IED
a microprocessor that controls power equipment devices.
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Product
Modular Compact Embedded Box PC With 6th/7th Gen Intel® Core™ I CPU
UNO-2484G
Box PC
Intel® Core™ i7/i5/i3/Celeron Processor with 8GB DDR4 built-in Memory4 x GbE, 4 x USB 3.0, 1 x HDMI, 1 x DP, 4 x RS232/422/485Stackable 2nd layer for up to 4 iDoor extension or customize for domain applicationsCompact Fanless DesignRuggedized by zero cable and lockable I/O designSupports 30+ iDOOR combination with four main categoriesDiverse system I/O and Isolated Digital I/O by iDoor TechnologySupports Fieldbus Protocol by iDoor Technology3G/GPS/GPRS/Wi-Fi Communication by iDoor Technology with RED Compliance
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Product
Holographic Concave Gratings - Type I
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HORIBA Scientific produces a wide range of holographic master gratings from which high precision replicas are manufactured.Type I holographic concave gratings are recorded on spherical substrates, with equidistant and parallel grooves.Their geometric optical properties are the same as classically ruled gratings and are interchangeable with them.When used in a spectrograph, Type I holographic concave gratings are traditionally arranged on the Rowland circle (i.e., the circle defined by the grating center and the tangential radius of curvature of the grating).
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Product
Compact Fanless System With 12th/13th/14th Gen Intel® Core™ I CPU Socket (LGA 1700)
MIC-770 V3
Modular Edge Computer
Intel® 12th/13th/14th Gen Core™ i CPU socket-type (LGA1700) with Intel® R680E/ H610E chipsetWide operating temperature (-20 ~ 60 °C)2 x GigaLAN, 2 x USB 3.2 (Gen2) and 6 x USB 3.2 (Gen1); 2 x RS-232/422/485 and 4 x RS232 serial ports (Optional)1 x 2.5" HDD/SSD, 1 x mSATA, and 1 x NVMe M.2; 9 ~ 36 VDC input power rangeIP40 dust proof for deployment in harsh environmentSupports FlexIO and iDoor technology, flexible configure additional DP, DVI, COM port, DIO, Remote switch IOSupports Advantech i-Modules; Supports Advantech SUSIAPI and embedded software APIsSupports Intel® vPro™/AMT and TPM technologies; Supports Advantech iBMC 1.2 remote out-of-band power management solution on WISE-DeviceOnSupport Windows 11 IoT Enterprise LTSC
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Product
Intel Coffee Lake Platform To Support Intel® 9th & 8th Gen Core™ I Processor With One Low-Profile PCIe Expansion Slot
EPC-B2276
Embedded PC
Supports Intel® 9th & 8th Gen Core™ i processor (LGA1151) with Intel Q370.Two 260-pin SO-DIMM up to 32GB DDR4 2133 MHz SDRAM.Supports triple display of 2x DP/HDMI.One low-profile PCIe expansion slot.Reserved 2 USB, 2 COM, punchouts on front panel.Support SUSI, WISE-DeviceOn and Edge AI Suite.
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Product
I²C/SPI Interface Device
Interface
The I²C/SPI Interface Device is a master or slave interface for inter-integrated circuit (I²C), or master interface for serial parallel interface (SPI) devices. With plug-and-play USB connectivity, the I²C/SPI Interface Device is a portable solution to communicate with consumer electronics and integrated circuits. The I²C/SPI Interface Device can be physically located more closely to I²C/SPI devices than PCI interfaces, reducing I²C bus length and minimizing noise problems. The I²C/SPI Interface Device supports I²C rates up to 250 kHz and SPI rates up to 50 MHz, and it also includes eight general-purpose digital I/O lines for a variety of applications, such as configuring the address of I²C devices or toggling LEDs.
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Product
Compact Fanless AMR/MMR Controller System With 12th/13th/14th Gen Intel® Core™ I CPU Socket (LGA 1700)
MIC-760
Controller
High-performance computing powered by Intel® 12th/13th/14th Gen Core™ i CPUFanless design ensures reliable operation in environments up to 60°CIsolated DIO, CANbus and Serial ports guarantee for industrial communicationContact 8KV/Air 15KV IV level ESD protection , ClassB for EMI design, best choice for industrial environment3 Ethernet and 4 USB3.2 (5Gbps) for Camera and Lidar connectionIndustrial WiFi design enables fast roaming at 36msCompact size ensures easy installation for AMR/MMRBuilt on Ubuntu 22.04 and Advantech Edge Linux, with ROS2 package readinessROS2 package enhances industrial automation capabilities including EtherCAT and Modbus node support
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Product
Interfaces & I / Os
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USBTucan is a USB-connected I / O box with digital inputs / outputs, analog inputs and a galvanically isolated CAN interface.
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Product
Intel® 8th & 9th Gen. Core™ I Mini-ITX Motherboard
PPC-MB-610
Motherboard
Supports Intel® 8th & 9th Gen Core™ i processor (LGA1151) with Intel Q370 chipsetTwo 260-pin SO-DIMM up to 32GB DDR4 2666 MHz SDRAMSupports triple display of DP/VGA/LVDSSupports PCIe x16 (Gen 3), 1 M.2 M key & 1 M.2 E key, 6 x USB 3.1Supports 2 x SATA 3.0 (Raid 0, 1)Supports TPM 2.0 (optional)Supports 4 RS-232,1 RS-232/422/485Supports 1 GPIO(8 channels)
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Product
Modular TPC - Computing Box Module With Intel® 12th/13th/14th Gen./BTL S Core™ I CPU Socket (LGA1700)
TPC-B620
Panel PC
High Performance Computing Box powered by Intel® 12th/13th/14th Gen. Core™ i / BTL Core™ S-series CPUs Socket (LGA1700) with fanless design10+ x Panel Modules (IP66) ranging from 15" to 23.8" in selectionDual Channel Memory slots (DDR5) support up to 64GB in totalComprehensive I/Os, including 4 x USB, 2 x COM, 3 x RJ45...etcSupports Expansion via 1 x PCIe x16, 1 x PCIe x4 or PCIe x2, 4 x M.2 (NVMe, SATA, WIFI)Supports Storage via 2 x M.2 2280 SATA SSD (RAID 0/1), 1 x M.2 NVMe SSD (2280)Supports Fieldbus protocols/GPS/GPRS/Wi-Fi capabilities via iDoor technologySupports Diverse system I/O, DIO, PoE...etc. via iDoor technologySupports TPM 2.0 hardware security
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Product
Modular Embedded Box PC With 11th Gen Intel® Core™ I CPU
UNO-2484G V2
Box PC
Intel® Core™ 11th i7/i5/i3 Processor with 8GB DDR4 3200Mb/s memory4 x GbE, 3 x USB 3.2 Gen2, 1 x USB2.0, 1 x HDMI 1.4, 1 x DP 1.4a, 4 x RS232/422/485Optional 2nd stack supports up to 2 x iDoor extension for expending wireless connectivity, industrial fieldbus or more I/OCompact fanless designRuggedized by zero cable and lockable I/O designSupports NVME storage with high data-transmission efficiency
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Product
High Force Type Probe For PCB, K100 Series 100mil Pitch, Type I, Ø1.26mm, 155gf
K100-I126155-SKAU
Spring Probe
K100 Series, Pitch 100mil, Tip Style I, Tip Diameter Ø1.26mm, Spring force 155gf, Steel with Gold Plating.
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Product
Compact Fanless System With 10th Gen Intel® Xeon®/Core™ I CPU Socket (LGA 1200)
MIC-770 V2
Modular Edge Computer
Intel® 10th Gen Xeon®/Core™ i CPU socket-type (LGA1200) with Intel® W480E/H420E chipsetWide operating temperature (-10 ~ 60 °C), 9 ~ 36 VDC input power range2 x GigaLAN, 2 x USB 3.2 (Gen2) and 6 x USB 3.2 (Gen1)2 x RS-232/422/485 and 4 x RS232 serial ports (Optional)1 x 2.5" HDD/SSD, and 1 x mSATASupports Advantech i-Modules, FlexIO and iDoor technology, flexible configure additional HDMI, DVI, Comport, DIO, Remote switch IOVGA and HDMI™ output (The terms HDMI, HDMI High-Definition Multimedia Interface, HDMI trade dress and the HDMI Logos are trademarks or registered trademarks of HDMI Licensing Administrator, Inc.)Microsoft Azure PnP, AWS IoT Greengrass, Ubuntu CertifiedRED Compliance
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Product
Intel® 8th/9th Generation Core I 2U Fan System
EPC-P3086
Embedded PC
ntel® 8th/ 9th Gen Core™ i processor (LGA1151) with Intel C246/H310Up to 4 x extension Card by Riser Card (Optional)12~24V DC input power rangeSupport Advantech I Door module
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Product
Digital I / O modules
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The 34950A module has 64-bit bi-directional lines and can be configured with 8 8-bit digital I / O channels with handshaking capability. Each 8-bit channel has programmable polarity and a threshold of up to 5V. The memory can be used to generate or capture digital patterns up to 10 MHz. It provides seven configurable handshaking protocols for a wide range of applications. In addition, two counter / totalizer channels can be used to compute events, frequency, period, duty cycle, accumulation, and pulse width.
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Product
Intel® Core™ I Automation Computer With 2 PCI(E) Expansion Slots
UNO-3283G
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6th Generation IntelR Quad Core Processors with 8GB DDR4 Memory2 x GbE, 6 x USB 3.0, 2 x RS-232/422/485, 2 x RS-232 (pin header), 1 x DVI-I, 1 x HDMI1 x PCIex16, 1x PCI, 2 x mPCIe (2 x full), 1x CFast slot, 1 x mSATA slot (optional)Thumb screw for easy maintenanceHot-Swappable HDD/SSD support for RAID 0/1Easily exchangeable RTC batterySupports Fieldbus Protocol by iDoor TechnologyChassis Grounding ProtectionLAN Redundancy (Teaming)
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Product
Intel® 6th/7th Generation Core I Desktop Compact Fanless System
MIC-7700
Computer-on-Module
Intel® 6th/7th Generation Core i Desktop CPU (LGA1151) with Q170/H110 chipset2 x RS-232/422/485 and 4 x RS232 serial ports (with expansion cable)1 x 2.5" HDD, 1 x CFast, 1x mSATA and 1 mini-PCIe with SIMSupports 2 LAN, Isolation COM, 32-bit GPIO modules2 x GigaLAN and 8 x USB 3.0VGA and DVI outputSupports Advantech’s i-module, SUSIAccess, and embedded software APIs9 ~ 36 V DC input power rangeWide operating temperature
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Product
Intel® 8th/9th Generation Core I 2U Fan System
EPC-P3066
Embedded PC
Intel® 8th/ 9th Gen Core™ i processor (LGA1151) with Intel C246/H310Up to 4 x extension Card by Riser Card (Optional)3 x GigaLAN and upto 8 x USB3.02 x RS-232/422/485 and 4 x RS232 serial ports, 16 bit GPIO4 x SATA (max), 1 x M.2 E key, 1 x M.2 B/M key, 2 x F/S mSATAVGA+HDMI or 2 x HDMI output (Optional)12~24V DC input power rangeSupport Advantech I Door moduleSupport SUSI, WISE-DeviceOn and Edge AI Suite
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Product
Compact Fanless System With 8th/9th Gen Intel® Core™ I CPU Socket (LGA 1151)
MIC-770
Modular Edge Computer
Intel® 8th/9th Gen Core™ i CPU socket-type (LGA1151) with Intel® Q370/H310 chipsetWide operating temperature (-10 ~ 50 °C), 9 ~ 36 VDC input power range2 x GigaLAN, 2 x USB 3.1 and 6 x USB 3.02 x RS-232/422/485 and 4 x RS232 serial ports (Optional)1 x 2.5" HDD/SSD, and 1 x mSATASupports 2 x LAN, isolation COMs, and 32-bit GPIO modulesSupports Advantech i-ModulesSupports Advantech SUSIAccess and embedded software APIsVGA and HDMI™ output (The terms HDMI, HDMI High-Definition Multimedia Interface, HDMI trade dress and the HDMI Logos are trademarks or registered trademarks of HDMI Licensing Administrator, Inc.)
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Product
Intel® Core™ I Automation Computer With 4 PCI(E) Expansion Slots
UNO-3285G
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Intel® 6th Gen Core™ i7-6822EQ Quad Core Processors with 8GB DDR4 Memory2 x GbE, 6 x USB 3.0, 2 x RS-232/422/485, 2 x RS-232 (pin header), 1 x DVI-I, 1 x HDMI2 x PCIe x8, 2 x PCI, 2 x mPCIe (2 x full), 1x CFast, slot, 1 x mSATA slot (optional)Dual Hot-Swappable storage with thumb screw support for RAID 0/1Supports Fieldbus Protocol by iDoor TechnologyDual power input for power redundancyFront LED indicator design for monitoring system status
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Product
MCB Thermal Trip Calibration Test Bench (IEC 60898 Cl 9.10.1.2, Annex I.1, IS)
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The test system is designed and customized to carry out 2.55*Intest as per Table 7 (test c) of IEC 60898 (also mentioned for routine testing of MCBs. The test is done at dc current to exactly analyze and correct the bimetallic properties of the MCB as far as thermal tripping is concerned. The unit comes with a pneumatically operated test fixture with in-built dc stepper motor that is controlled by a micro controller / PC to calibrate the breaker into a narrow tripping band programmed by the user.
