Showing results: 166 - 180 of 382 items found.
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IC-CMC-VPX3a -
ELMA Electronic, Inc.
The IC-CMC-VPX3a is a 3U OpenVPX adapter board for PMC or XMC mezzanine modules. Expand the I/O or storage features of your system using a wide range of available modules.
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IC-GIGA-XMCb -
ELMA Electronic, Inc.
The IC-GIGA-XMCb is an XMC module providing up to four 10/100/1000 Ethernet channels.
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IC-INT-VPX3e -
ELMA Electronic, Inc.
The IC-INT-VPX3d is a powerful OpenVPX 3U Single Board Computer (SBC) based on Intel’s High-Performance Low Power Spectrum Broadwell-DE processor for high performance embedded computing (HPEC).
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IC-GRA-XMCe -
ELMA Electronic, Inc.
The IC-GRA-XMCe is an ultra-low-power graphic XMC mezzanine board providing cutting-edge video quality and performance for military/aerospace (radar, SIGINT, ELINT, COMINT), medical imaging applications and industrial applications.
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IC-FEP-VPX3f -
ELMA Electronic, Inc.
Based on the latest Xilinx Kintex® UltraScale™ 20nm FPGA family, the IC-FEP-VPX3f is the first VITA 66.5 compliant FPGA board available. It is the perfect solution for applications requiring DSP-intensive processing in a 3U VPX form factor
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IC-ARM-VPX3b -
ELMA Electronic, Inc.
Designed for applications requiring high processing and communication performance and low power, the IC-ARM-VPX3b is a highly versatile SBC for small, 3U OpenVPX systems. The IC-ARM-VPX3b is developed in alignment with the SOSA™ Technical Standard.
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IC-FEP-VPX3d -
ELMA Electronic, Inc.
Based on the latest Xilinx 20nm FPGA family, the IC-FEP-VPX3d uses a Kintex® UltraScale™ FPGA making it the perfect solution for DSP-intensive processing in a 3U VPX form factor.
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IC-FEP-VPX6e -
ELMA Electronic, Inc.
Based on the latest Xilinx Kintex UltraScale™20nm FPGA, the IC-FEP-VPX6e is a 6U OpenVPX Front-End Processor (FEP) optimized for applications requiring DSP intensive processing in highly constrained environments.
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IC-INT-VPX6d -
ELMA Electronic, Inc.
The IC-INT-VPX6d is a 6U OpenVPX digital signal processing (DSP) embedded computing board for defense applications. It is a key element in high -performance embedded computing (HPEC) designs.
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Teledyne DALSA
Teledyne DALSA’s mixed-signal group, formerly known as Axiom IC, delivers high-performance, high-quality data-converter designs and IP blocks for the industrial, professional, scientific, imaging and audio markets. Based in the Kennispark business and science park in Enschede, The Netherlands, the group works in close cooperation with the University of Twente and supports PhD students and trainees to stay involved in the newest CMOS design methodologies and technologies.
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ScanTool.net, LLC
The OBD Development Kit is a modular development system designed to speed up the development of devices that interface with the OBD bus. It consists of the Interconnect Board, three removable modules (Power, OBD Drivers, and STN OBD IC), and an OBD cable.
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RoodMicrotec GmbH
Failure analyses in order to clarify the failure cause soonest possible.From single device to the whole system - and from highly complex IC up to printed circuit board (PCB), mounting & interconnection technology and printed board assembly (PBA).
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Ironwood Electronics
For BGA, QFN, or LGA applications, GTP contact technology provides >94 GHz signal speed and can additionally be used in high cycle life applications such as ATE. These sockets support pitches from 0.2 mm to 1.27 mm. Ironwood's GT sockets are ideal for prototyping and testing almost any BGA device application. These IC sockets provide excellent signal integrity yet remain cost effective. Innovative elastomer interconnect technology that delivers low signal loss (1dB at 94GHz) and supports BGA packages with pitches down to 0.2mm was utilized in these sockets. GT BGA sockets are mechanically mounted over a target system's BGA lands using mounting and alignment holes at proper locations (page 2 of the individual socket drawing shows recommended PCB layout information). These low-profile sockets are only 2.5 mm per side larger than actual IC packages (industry's smallest footprint).
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KLA-Tencor Corp
KLA’s extensive portfolio of packaging solutions accelerates the manufacturing process for outsourced semiconductor assembly and test (OSAT) providers, device manufacturers and foundries for a wide range of packaging applications. Innovations in advanced packaging, such as 2.5D/3D IC integration using through silicon vias (TSVs), wafer-level chip scale packaging (WLCSP), fan-out wafer-level packaging (FOWLP) and heterogeneous integration as well as a wide range of IC substrates create new and evolving process requirements. KLA offers systems for packaging inspection, metrology, die sorting and data analytics focused on meeting quality standards and increasing yield before and after singulation. SPTS provides a broad range of etch and deposition process solutions for advanced packaging applications. Orbotech offers a portfolio of technologies that includes automated optical inspection (AOI), automated optical shaping (AOS), direct imaging (DI), UV laser drilling, inkjet/additive printing and software solutions to ensure manufacture of the highest quality of IC substrates.
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Renesas Electronics Corp.
Renesas has invested in key technologies to address the latest trends within the automotive market. Offering both standard and AEC-Q100 qualified products for automotive applications, Renesas' automotive display IC product line is defined by feature rich, highly integrated semiconductor solutions that incorporate many key function blocks for front console, rear seat entertainment, and rear camera display applications.