Ground Bond Testers
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Product
Protective Bonding Testers
RMO-E Series
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The RMO-E instruments are designed and ideal for testing protective bonding (grounding) of equipment following the standard IEC 61010-1. Also, they can measure the resistance of high, middle and low voltage circuit breakers, high-current bus bar joints, cable splices, and welding joints. The instruments accurately measure not only in factory environments but also in high-induction fields and substations.Both models generate a true DC ripple-free (less than 1 %) current with automatically regulated test ramps. During a test, the protective bonding testers automatically generate increasing current before measuring and decreasing current after the measurement. Consequently, this significantly decreases magnetic transients and ensures great accuracy.These instruments can store up to 500 measurements in the internal memory and have a built-in thermal printer available as an option.DV Win software communicates with the RMO-E earth resistance meter via USB or RS232 interface. It allows a user to run the test remotely from PC, as well as to download test results, analyze and generate fully configurable test reports.The RMO-E series contains two models, RMO60E and RMO100E. The main difference between these two models is in the maximal test current:60 A DC for RMO60E100 A DC for RMO100E
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PE/ Ground, Insulation Resistance Tester
Handheld
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The safety testers of the Handheld class are used to measure PE/ Ground resistances, insulation resistances and to perform a simple functional test. The small and sturdy universal testers are intended for standard-compliant safety tests in workshops and production as well as for mobile operation during repair, installation, service and more.
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Bond Inspection
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Increasingly thin wires, finer pitches, as well as more applications of thick wire for higher capacities are among the current trends in wire bonding. At the same time, the requirements for robust and defect-free bonds are increasing, for example in assistance systems in the automotive sector and in RF modules in the 5G mobile communications network. This makes reliable inspections extremely important.
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Scott Internal Bond Impact Tester
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The Scott Internal Bond Impact Tester is used to determine tear resistance (Elmendorf). A sample is torn with the help of the pendulum device starting from a predetermined cut. The work required for a tear of a given length is measured.
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Handheld Grounding Tester
HGT1
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The HGT1 is a handheld meter to measure ground impedance as well as step and touch voltages. Using the CPC 100 and CP CU1, test currents at variable frequencies can be fed into power cables or overhead lines safely to simulate a ground fault.
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Error Detector Remote Head 32 and 17 Gb/s
N4952A
Bit Error Rate Tester (BERT)
The N4952A is an affordable and compact error detector remote head available in 4 to 17 Gb/s and 5 to 32 Gb/s configurations. Compatible with the N4960A Serial BERT controller, it is the perfect solution to test up to 32 Gb/s per channel for 100 Gigabit Ethernet applications and other high-data rate devices. The N4952A error detector supports PRBS or user patterns and operates up to 32 Gb/s in a single band with no gaps or missing data rates. The remote head allows the test equipment to be located very close to the device under test, eliminating the need for long cables that degrade signal quality.
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Temporary Bonding Systems
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Temporary bonding is an essential process to offer mechanical support for thin or to-be-thinned wafers, important for 3D ICs, power devices and FoWLP wafers, as well as for handling fragile substrates like compound semiconductors. A device wafer is bonded to a carrier wafer with the help of an intermediate temporary bonding adhesive, allowing the typically fragile device wafer to be processed with additional mechanical support. After the critical processes, the wafer stack is debonded. EVG’s outstanding bonding know-how is reflected in its temporary bonding equipment, which has been provided by the company since 2001.
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Product
64 Gbaud High-performance BERT
M8040A
Bit Error Rate Tester (BERT)
The Keysight M8040A is a highly integrated BERT for physical layer characterization and compliance testing. With support for PAM-4 and NRZ signals and data rates up to 64 Gbaud (corresponds to 128 Gbit/s) it covers all flavors of 200 and 400 GbE standards.
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Below Ground Insulator Tester
CE-IT
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The CE-IT gives fast and accurate testing of below ground insulators and road crossing casings. This fully automatic unit tests the insulator without any adjustment by the operator needed.
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Earth Ground Testers
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TES Electrical Electronic Corp.
Capable of measuring earth voltage. Data hold function. Auto power off function. The timer operates automatically about 10 minutes with the "test button switch are pressed to keep the tester power on.
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Ground Strap Testers
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This precision Ground Strap Tester automatically measures the resistance of ground straps and clearly indicates whether or not the resistance is within the specified limits. Performs precision ground-strap resistance measurements, automatic upper/lower resistance tests. Ideal for both wrist straps and heel straps.
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Bond Tester for Wafers 2 - 12 inch
Sigma W12
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Bondtester for wafers or at wafer level 2” – 12” (up to 300 mm)Precise testing and Cold Bump Pull (CBP) testingLarge X/Y stages X: 600mm, Y: 370 mmForce range from 1gf – 10 kgfBump pitch down to 20 µm
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Product
Above Ground Insulator Tester / RF-IT
RF-IT
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Hand Held InstrumentEasily locates shorted bolts, replaces bolt to boltUse on structure with or without CPUses Radio Frequency to test effectiveness of above ground insulatorsAuto Shut-Off feature
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Earth Ground Testers
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Fluke''s family of earth ground testers have been built to address the entire spectrum of ground testing methods from the basic to the most advanced. Our testers have been designed to be accurate, safe and easy to use. We provide quick and precise resistance measurements through several test methods: 3- and 4-pole Fall-of-Potential testing, selective testing, stakeless testing and 2-pole testing. Detailed application information can be found at the Earth Ground Solution Center.
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Earth Bond Test Set
EC-12
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The Earth bond test is a basic safety test prescribed in many standards to test samples for the integrity of earthing continuity throughout the sample.
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Battery Ground Detector
BGD
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Battery Ground Detectors supply contact closures for alarm indications at precise ground fault resistance settings.
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AXIe M8000 Series of BER Testers
Bit Error Rate Tester (BERT)
Simplified time-efficient testing is essential when you are developing next-generation computer, consumer, or communication devices. The Keysight M8000 Series is the highly integrated BER test solution for physical layer characterization, validation, and compliance testing. With support for a wide range of data rates and standards, the M8000 Series provides accurate, reliable results that accelerate your insight into the performance margins of high-speed digital devices.
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Bonding Ohmeters
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bonding ohmmeter is an affordable, highly accurate, and intrinsically safe electrical bond tester. This meter is capable of performing bond measurements on a variety of components and metal-to-metal connections. The 620LK has been independently UL-913 certified, ensuring quality and safety at each step of manufacturing. Due to its safety certifications and high level of accuracy, the 620LK meter is the choice bond tester for many commercial airliners, while its sibling the 620UK-B is in countless USAF programs.
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Neutral Grounding Resistors
NGR
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Neutral Grounding Resistors (NGRs) are used to limit the fault current for safety of equipment and personnel in industrial systems.
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Ground Fault Monitors
IFT
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In most industrial settings, ground faults can cause significant damage. Since these leaks are unavoidable in almost all industrial environments, our ground fault monitors allow you to quickly and easily find the source of the leak before a major problem occurs and damages your equipment. The IFT-120 is designed to help you rapidly locate ground faults.
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Product
Ground Fault Finder
FST-JD200 DC
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Foresight Electronics Co., Ltd.
FST-JD200 not only can provide a solution on accurately testing the faults of the indirect-grounding of the direct current system, non-metal grounding, loop grounding, simultaneous grounding of the anode and cathode, balanced grounding of the anode and cathode and multi-point grounding 1.The high-precision sampling clamp meter The device uses a high resolution (0.1mA) signal sampling direct current clamp meter that can achieve multi-point grounding and high resistance ground point positioning...
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Fusion Bonded Cable Jumpers
Series 152FB
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Fusion Bonded Cable Jumpers. Aries Series 152FB Fusion Bonded Cable Jumpers are flexible...plug them directly into PC boards or sockets. Stranded wire conductors are fusion bonded with an overcoat of tin for easy soldering or socketing. Each jumper is shipped with protective tabs on both ends for maintaining proper conductor spacing.
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Ground Weather Analytics
HELIOS
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L3Harris Geospatial Solutions, Inc
Microclimates are on the rise, and as a result, there are extreme deviations of wind, snow, fog and visibility even over short distances. Organizations of all sizes need hyperlocal ground information and weather data to enhance operational efficiencies and make better decisions that can save time, money, property and even lives.
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Post Wire and Die Bond Inspection Machine
IV-E1700
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IV-E1700 is a post wire and die bond inspection machine that is known for having a proven, effective and patented 2D+3D Inspection system. This product is best used to weed out defects with data collection for process improvement and reports for SPC quality Control.
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Permanent Bonding Systems
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The introduction of EVG's wafer-bonding approach, which separates the bond alignment from the bonding step, immediately revolutionized the market. Utilizing high-contact forces under elevated temperatures and a controlled atmosphere, this novel approach is today's process standard, with EVG holding the dominant market share for both semi- and fully automated wafer bonders and a growing installed base of more than 1500 chambers. EVG's wafer bonders offer optimal total cost of ownership (TCO), as well as multiple design features to optimize bonding yield. Multiple modules for bond alignment are optimized for different market requirements in MEMS, 3D integration or advanced packaging. Industry-leading alignment accuracies of less than 100 nm and a high-volume-proven modular platform enables the combination of EVG’s wafer bonding technologies in various applications.
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Resistance Wire Bonding
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Electronic Systems of Wisconsin, Inc.
ESW's Resistance Wire Bonding System comes equipped with the latest features the market has to offer. Our system is capable of bonding armatures, stators or coils. The on-screen display in our bonder makes it easy to read, track, and record your bonding data. If desired, ESW offers complete electrical testing of the part prior to the bonding sequence as well. This ensures only good parts that have been electrically tested are processed through bonding. It is our duty to make sure you never have to worry about losing important information again. Our Sales and Engineering staff will work closely with you to make sure that a bonding systems will meet your needs. See the slideshow below to see some of our Resistance Wire Bonding Testers.
