Evolved Packet Core
LTE system core voice and data network.
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Product
SMARC® 2.1 Short Size Module With Intel® Core™ I3 Processors, Intel® Processors N Series And Intel® 7th Gen Atom® X7000E Processors
LEC-ALN
Computer on Module
The ADLINK LEC-ALN is a SMARC module that supports up to 8 cores Intel® Core™ i3 (i3-N305, i3-N300) Processors, Intel® Processors N Series (N97, N50) and Intel® Atom® x7000E (x7425E, x7213E, x7211E) Processors (formerly Alder Lake-N) with integrated Intel® UHD graphics and high-speed interfaces. LEC-ALN modules support up 16GB LPDDR5 memory, up to 256GB eMMC storage (build option) and are also available with rugged operating temperature range and low power envelope, making them a perfect match for mission critical fanless edge computing applications that require safety and reliability at all times.
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Product
Mini-ITX SBC With LGA1151 9th/8th Gen Intel® Core™ I7/i5/i3 Processor, Dual DisplayPort++, HDMI, LVDS, USB 3.0, MSATA, M.2 And Dual GbE LAN
MANO520
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The MANO520 is powered by the LGA1151 socket 9th/8th generation Intel® Core™ i7/i5/i3 (code name: Coffee Lake), Intel® Pentium® Gold or Intel® Celeron® processor with the Intel® Q310 chipset (Intel® Q370 optional). The Intel® Coffee Lake-based MANO520 is specifically designed for performance-demanding applications with its excellent reliability as well as communication and real-time computing capabilities. The MANO520 supports two 260-pin DDR4-2666/2400 SO-DIMM sockets for up to 32GB of memory. Also, the mini-ITX motherboard features three SATA-600 connectors and one mSATA for additional storage. It is equipped with one full-size PCI Express Mini Card, one PCIe x16 and one M.2 Key E slots for wireless devices such as Wi-Fi, Bluetooth, and 3G/LTE. Moreover, the mini-ITX form factor single board computer features an ATX connector with AT mode auto power function.
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Product
Embedded System Supporting MXM Graphics Module with 8th/9th Generation Intel® Core™ i7/i5/i3 in LGA1151 Socket
DLAP-3000-CF Series
Embedded Platform
ADLINK provides an optimized, highly-available computing platform with expandability options, including the MXM cards. The DLAP-3000-CF series platforms support performance-hungry workloads (e.g., deep learning) with active cooling for applications requiring very high levels of computing in a limited space. DLAP-3000-CF Series features: - Smallest Embedded GPU Platform (3 liters) - Reliable MXM GPU Design with Low TDP - Scalable Graphics Processing Ranging from Pascal to Turing GPUs
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Product
High-Performance Intelligent Pod for Corelis Boundary-Scan Controllers
ScanTAP 4 & 8
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Boundary-scan has proven itself time and again to be a truly versatile interface for structural test, embedded functional test, built-in self-test (BIST), software debug, and in-system programming. Supporting such diverse applications requires equipment with high-performance specifications and extended features.Corelis ScanTAP pods are designed for use with PCI-1149.1/Turbo and PCIe-1149.1 high-speed JTAG controllers. Featuring 4 & 8 independent Test Access Ports (TAPs), up to 80 MHz clock rates, and advanced TAP capabilities such as analog voltage measurement, the ScanTAP family of intelligent pods is the ideal JTAG interface for high-performance environments.
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Product
15" Fanless Panel PC With 13th Gen Intel® Core™ Processors (I7/i5/i3)
PPC-315S RPL
Panel PC
True-flat touchscreen with Industrial-grade LCD panelHigh-performance, fanless 13th gen Intel® Core™ processorsSlim Compact, fanless design with aluminum alloy enclosureIP66-rated front panelSupports dual displays (1 x external DP), iDoor and PCI or PCIe1 x M.2 M Key 2242/2280 (SATA or NVME PCIe x 4) for storage, support SATA RAID 0,12 x 2500BASE-T Ethernet Supports Time-Sensitive Network(TSN) technologySupports VESA 100Support TPM2.0 hardware security
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Product
Fanless Embedded System With LGA1151 Socket 7th/6th Gen Intel® Core™ I7/i5/i3 & Celeron® Processor, Intel® Q170, HDMI, DVI-D, VGA, 8-CH PoE, 6 USB And 24 VDC
eBOX671-517-FL
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The eBOX671-517-FL supports 8-port Gigabit PoE and able to work under harsh temperatures. Its eight Gigabit PoE ports allow multiple cabling to cameras and any PoE power device; and, the eBOX671-517-FL is specifically designed for security surveillance, optical inspection, and edge computing applications. This rugged NVR embedded box PC is powered by the 7th/6th generation Intel® Core™ (Kaby Lake/Skylake) or Intel® Celeron® processors with a 35W/65W TDP and comes with Intel® Q170 chipset. The eBOX671-517-FL comes in great expansion possibilities, including a flexible I/O module slot with a wide selection of PCIe Mini modules and four PCI Express Mini Card slots. It also has two front-accessible SIM slots and four SMA-type antenna connectors. For storage, this high performance fanless embedded system has two SATA HDD drive bays with a height of up to 15 mm and one optional mSATA for RAID 0 and 1. Moreover, the embedded device supports two non-ECC 260-pin DDR4 SO-DIMM slots for up to 32GB of system memory.
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Product
PXIe-8821, 2.6 GHz Dual Core Processor PXI Controller
785158-33
Controller
PXIe, 2.6 GHz Dual Core Processor PXI Controller—The PXIe‑8821 is an Intel Core i3‑based embedded controller for PXI systems. You use it to create a compact and/or portable PC-based platform for industrial control, data acquisition, and test and measurement applications. The PXIe‑8821 includes a 10/100/1000 BASE‑TX (Gigabit) Ethernet port, two Hi‑Speed USB ports, two USB 3.0 ports, as well as an integrated hard drive, serial port, and other peripheral I/O.
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Product
3U Intel® Core™ i7-7820EQ Quad-Core Processor-Based PXI Express Gen3 Controller
PXIe-3987
Controller
The ADLINK PXIe-3987 PXI Express embedded controller, based on the 7th gen Intel® Core™ i7 processor, is specifically designed for hybrid PXI Express-based testing systems, delivering maximum computing power for a wide variety of testing and measurement applications.
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Product
COM Express® Basic Size Type 2 Module with 6th Gen Intel Core™, Intel Xeon® and Intel Celeron® Processors (formerly codename: Sky Lake-H)
Express-SL2
Computer on Module
ADLINK announces a new COM Express Type 2 Computer-on-Module, based on the highly popular Intel® Core processors (formerly codenamed Skylake and Kaby Lake). The Express-SL2/KL2 supports all type 2 related legacy I/O and thereby allows customers to extend the production life of existing type 2 based systems for at least another 10 years.
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Product
Industrial ATX Motherboard with 8th/9th Gen Intel® Core™ i9/i7/i5/i3 or Xeon® E Processors
IMB-M45
Motherboard
ADLINK IMB-M45 ATX industrial motherboard supports the 8th/9th Generation Intel Core i9/i7/i5/i3 and Xeon E3 processor in the LGA1151 package, and the Intel C246 chipset. This model supports ubiquitous high-speed data transfer interfaces PCIe 3.0, USB 3.1 Gen2 and SATA 6 Gb/s (SATA III), with dual-channel DDR4 2400/2666 MHz ECC or non-ECC memory up to 128 GB in four DIMM slots.
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Product
CT Core Tester
VCCT
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Veer make CT Core Tester VCCT is portable & easy to use Instrument. It is very useful to measure Voltage & Current of Electrical Steel like Toroidal Cores of different grade and size. VCCT is designed to test a lamination stack Toroidal Core. A Quality is judged by comparing the value of voltage applied & consumption of current.
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Product
3U CompactPCI Serial 9th Gen Intel Xeon®/Core™ i7 Processor Blade
cPCI-A3525 Series
Processor Blade
CompactPCI® Serial (PICMG CPCI-S.0) is a new modular computer standard officially adopted by PICMG in 2011. The CompactPCI Serial standard defines a completely new connector to support high-speed serial interfaces including PCI Express, SATA, USB and Ethernet. A CompactPCI Serial backplane has six high-speed connectors P1 to P6 on the system slot but only P1 is mandatory on peripheral slots, P2 to P6 being optional. A CompactPCI Serial system can comprise a total of nine blades (one system blade and eight peripheral I/O blades) through an Ethernet full mesh or single star architecture. The CompactPCI® Serial standard is the next-generation of the CompactPCI® specification and provides more flexibility and higher speed and bandwidth in modular system solutions.
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Product
Soft Magnetic Core Power Loss Analyzer
SS-SML01
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This SS-SML01 soft magnetic core power loss analyzer includes one set broadband power signal generator and on set W-A-V meter, the broadband power signal generator is specially researched and manufactured for the testing of the soft magnetism materials.
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Product
PICMG 1.3 Half-size CPU Card With LGA1151 9th/8th Gen Intel® Core™ I7/i5/i3, Xeon® E, Pentium® Or Celeron® Processor, Intel® C246/Q370/H310, SATA 3.0, USB 3.1 Gen1, LAN And DVI-I
SHB250R
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*LGA1151 9th/8th gen Intel® Core™ i7/i5/i3, Xeon® E (C246), Pentium® or Celeron® processor*Intel® C246/Q370/H310 chipset*2 DDR4-2666/2400 SO-DIMM for up to 64GB of memory*Supports M.2 slot (C246/Q370)*Supports Intel® AMT and vPro (C246/Q370)*TPM 2.0 supported
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Product
PICMG 1.3 Full-size CPU Card With LGA1151 8th Gen Intel® Core™ I7/i5/i3, Xeon® E, Pentium® Or Celeron® Processor, Intel® C246/Q370/H310, SATA 3.0, USB 3.1 Gen1/Gen2, Dual LAN And DVI-I
SHB150
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The SHB150 is based on the latest LGA1151 socket 8th generation Intel® Core™ processors (code name: Coffee Lake) and Intel® C246, Q370 or H310 chipset. The SHB150 features multiple I/O options and high-speed transfer interfaces as well as superior graphics capability (Intel® HD Graphics), making it an ideal solution for smart factory automation. The Intel® Core™-based full-size SBC, SHB150, comes with two 288-pin DDR4-2666/2400 Long-DIMM sockets with up to 32GB of system memory. The PICMG 1.3 single board computer has a maximum of six SATA-600 ports supporting software RAID 0/1/5/10 for data redundancy. It also has one M.2 Key M 2280 SSD slot with a PCIe x4 interface. The SHB150 with the Intel® HD Graphics brings a true high definition visual experience with triple display configurations (Intel® C246 or Q370) via DVI-I and DisplayPort (header) ports. Moreover, the Intel® Coffee Lake-based SHB150 supports optional Trusted Platform Module (TPM) 2.0 for optimum security, Intel® Active Management Technology (Intel® AMT) 12 for remote management, as well as Intel® vPro™ technology. The industrial single board computer provides significant advantages to customers in the fields of machine vision and industrial automation operations
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Product
23.8" Fanless Panel PC With Intel® Core™ I7/i5/i3 Processor
PPC-324W TGL
Panel PC
Industrial-grade 23.8" LCD panel with 30k backlight lifetimeTrue-flat touchscreen with multi-touch projected capacitive controlHigh-performance, fanless 11th generation Intel® Core™ i processorDual channel memory slots, max 64GCompact, fanless design with aluminum alloy enclosureIP66-rated front panelSupports dual displays (1 x external HDMI)1 x M.2 bay (2242/2280 NVME or SATA Interface) for storage and support SATA RAID 0, 11 x 2500BASE-T Ethernet Supports Time-Sensitive Network(TSN) technology
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Product
Compact Fanless System With Intel® Core™ Ultra 5/7/9 Processors (Series 2)
MIC-780
Modular Edge Computer
Intel® Core™ Ultra 5/7/9 Processors (Series 2)CPU type: Socket (LGA1851)Chipset: Intel® W880/H810DDR5 Memory up to 128GB 6400MT/sMIC-780W: 3 x displays – 2 x HDMI/1 x DP, 4 x GbE LAN, 4 x USB 3.2 Gen2x1 (10G), 2 x COM, 1 x NVMe M.2 (PCIe Gen4 x4)MIC-780H: 3 x displays – 2 x HDMI/1 x DP, 2 x GbE LAN, 2 x USB 3.2 Gen 2x1 (10G), 2 x USB 3.2 Gen 1x1 (5G) , 2 x COM
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Product
COM Express Type 6 Basic Module With Intel® Xeon® & 8th Gen Intel® Core™ Processors And Intel® CM246/QM370/HM370
CEM520
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The CEM520 is a high-performance COM Express Type 6 basic module featuring triple independent displays, industrial operating temperatures and rich expansions. The CEM520 is based on the Intel® Xeon® E-2176M and 8th generation Intel® Core™ i7/i5/i3 processors (codename: Coffee Lake) with the Intel® CM246/QM370/HM370 chipset. The system-on-module is equipped with dual DDR4-2666 SO-DIMM slots for up to 32GB of system memory. Its wide operating temperature range of -40°C to +85°C strengthens the adaptability of harsh operating conditions. Integrated with Intel® Gen 9 graphics, and with the support of DX11/12, OCL 2.0 and OGL 4.3/4.4, the Intel® Xeon® and Core™-based computer-on-module presents excellent graphics performance with a resolution up to 4K. Three independent displays are supported through one LVDS, one VGA and two DDI ports for HDMI, DisplayPort. The CEM520 comes with multiple I/O connectors including four SATA-600 interfaces with RAID 0/1/5/10, one Gigabit LAN port with Intel® i219-LM controller, four USB 3.0 ports, eight USB 2.0 ports, and 4-In/Out DIO port. Also, the system-on-module is expandable with one PCIe x16 slot and eight PCIe x1 slots, as well as LPC and SMB expansion buses. Trusted Platform Module 2.0 (TPM 2.0) is supported to provide efficient hardware-based data protection. This new powerful COM Express Type 6 module is compatible with Windows® 10 and Linux operating systems. It also supports AMS.AXView – Axiomtek’s exclusive software for smart device monitoring and remote management applications.
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Product
Tilera GX72 Processor, 72 Core, Mid-size, AMC
AMC741
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The AMC741 is ideal for packet filtering, intelligent networking, multimedia, video transcoding, cloud and other applications. The device includes 72 identical processor cores (tiles) interconnected with Tilera’s iMesh™ on-chip network.
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Product
1U Network Appliance With 12th/13th/14th Gen Intel® Core Processors For Network Security And Management For Network Security Applications.
FWA-3034
Network Appliance
12th/13th/14th Gen Intel Core Processors, up to 24 Cores/32 Threads, Hybrid Performance & Efficiency CoresDDR5 UDIMM with up to 64GB2 x 1GbE SFP, 8 x 2.5GbE RJ-45, 2 x 10GbE SFP+ with two pairs of LAN bypass2 x internal 2.5” SATA SSDs/HDDsIPMI v2.0 compliant BMC1 x Advantech network module expansion
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Product
Rugged 3U VPX Intel® Xeon® and 9th Gen Core™ i3 Processor Blade
VPX3020
Processor Blade
- Intel® Xeon® Processor E-2254MLand 9th Gen Intel® Core™ i3 (formerly “Coffee Lake-H Refresh”)- DDR4-2666 soldered ECC SDRAM up to 16GB- Optional SATA SLC SSD, up to 64GB- Up to PCIe x16 Gen3 interface supporting non-transparent bridge=
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Product
Fanless Embedded System With LGA1150 Socket 4th Gen Intel® Core™ I7/i5/i3 & Celeron® Processor, Intel® Q87, 4 PoE, 6 USB 3.0, HDMI/DVI/DisplayPort And 2 PCIe Mini Cards
eBOX671-885-FL
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The eBOX671-885-FL powerful industrial-grade embedded vision system features PoE (power-over-Ethernet) support. To provide better computing performance, the powerful PoE embedded vision system supports LGA1150 socket 4th generation Intel® Core™ i7/i5/i3 or Celeron™ processor (Codename: Haswell/Haswell-refresh). Its four channel Gigabit PoE ports allow multiple cabling to cameras and any PoE power device. With high-end CPU and multi-I/O connectivity, this fanless embedded vision system is well suited to multi-camera imaging applications such as optical inspection, surveillance system and IoT & M2M-related applications.
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Product
Slim And Light All-In-One Medical Panel Computer Family With 11th Generation Intel® Core™ Processor Performance
MLC-M Series
Panel PC
MLC-M is a slim and light medical panel PC ideal for hospital information management at nursing stations or on medical carts. The MLC-M supports an 11th gen Intel® Core™ processor (Tiger Lake), providing the processing power needed to run high performance image processing software as well as hospital applications such as HIS, RIS, PDMS, and documentation software. The MLC-M has an IP54 rating courtesy of its screwless and fanless design, making cleaning easier, and protecting clinicians, nurses, and patients from possible infection. For superior user experience, the MLC-M has a highly flexible IO function module that can be customized for dedicated applications, four control keys for straightforward operation, a touch panel, and a selection of optional accessories.
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Product
Drum Core Inductors
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Drum core inductors are so named as the conductor (round magnet wire) is wound directly onto the ferrite core which is shaped like a drum or spool. The wire is then connected to the core, a plastic base or metal lead frame to form the surface mount termination. Drum core inductors come in unshielded (high saturation current but potentially more EMI) and shielded constructions (lower saturation current but closed magnetic path for lower EMI). The shielded constructions use either a second ferrite core or a magnetic resin epoxy to create the magnetic shield.
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Product
Split Core Current Transformers
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Application:Watt Transducer, Current Transducer, KWH Meter, Demand Meter, Power Factor Meter, Current Sensing Relays, Energy Management SystemsContinuous Thermal: Rating 1.25 at 30° C, 1.0 at 55° C Standard 5-amp secondary. Others available.
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Product
Micro ATX Motherboard With LGA1151 Socket 7th/6th Gen Intel® Core™ Processor, Intel® Q170, USB 3.0, SATA 3.0, Dual LAN, VGA, DisplayPort, DVI-D, And HDMI
MMB501
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The MMB501 is powered by the LGA1151 socket 7th/6th generation Intel® Core™ i7/i5/i3, Pentium® and Celeron® processors (formally codename: Kaby Lake/Skylake) with Intel® Q170 chipset. The MMB501 supports four high bandwidth 288-pin DDR4-2133/2400 with a memory capacity up to 64GB. The industrial-grade micro ATX motherboard is expandable with one PCIe x16 slot, two PCIe x4 slots, one PCI slot and one full-size PCI Express Mini Card slot. Moreover, the embedded board supports triple-display via DisplayPort, HDMI, DVI-D and VGA interfaces. Furthermore, this outstanding multi-function embedded motherboard is integrated with the Intel® HD Graphics 530/510 to deliver stunning UHD 4K resolution and fast 3-D and video playback for graphics-intensive applications. To meet the distinct needs from users, there are six SATA-600 with RAID 0/1/5/10, six USB 3.0, five USB 2.0, four RS-232 ports, two RS-232/422/485 ports, one DisplayPort, one DVI-D, one HDMI and one VGA, as well as has two Gigabit Ethernet ports with Intel® i219LM and Intel® i211AT controllers. To ensure stable and reliable operation, the high-performance Intel® Core™-based industrial micro ATX motherboard supports a watchdog timer and hardware monitoring features. Furthermore, this new embedded board runs well with Windows® 7, and Windows® 10 operating systems.
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Product
Tilera GX72 Processor AMC, 72 Core
AMC740
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The AMC740 is ideal for packet filtering, intelligent networking, multimedia, video transcoding, cloud and other applications. The device includes 72 identical processor cores (tiles) interconnected with Tilera’s iMesh™ on-chip network. Each tile consists of a full-featured, 64-bit processor core as well as L1 and L2 cache and a non-blocking Terabit/sec switch. The high processing density and high internal bandwidth of the GX72CPU make it ideal for intensive computing tasks.
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Product
COM Express® Basic Size Type 6 Module with Up to Hexacore 8th Gen Intel Core™ 8000 Series and Intel Xeon® Processors (formerly codename: Coffee Lake-H)
Express-CF/CFE
Computer on Module
The Express-CF/CFE is the first COM Express® COM.0 R3.0 Basic Size Type 6 module supporting the Hexa-core (6 cores) 64-bit 8th Generation Intel® Core™ and Xeon® processor (codename “Coffeelake-H”) with Mobile Intel® QM370, HM370, CM246 Chipset.
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Product
Fanless Embedded System With Intel® Core™ I5-7300U/i3-7100U & Celeron® 3965U, 2 HDMI, 2 GbE LAN, 4 USB 3.0 And PCI Express Mini Card Slot
eBOX560-512-FL
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The eBOX560-512-FL is powered by the Intel® Core™ i5-7300U/i3-7100U or Celeron® 3965U processor. To enhance system efficiency, the embedded box PC supports one 260-pin DDR4-2133 SO-DIMM socket with up to 16 GB system memory. Two HDMI ports with up to 4K resolution are supported for dual independent display applications. The palm-sized fanless embedded system is dedicated to smart factory automation, thin clients, industrial controller system, digital signage and retail equipment. Axiomtek's eBOX560-512-FL was designed to operate reliably in industrial and embedded application environments. It is enclosed in IP40-rated heavy-duty aluminum extrusion and steel enclosure and offers a wide operating temperature range from -10°C ~ +50°C (+14°F ~ +122°F) and up to 3G vibration endurance.
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Product
9th Gen Intel® Xeon®, Core™ i7/i3 and 8th Gen Intel® Core™ i5 Processor-Based Embedded Fanless Computer
MXE-5600 Series
Industrial Computer
- 9th Gen Intel® Xeon®, Core™ i7/i3 and 8th Gen Intel® Core™ i5 BGA processor and Mobile Intel® CM246 Chipset- Dual SODIMMs for up to 32GB DDR4 non-ECC/ ECC memory- Rich I/O: 2x DP++, HDMI, 2x GbE, 6x COM, 8-ch DI, 8-ch DO, TPM2.0- 2x USB 3.1 Gen2, 2x USB 3.1 Gen1. 4x USB 2.0- Rich storage: 2x 2.5" SATA 6 Gb/s, CFast, M.2 2280
