.0, 1x 2.5” SATA drive bay
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Product
4/8-CH 12-Bit 1 MS/s Analog Output Multi-Function DAQ PCI Express Cards
DAQe-2500 Series
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ADLINK DAQe-2500 series are high-speed and high-performance analog output multi-function DAQ PCI EXpress cards. The devices are able to update up to 8-CH, 12-bit analog outputs simultaneously at sustaining 1 MS/s. The reference sources and the output polarities are programmable on per channel basis, combining with the multiplying DAC architecture, ADLINK DAQe-2500 series DAQ cards can generate complex modulated analog signals. The hardware-based arbitrary waveform generation frees the CPU intervention even when all analog outputs are updating at full speed, and the lengths of waveforms are only limited by the system memory.
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Product
16-CH 12-Bit 110 kS/s Multi-Function DAQ Card
PCI-9112
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- Supports a 3.3 V or 5 V PCI bus- 12-bit A/D and sampling rate up to 110kS/s- 16-CH single-ended or 8-CH differential inputs- On-board A/D FIFO
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Product
Computer-On-Module
Qseven®
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Qseven is an off-the-shelf, multi-vendor, computer-on-module that integrates all the core components of a common x86 PC and is mounted onto an application specific carrier board. A single ruggedized 230-pin MXM connector provides the carrier board interface to carry all the I/O signals to and from the Qseven module.
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Product
SMARC Short Size Module with NXP i.MX 8M Plus
LEC-IMX8MP
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ADLINK LEC-IMX8MP, based on the powerful NXP i.MX8M Plus (quad core Arm Cortex-A53) processor with an optional Neural Processing Unit (NPU) operating at up to 2.3 TOPS., is the first SMARC revision 2.1 compliant module focusing on machine learning and vision, advanced multimedia, and industrial IoT with high reliability. Additionally, it supports dual Image Signal Processors and two camera inputs for an effective Vision System. The LEC-IMX8MP is suited for applications such as smart home, building, city and industry 4.0.
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Product
Data Acquisition & Control
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With these DAQ systems, you can acquire and digitize signals from variety of sources and sensors, store the data, analyze it, and present the results in local and remote locations.
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Product
16/32 -CH 16-Bit 250/500 KS/s Multi-Function DAQ Cards with Encoder Input
PCI-9222/9223
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The ADLINK PCI-9222/PCI-9223 is a 16-bit, 16/32-CH, 250/500 KS/s high performance DAQ card with 8 different input ranges. It also features 2-CH 16-bit analog outputs capable of a 1 MS/s update rate, 2-CH encoder inputs, and programmable function I/O. The software-programmable function I/O supports a variety of applications, including TTL digital I/O, high-speed DIO, general-purpose timer/counter, pulse generation, and PWM output. Analog input, analog output, and function I/O at full speed simultaneously, and multiple cards can be synchronized through the SSI (System Synchronization Interface) bus if users need more channels than a single board can provide. Ideal for mixed-signal tests, laboratory research, and factory automation, PCI-9222/PCI-9223 is the best single-board solution on the market providing the best integration capability of multiple tasks with high performance and an affordable price.
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Product
Computer-On-Module
SMARC
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SMARC form factor is the only computer-on-module form factor that truly is capable of supporting both ARM and x86 designs. With 314-pins on a high speed MXM3 connector, SMARC can fully cover both typical x86 interfaces as well as typical ARM type low level signals. Using ARM SoCs opens the possibility to leverage the product ecosystem of familiar devices such as tablet computers and smart phones. Alternative low power SoCs and CPUs, such as tablet oriented x86 devices and other RISC CPUs may be used as well.
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Product
COM Express Basic Size Type 6 Module with 12th Gen Intel® Core™ Processor (formerly codename: Alder Lake-P)
Express-ADP
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ADLINK’s Express-ADP COM Express Type 6 Basic size module is based on the 12th Gen Intel® Core™ processor and is the first COM Express module to support advanced hybrid architecture with up to 6 Performance-cores (P-cores) for IoT workloads and up to 8 Efficient-cores (E-cores) for background task management, boosting productivity and fueling IoT innovation across a wide variety of deployments.
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Product
Value Family 9th Gen Intel® Core™ i7/i5/i3® Processor-Based Embedded GPU/AI Platforms
MVP-5100-MXM Series
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- 9th Gen Intel® Core™ i7/i5/i3 LGA processor- Dual SODIMMs sockets for up to 32GB DDR4- Abundant I/O: Up to 4x additional DP 1.4 from MXM, 2x DP++, DVI, VGA, 3x GbE, 3x COM, TPM2.0- 3x USB 3.1 Gen 1, 3x USB 2.0- Rich storage options: 2x 2.5" SATA, M.2 2280
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Product
COM Express Compact Size Type 6 Module with Mobile 7th Gen Intel® Core™ and Celeron® Processors (formerly codename: Kaby Lake)
cExpress-KL
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The cExpress-KL is a COM ExpressR COM.0 R2.1 Type 6 Compact size module featuring the 64-bit 7th Generation Intel® Core™ i7/i5/i3 and IntelR CeleronR Ultra-Low TDP processors (formerly "Kaby Lake U") with CPU, memory controller, graphics processor and I/O hub on a single chip.
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Product
Value Family 6th Generation Intel® Core™ i7/i5/i3 Processor-Based Fanless Embedded Computer
MVP-6000 Series
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ADLINK's newly introduced MVP-6000 Series of fanless embedded computing platforms, incorporating the 6th Generation Intel® Core™ processor (Code name: Skylake), provides one PCIe Gen3 x16, one PCI slot, 1 mini PCIe slot and single-side access for I/O ports, optimizing easy maintenance in industrial automation environments. The series retains the robust design of all ADLINK MXC/MXE lines, at a new extremely cost-effective price point.
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Product
Windows Driver & SDK for ADLINK PCI/PCI Express/cPCI Series Data Acquisition Cards
PCIS-DASK
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ADLINK PCIS-DASK is an advanced 32-/64-bit kernel driver and 32-bit/64-bitDLL Library for custom data acquisition application development. PCIS-DASK provides a common set of Application Programming Interface (API) for ADLINK"s extensive family of PCI/PCI Express(R)/cPCI Series Data Acquisition Cards, and is ideal for custom applications development under 32-bit/64-bit Windows 7/8. With PCIS-DASK, you can easily access all functionality of ADLINK DAQ PCI/cPCI general series data acquisition cards.
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Product
16-CH 16-Bit 250 kS/s Low-Cost Multi-Function DAQ PCI Express Cards
DAQe-2213/2214
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ADLINK DAQe-2213/2214 can sample up to 16 AI channels with different gain settings and scan sequences. It makes them ideal for dealing with analog signals with various input ranges and sampling speeds. These devices also offer differential mode for 8 AI channels in order to achieve maximum noise elimination.
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Product
8-CH Relay Output Module
ND-6063
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- 8-CH relay outputs- Output Type: 8 Form A- Contact Rating: AC: 0.5 A / 125 V; DC: 1 A / 30 V or 0.3 A / 110 V; ON/OFF Interval Time: 3 ms- Breakdown Voltage: 500 VAC (50/60 Hz)
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Product
High-Performance 6th Generation Intel® Core™ i7/i5/i3 Processor-Based Fanless Embedded Computer
MXC-6400 Series
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The Matrix MXC-6400 series is a line of high-performance fanless embedded computers, integrating 6th generation Intel® Core™ i7/i5/i3 processors and the QM170 chipset for more powerful computing and graphics performance with minimal power consumption.
