Alignment
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Product
Automated Mask Aligner with Integrated Mask Changer
Model 6000A-MC
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The Model 6000A-MC is a precision system combining OAI’s Model 6000, Automated Production Mask Aligner, with an integrated mask changer. The mask changer can handle from 10 to 150 masks. Ideal for both semiconductor and bio-tech applications. It also is designed with a bar code reader to assure each mask is coordinated to the right process. Please contact OAI for further product information.
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Product
FlexVNX+ 8-Slot Test And Development Platform Aligned To SOSA And VITA 90 Standards
39S08VPXZZY2VAND
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Elma’s all-new FlexVNX+ Test and Development chassis is the next generation portable test platform designed to accelerate development and test of VNX+ plug-in cards (PICs) aligned to The Open Group® SOSA™ Technical Standard and VITA 90.
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Product
3U OpenVPX SOSA™-aligned PWM Servo Motor Drive
68PW1
Servo Motor Drive
The 68PW1 is a 3U OpenVPX SOSA™-aligned (basis, Snapshot 2) single-axis PWM servo motor drive that can be configured with closed loop feedback measurement options including Hall, Resolver/Synchro or Encoder. The PWM drive provides programmable PWM output drive (up to 65 V @ 10 A continuous) from a single +28 VDC input source. Ideally suited for rugged Mil-Aero applications, the 68PW1 delivers off-the-shelf solutions that accelerate deployment of SWaP-optimized systems in air, land and sea applications.
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Product
SOSA Aligned LVDS with Optical I/O Kintex UltraScale FPGA - XMC
Model 71813
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- Jade Xilinx Kintex UltraScale FPGA Products and Navigator Design Suite Software Video- Jade Xilinx Kintex UltraScale FPGA Family Brochure- Supports Xilinx Kintex Ultrascale FPGAs- Supports the emerging SOSA™ Technical Standard- PCI Express (Gen. 1, 2 & 3) interface up to x8VITA 42.0 XMC compatible with switched fabric interfaces- Optional front panel optical interface- Ruggedized and conduction-cooled versions available- Please refer to the product datasheet for Installed FPGA IP Module details
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Product
725-Watt (270VDC input) DC/DC Converter, SOSA™ Aligned, 3U VPX
VPX57HS
DC Converter
NAI’s VPX57HS-31 is NAI's latest +270 VDC Input, VPX DC/DC Converter. The VPX57HS was developed in alignment of the SOSA™ Technical Standard and is capable of handling up to 725 Watts of output power. It plugs directly into a standard 3U VPX chassis with a VITA 62 1.0” power supply slot. This off-the-shelf solution for VITA 46.0 and VITA 65 systems is compatible with VPX specifications; supports all VITA standard I/O, signals, and features; and conforms to the VITA 62 mechanical and electrical requirements for modular power supplies.
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Product
3U 2-slot OpenVPX Backplane Aligned To SOSA™ - VITA 67.3c Aperture In Slot 2
1SVX302AMP-1X31
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Designed in alignment with SOSA, this 3U backplane offers 2 Plug-in Card (PIC) slots to support the DoD’s MOSA and CMOSS initiatives. The backplane supports high-speed signals on all data paths and VITA 67.3c aperture in slot 2.
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Product
7-Slot 3U OpenVPX Backplane Aligned To SOSA | 6 VITA 65 Slots + 1 VITA 62 PSU Slot
1SVX306AXX-XX31
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These six VITA 65 slots plus one VITA 62 slot (6+1) backplanes are designed in alignment with The Open Group® Sensor Open Systems Architecture™ Technical Reference Standard, or SOSA®.
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Product
MLA 150 Maskless Aligner
MLA 150
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The MLA 150 Maskless Aligner is poised to revolutionize photolithography by offering an advanced, fast, and flexible solution that replaces traditional photomask techniques. With its high-resolution capabilities providing sub-micron accuracy, this aligner is designed for efficiency, making it ideal for rapid prototyping, advanced research, and low to mid-volume production. By utilizing a two-dimensional spatial light modulator (SLM), the MLA 150 directly exposes the resist-coated wafer, facilitating an unmatched ease of use and operational performance. Its application spans various sectors including MEMS, micro-optics, sensors, and electronic components, highlighting its versatility and effectiveness in nanofabrication environments.
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Product
725-Watt (28VDC input) DC/DC Converter, SOSA™ Aligned, 3U VPX
VPX55HS
DC Converter
NAI’s VPX55HS-31 is NAI's latest +28 VDC Input, VPX DC/DC Converter. The VPX55HS was developed in alignment of the SOSA™ Technical Standard and is capable of handling up to 725 Watts of output power. It plugs directly into a standard 3U VPX chassis with a VITA 62 1.0” power supply slot. This off-the-shelf solution for VITA 46.0 and VITA 65 systems is compatible with VPX specifications; supports all VITA standard I/O, signals, and features; and conforms to the VITA 62 mechanical and electrical requirements for modular power supplies.
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Product
3U 12-Slot Development Platform Aligned To SOSA 1.0 And CMOSS
39E12WUX98Y2VCM0-SOSA1
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3U OpenVPX development platform aligned with SOSA 1.0. It supports both SOSA and CMOSS profiles. It includes: 2 I/O intensive SBC, 7 primary payload, 1 radial clock, 2 switch and 2 power. Includes VITA 67.3 RF and optical I/O modules.
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Product
Front & Backside, Semi-Automatic Mask Aligner
Model 800E
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The OAI Model 800E front and backside, semi-automatic mask aligner system offers advanced features and specifications found most often in costly automated production mask aligners. With the development of this mask aligner, OAI meets the growing challenge of the dynamic semiconductor and MEMS market with a new class of mask aligners that are engineered for R&D and low volume production.
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Product
AI Optimized 3U VPX Development Platform For GPUs Aligned To SOSA
39S06NWX94Y3VCC0-6AUP
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Accelerate battlefield AI development with Elma's 7-slot CompacFrame chassis. It features six 3U slots aligned to SOSA, with meshed GPU connectivity and SBC-to-GPU coupling for testing tactical edge applications from concept to field-ready solutions.
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Product
Automated Front & Backside Mask Aligner System
Model 6000
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With over 4 decades of manufacturing in the semiconductor industry, OAI meets the growing challenge of a dynamic market with an elite class of production photolithography equipment. Built on the proven OAI modular platform, the Model 6000 has front and backside alignment that is fully automated with a submicron printing capability as well as submicron top to bottom front side alignment accuracy which delivers performance that is unmatched at any price. Choose either topside or optional backside alignment which uses OAI’s customized advanced recognition pattern software. These Mask Aligners have OAI’s Advanced Beam Optics with better than ±3% uniformity and a throughput of 200 wafers per hour in first mask mode, which results in higher yields. The Series 6000 can handle a wide variety of wafers from thick and bonded substrates (up to 7000 microns), warped wafers (up to 7 mm-10mm), thin substrates (down to 100 micron thick), and thick photo resist.
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Product
Bare Fiber Aligner
1120
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The Photon Kinetics 1120 Bare Fiber Aligner makes it possible to reduce test setup time to seconds, thereby reducing overall testing cost. Just strip the fiber, scribe and break it (or use a more precise fiber cleaver, if desired) and then insert the prepared end into the 1120. In an instant, the fiber is coupled to your OTDR or chromatic dispersion test system with low optical loss and low reflectance. The 1120's compact, ergonomic industrial design is well-suited for low to moderate volume fiber and cable testing applications where automated fiber alignment systems are less economical. It is particularly useful as part of an in-process or finished cable test station employing either the 8000i or 8000 OTDR, and the OASYS.net OTDR Automation Software.
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Product
3U OpenVPX™ SOSA™-Aligned SBC with Intel® Core™ i7-1186GRE Processor (Tiger Lake)
68INT6
OpenVPX
The 68INT6 is a SOSA™-aligned 3U OpenVPX Intel® Core™ i7-1186GRE Processor / integrated PCH-LP (Tiger Lake) w/ 4 Cores & 12M Smart Cache running up to 2.8 GHz Single Board Computer that can be configured with up to two Smart I/O and communications function modules (w/ NAI-XMC configuration option). Ideally suited for rugged Mil-Aero applications, the 68INT6 delivers off-the-shelf solutions that accelerate deployment of SWaP-optimized systems in air, land and sea applications.
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Product
6-Slots 25Gb Backplane Aligned To SOSA, With VITA 67.3D Aperture In Switch Slot, With Apertures For VITA 66/67 Modules
1SVX306ACP-1X31
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6-slots 25Gb backplane aligned to SOSA, with VITA 67.3D aperture in switch slot, with apertures for VITA 66/67 modules
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Product
Large Substrate Mask Aligner
Model 6020
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The Model 6020 is a large substrate Production Mask Aligner or Auto-flood Exposure System for RDL First Level Advanced Packaging (PLP) and markets requiring exposure of large glass panels. It is engineered with OAI’s precision, reliability, and quality that is found in all of OAI’s products. The features include wedge effect leveling, superb process repeatability, ≤ 2.0µm printing resolution, and remote diagnostics. Using robotic handling, the system can stand alone or be fully integrated with photo resist processing.
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Product
SOSA Aligned Family Of Chassis Managers, VITA 46.11
79-V46-CHMC-x-CHMC-CMx-S1
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Designed to align with SOSA™, Elma’s VPX Chassis Manager assures the proper operation of the chassis and boards in defense embedded computing platforms. It monitors the health of the chassis, reports anomalies and takes actions when needed.
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Product
Tabletop Front & Backside Mask Aligner
Model 200IR
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The OAI Model 200IR Mask Aligner is a tabletop system that requires minimal clean room space. It is a cost-effective alternative for R&D or limited scale, pilot production. Utilizing an innovative, air bearing / vacuum chuck leveling system, the substrate is leveled quickly and gently, for parallel photo mask alignment and uniform contact across the wafer during contact exposure. The Model 200IR Mask Aligner is capable of one micron resolution and alignment precision. It has an alignment module which features mask insert sets and quick-change wafer chucks that enable the use of a variety of substrates and masks without requiring tools for reconfiguration. The alignment module incorporates micrometers for X, Y, and z-axis.
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Product
½ ATR For Deployable Applications Aligned To SOSA™
ATR-3600S
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ATR-3600S is an off-the-shelf half-ATR specifically designed for deployable applications requiring alignment with the SOSA Technical Standard. This six-slot chassis is mission-ready to accept SOSA aligned plug-in cards (PICs) and VITA 62 power supplies and is an ideal way to rapidly integrate a deployable platform leveraging the power of SOSA.
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Product
3U – 6U SOSA™ Aligned VPX Backplanes
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Using a modular concept based on open standards it is common practice in the civil sector to integrate subsystems components from different manufacturers into a single modular system. The SOSA™ Technical Standard aims at such an interoperability in embedded computing for military applications.
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Product
MORA Ready Development Platform: CompacFrame Integrated With SOSA Aligned PICs And Sciens Innovations Helux Core RF Tools
SE9M3PS9YIBXNLY
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The MORA-Ready Development Platform (MRDP) simplifies the process of creating RF signal processing capabilities and accelerates integration of existing applications. Featuring Sciens Innovations helux™ Core powerful software tools to accelerate RF signal generation and system development.
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Product
SOSA Aligned 1-Slot 3U VPX Development Chassis for Quartz Products
Model 8257A
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- Ideal development platform for Mercury's- Model 5553 8-Channel A/D & D/A Zynq UltraScale+ RFSoC Gen 3 - Processor - SOSA Aligned 3U VPX- Model 5550 8-Channel A/D & D/A Zynq UltraScale+ RFSoC Processor - SOSA Aligned 3U VPX- Access to data and control planes provided through RTM- 1-slot, small footprint development chassis- Rear panel access to RF I/O, 100 GigE and chassis manager- Supports VITA-67.3C- Compatible with the Quartz product family- Pentek's Quartz Family of Xilinx Zynq UltraScale+ RFSoC FPGA Products Video- Live Signal Acquisition Video: Quartz Model 5950 and Model 6001 RFSoC boards- Pipeline Newsletter: Strategies for Deploying Xilinx's Zync UltraScale+ RFSoC- Please refer to the product datasheet for Installed FPGA IP Module details
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Product
3U OpenVPX SOSA™-Aligned MFIO-Intensive Processing Board
68G6
Multifunction I/O
The 68G6 is a SOSA™-Aligned 3U OpenVPX board that can be configured with up to three NAI smart I/O and communication function modules. In addition to the standard expansion plane (EP) PCIe and control plane (CP) Ethernet control interfaces, the 68G6 facilitates convenient external access to supported NAI PCIe function modules through its 1 x1 PCIe interface, enabling seamless expansion of host SBC functions for enhanced project solutions, while also offering external access to supported NAI FMx modules via a SATA II interface. The 68G6 is on NAI’s certifiable product development roadmap supporting DO-178C and DO-254 design assurance guidelines for safety-critical applications. Ideally suited for rugged Mil-Aero applications, the 68G6 delivers off-the-shelf solutions that accelerate deployment of SWaP-optimized systems in air, land and sea applications.
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Product
High-Speed System Sync and Distribution Amplifier - SOSA Aligned 3U VPX
Model 5503
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- Supports Xilinx® Zynq® UltraScale+™ RFSoC FPGAs- Synchronizes up to 32 channels across four Quartz boards- Synchronizes sampling and data acquisition for multichannel systems- Provides single sample accurate synchronization between multiple channels and multiple boards- Synchronizes gating and triggering functions- Optional VITA 67.3D optical interface for backplane gigabit serial communication
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Product
IC-INT-VPX3l, SOSA™-Aligned 3U VPX Intel® Xeon® W SBC
IC-INT-VPX3l
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The IC-INT-VPX3l is a 3U VPX Single Board Computer based on the Intel® Xeon® W (code name Tiger Lake-H) processor and designed in alignment with the SOSA™ Technical Standard. This high-processing module is ideally suited for mil-aero applications and edge applications such as Mission Computer, Radar and Sonar HPEC.
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Product
3U 12-slot VPX Backplane Aligned To SOSA 1.0
1OVX312AFQ-xxxx
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3U 12-slot backplane with profiles aligned SOSA. It is designed to meet the U.S. Army’s C5ISR Modular Open Suite of Standards (CMOSS), and supports high-speed signals on all data paths and VITA 67.3 and VITA 66.5 connectors.
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Product
Type 39 CompacFrame Development Platform, 2 And 4 Slot 3U OpenVPX Aligned To SOSA
39S0xBWX9ZY2VCC0
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Elma’s CompacFrame is the next generation portable test platform designed to accelerate development and test of plug-in cards (PICs) aligned to the Open Group® SOSA™ Technical Standard. Accommodates up to 4-slot OpenVPX backplane.
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Product
MLA 300 Maskless Aligner
MLA 300
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The MLA 300 Maskless Aligner is engineered for high-volume production, delivering exceptional flexibility and precision in the realm of industrial lithography. This innovative tool supports wafers up to 300 x 300 mm and is capable of dynamically adjusting to surface variations, effectively eliminating the need for costly and time-consuming mask production. By employing direct data exposure instead of traditional masks, the MLA 300 provides advanced solutions for complex lithography challenges, including those encountered in advanced packaging, sensor calibration, and MEMS fabrication. With its high throughput of up to 18,000 mm²/min and resolution down to 1.5 μm, it streamlines workflows and integrates seamlessly with manufacturing execution systems (MES), making it the preferred choice for a broad range of applications like microfluidic devices and other cutting-edge technologies.
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Product
IPMI Controller & Software For VPX Systems Aligned With SOSA
IPMI-C-VP-S1 and 79-V48-3-IPMC-TB-S1
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Elma‘s VITA 46.11 Intelligent Platform Management Controller (IPMC) for VPX is a pre-programmed part and source-code package created to give designers a quick path to integrating VITA 46.11 system management functionality onto their board designs.





























