Echo
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Product
Assesses Nodularity In Ductile Iron Cast Automotive Components
ECHOMAC® Velocity Measurement
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Variations in Nodularity, a type of graphite structure that can develop during the production process, can attenuate the velocity of sound waves passing through the automotive component being tested. Echomac VM measures the sound velocity and, using known limits, reports whether the part is acceptable.
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Product
Android Software
SonarMite 'Plus' App
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The SonarMite+ App is based on the free SonarMite App but offering additional features. The software is an Android App designed to work with the popular SonarMite Bluetooth Echo Sounder used in hydrographic surveying applications. With the demise of Hyperterminal as a standard terminal application the end user is left with little choice for a simple communications program with serial data devices. Connecting via Bluetooth is cleaner than USB cable, there are no wires and the connection is independent of baud rate and other serial port settings. Most terminal programs are not easily configured with commands to directly interface with instruments such as SonarMite.
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Product
Commercial Grade Image Intensifier Tubes
ECHO Series
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The commercial grade image intensifier tubes are used to amplify low light level images in a wide light spectrum for civil applications.Discover ECHO the high performance commercial image intensifier by Photonis. The ECHO technology is the commercial grade image intensififier tube by Photonis, offering two high performance grades to the commercial market for civilian users.ECHO image intensifier tubes serve many night vision applications for users that require good range and details at night andmaking them perfect for sport shooters, hunters, airsoft practioners and night vision enthusiasts.
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Product
Scanning Acoustic Microscope
Pulse2
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This industry-leading scanning acoustic microscope provides a universal inspection tool for packaged semiconductor development, production and failure analysis. With the ability to detect air defects as thin 0.05 micron and spatially resolve defects down to 10 microns, the ECHO is perfect for bump detection, stacked die (3D packaging) inspection, complex flip chip inspection and more traditional plastic packages.
