Thermal Expansion
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Coupler Workstations
Workstations using pure hydrogen gas from a tabletop generator, tank supply, or oxygen, can achieve high enough temperatures to develop Fused Biconic Tapered devices, Power Combiners, Wavelength Division Multiplexers, Thermal Core Expansion devices, and many other products.
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Horizontal Dilatometers
TA Instruments’ unique True Differential configuration makes our dilatometers the preferred choice for the most accurate measurement of Coefficient of Thermal Expansion (CTE). The high precision linear position sensor, the thermostat equipped measuring head housing, and the use of thermally ultra-stable materials all contribute to the outstanding displacement resolution, and ensure the most accurate measurement of low CTE values.
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Digital Image Correlation System for Complete 3D Warpage, Thermal Expansion, and Strain Analysis of Materials and Components in the Heating and Cooling Phase
Q-400 TCT
The Q-400 TCT system is designed for complete three-dimensional and highly sensitive warpage, thermal expansion measurement and strain analysis of materials and components in the heating and cooling phase. Areas from 50 mm x 70 mm down to 2 mm x 3 mm can be investigated. Measurements can be done from room temperature up to 300°C and down to -40°C. The system is specially suited for thermal expansion measurement of electronic components and is frequently used in the development and testing of complex anisotropic materials, components, and structures in electronic applications.
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Expansion I/O Module.
SI-MOD22xx
The SI-MOD22xx is a family of high resolution, ultra high speed multi function data acquisition and control modules that plug into any SI-DSP carrier processor card for the PCI Express bus.
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Thermal cameras
SKF Condition Monitoring Center
Using an SKF Thermal Camera is a proactive way to help you detect problems before they occur, increasing uptime and improving safety. They allow you to be able to visualise potential problems, invisible to the naked eye, by presenting a picture of the heat distribution of an asset. The thermal image, presented on a large LCD screen, shows you where the temperature is either too hot or too cold allowing you to pinpoint potential problems fast.
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Current Loop Expansion Kit
OP-SB85C
This expansion kit supports current loop communications.The kit incorporates a communications circuit with photo-coupler isolation and constant-current power supply of insulated type, thus realizing not only monitoring but also easy communications testing with passive or active current loop devices.
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AMC For PCIe Bus Expansion
AMC113
AMC113 is VadaTech second generation PCIe expansion module. The AMC113 is a high-speed 20Gbps bridge from the host PCIe bus to VadaTech’s other carrier and Rear Transition Module (RTM) products such as the ATC104/114/118/117/119, ART114, μTCA chassis, etc. The different carriers host different I/O modules such as PMC/PrPMC, AMC, PCI-X and PCIe edge modules. This concept allows any of the available I/O modules in these standard form factors to be integrated quickly and easily into an AdvancedTCA or μTCA subsystem.The AMC113 allows expansion among multiple μTCA chassis or
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Thermal Imager
testo 865
The testo 865 thermal imager combines all the important properties required for high-quality thermographic measurement it is accurate, robust, fast and reliable. The testo 865 provides high-quality thermography at an affordable price and keeps going even in tough working conditions. The case supplied with the thermal imager means it can be conveniently transported, so it is always there for you when needed.
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Thermal Testing
At E-Labs, Inc., we support thermal cycling and thermal bakeout vacuum testing requirements. During thermal cycling, the unit experiences repeated heating and cooling as it would when exposed to the harsh environment of space. During thermal bakeout, flight equipment is subjected to an outgassing reduction process so as to decrease the chance of molecular contamination of the spacecraft instrumentation.
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PCI Expansion Card
4624-3
VECTOR Electronics and Technology, Inc.
120 contacts (60 each side) on 0.050" centers. Overall GND plane, Pad-Per-Hole, Peripheral Buses. Isolated pads around each hole. 32-bit ISA format. Universal tab fits both 3.3V and 5V tab notch patterns. Mounting bracket included.Peripheral buses for voltage and ground distribution.I/O mounting area for D-sub and ribbon cable connectors.
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Thermal Camera
The thermal camera allows real-time thermography with 100Hz frame rate via USB 2.0 interface. The camera is lightweight, compact and rugged (IP65). Measurement ranges of -20C to 100C, 0C to 250C, or 150C to 900C are selectable in software. Interchangeable lenses are available with 6x5, 23x17, 48x31 and 72x52 field of view.
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FlexRay Communications Expansion Kit
OP-SB88
The FlexRay communication is anticipated as a next-generation high-speed in-vehicle network.The OP-SB88 is an expansion kit that allows monitoring of FlexRay communications on up to two channels in real time. The kit incorporates a monitor function that does not require complicated parameter settings, and a simulation function with which the OP-SB88 works as a FlexRay communications node to transmit and receive data, thus powerfully supporting the initial development. The filter function and high-capacity memory greatly shorten the analysis time of trouble.
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Handheld Thermal Cameras
Handheld thermal cameras are designed for a variety of industrial applications. They are ergonomically designed which minimizes fatigue when used for long periods of time. This series of products use high-performance Vox infrared detectors for extensive temperature measurement range and accurate measurement data, suitable for professional analysis work.
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Thermal Monitoring System
The monitoring system for the thermal state of traction electric locomotive machines is designed for:control of the thermal state of traction electric motors (TED) as part of a high-speed traction-energy car-laboratory for testing rolling stock (TEL-C) in the acceptance and certification tests of electric locomotives;control of the thermal load of the TED and the temperature distribution by volume of the TED during the operational tests of electric locomotives;experimental determination of the most heated parts of the TED under different operating conditions;display of the current thermal state of the engine to the operator of the system;storing the thermal state data in the database for later playback.
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Marine Thermal Vision
Ocean Scout TK
As a thermal imager, the Ocean Scout TK creates images based on heat, not visible light. Vessels, watercraft, buoys, and other obstacles give off heat and appear clearly in all lighting conditions from pitch darkness to blinding sun glare.
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Expansion Peripherals
Expansion peripherals are used with data loggers to achieve many purposes, including the following: add additional channels, extend data communications networks, perform media conversions, read vibrating wire sensors, and build distributed measurement networks.
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Thermal Control Products
WinWay’s commitment to technology, quality and service ensures our interface solutions go above and beyond to exceed your expectations. Our products and services have a proven track record of delivering customer success in semiconductor testing. The Company offers comprehensive test interface solutions ranging from wafer-level test, package-level test to thermal management.
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CAN/LIN Communications Expansion Kit
OP-SB7FX
OP-SB7FX is the expansion kit which makes it possible to monitor, and simulate CAN and LIN communications. It enables monitoring of CAN and LIN data in any combination up to 2 channels at a time. Suitable for evaluation of mixed in-vehicle networks of CAN and LIN.
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Thermal Testing And Analysis
Response Dynamics Vibration Engineering, Inc.
We have consulted on thermal issues ranging from conduction issues in TECs, thermal radiation modeling, and countless air cooled system issues relating to system performance, vibration, and acoustics noise. We use a wide array of thermocouple instrumentation, thermal imaging, flow measurements, as well as finite element analysis and analytic modeling to measure, design, and debug thermal and related issues. We often work on customer products in our Response Dynamics lab where we characterize the system, engineer solution options, and prototype solutions. We then work with the customer to work the winning solution into their quality control and manufacturing process.
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Thermal Software
ThetaCalc
Thermal Engineering Associates, Inc.
A tool designed to provide a quick estimate of the temperature and thermal resistance from a heat source to a reference heat sink. It also shows the temperature and thermal resistance value of each layer in the heat flow path. The program can accomodate up to ten layers of different materials of varying dimensions between the heat source and sink. The heat spreading angle can be set independently for each layer to a value between 0 and 45 degrees; the tool will automatically determine if heat flow reaches the layer edge and then convert to columnar flow.
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Thermal Imaging Camera
IRT301
Wuhan JOHO Technology Co., Ltd
IRT301 Thermal Imaging CameraIRT301, a fixed-site thermal security camera lets you aware of intruders and other threats to your facility clearly in total darkness, smoke, mist and other harsh situation. It is compatible with a wide variety of third-party accessories, permit them easy to integrate. It enable to control and operation over digital and analog networks. With 384x288 pixel detector, it delivers high quality thermal image in any harsh environmental conditions, IRT301 is ideal for both indoor and outdoor surveillance, applications covered from industrial monitoring to city or boundary security monitoring. ApplicationBorder security and surveillanceRoad, channel, warehouse monitoringBuilding and industrial safety monitoringKey FeaturesRugged, waterproof and dustproof designHigh resolution, high frame rateAdvanced image processing technologyStandard interfaceVarious lenses and pan-tilt optionsTechnical specificationDetectorDetector MaterialUFPA microbolometer, AsiResolution384x288, 25mSpectral range8m~14mNETD80mK@30LensFocus
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Thermal Shroud
BC8-55/150C
When combined with a thermal conditioner such as the Bemco PCL3L-III or PCL3M-III, this shroud converts a 24 inch inside diameter by 30 inch high vacuum only vertical bell jar into a 19 inch inside diameter by 20 inch high thermal vacuum testing system. With a convenient clam shell door, test objects are easily loaded by simply raising the bell jar above the top of the door opening.
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Dual HDMI Input Expansion Card
FMC-HDMI
Sundance Multiprocessor Technology Ltd.
The FMC-HDMI extends FMC-compatible FPGA systems with two HDMI Type A input ports. It’s extremely useful for image or video processing applications. One of the ports features a fully-fledged HDMI 1.4 receiver with CEC, HDCP, audio, and 3D TV support. The other port provides cable equalization and buffering for HDMI signals, leaving the decoding up to the user.
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Thermal Profiler
KIC K2
The latest-generation mobile-friendly profiling technologyThe KIC K2 Thermal Profiler features a compact and robust design that allows it to fit through the tight, heated chambers of lead-free reflow ovens. A plug-and-play hardware and graphical user interface makes profiling both quick and easy. The profile data measured by the K2 can now be viewed on either a PC or on a mobile device using the Profile Viewer App.
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Analog Expansion Board
MSXB 014
The MSXB 014 Analog Expansion Board provides 4 additional analog outputs. Up to 16 Analog Output Expansion Boards can be connected to a single DAP for a total of 64 additional output channels.
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Thermal Management
Our air cooling components dissipating heat to the ambient air comprise high-performance heat sinks, general purpose DC fans and AC fans for forced air ventilation, as well as filter fans with exchangeable exhaust filter inserts that ensure clean and reliable air exchange in cabinets.
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Isolated Digital Expansion Board
MSXB 078
The Microstar Laboratories Isolated Digital Expansion Board, part number MSXB 078, provides isolated digital expansion for Data Acquisition Processor (DAP) systems. Use these boards to eliminate ground currents – a potential source of noise in your measurement and control signals – and eliminate timing errors from high-channel count digital I/O.
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TTL/I2C/SPI* Expansion Kit
OP-SB5GL
OP-SB5GL is the interface expansion kit that has a port to measure RS-232C(V.24) and a port to measure the TTL / CMOS signal level communications. The port for TTL / CMOS supports the measurement of TTL / CMOS level communications that power supply system is from 1.8V to 5V. It is suitable for monitoring the communications between the LSI and the interface IC on the printed circuit board by directly probing into the lines. It supports the protocol of not only UART and HDLC but also I2C and SPI* on monitoring and simulating.
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Thermal Conductivity Analyzer
TCi
The default C-Therm TCi Thermal Conductivity Analyzer employs the Modified Transient Plane Source (MTPS) technique in characterizing the thermal conductivity and effusivity of materials.
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PCI Express Expansion Backplane
SKU-076-0X
PCI Express Expansion backplane was designed as a universal solution for Desktop or Laptop host computer expansion. It allows adding up to four additional PCI Express boards to the host computer. Expansion backplane can be placed inside any general-purpose computer chassis, and connects to the host computer via 5ft (or 10ft) CAT6 cable.
