Showing results: 106 - 110 of 110 items found.
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HBM-S1-B -
High Power Pulse Instruments GmbH
*±6 kV Human-Body-Model (HBM) 2-pin tester according ANSI/ESDA/JEDEC JS-001 standard with C = 100 pF, R = 1.5 kΩ discharge network*True HBM: the classical discharge network of the HBM-S1-A according the standard ensures compliant waveforms for all load conditions*Optionally available upgrade for all HPPI TLP-3010C, 4010C, 8010A, and 8010C hardware systems and software (upgrade on request)*Suppression of trailing pulses*Integrated 10 kΩ charge removal resistor*Integrated DUT voltage and DUT current sensor for real time voltage and current monitoring*Integrated DC test DUT switchIntegrated hardware 50 Ω trigger output for high speed digital oscilloscopesIntegrated overvoltage protection of voltage sense and DC test interfaces for oscilloscope and SMU protection during high voltage HBM testing*Fast and efficient HBM measurements including transient waveform data management using the HPPI TLP software*Compact size 145 mm x 82.5 mm x 44 mm
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1024L1 -
Princeton Infrared Technologies, Inc.
The 1024L1 is a 1024x1 state of the art InGaAs linear array imager on 12.5 µm pitch that was built for both spectroscopy and machine vision in the short wave infrared band. The 1024L1-12.5-T is an advanced digital array with the lowest read noise available <110e- for a 250 μm tall pixel. Our new advanced SWIR On-chip Noise Suppression Circuit will enable some spectroscopic applications to see read noise levels <80e-. A single ROIC chip is used thus minimizing variation from output to output found on linear arrays with multiple ROICs. The chips have built in 14bit A/Ds that are designed for the system thus maximizing dynamic range and minimizing the noise while enabling 34k lines/s at 1024 elements. Multiple full well capacities from 75ke- to 100Me- with 128 steps are available to optimize the array for the signal levels. On chip optical pixel binning (where every other detector is disconnected from the ROIC thus signal is captured by neighboring pixels) is available by command to trade spectral resolution for increased signal level. Pixel skipping or binning is also available allowing for 48k lines/s at 512 resolution on the same imager.
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TLP-12010A -
High Power Pulse Instruments GmbH
- High pulse output current up to ±120 A (short circuit)- Ultra-fast 50 Ω high voltage pulse output with typical 300 ps rise time- Wafer, package and system level TLP and HMM testing- 180 kW peak output power into 50 Ω load- Built-in HMM pulse up to ±32 kV in 50 Ω-configuration- High speed 50 Ω trigger output for oscilloscopes (synchronous to high voltage pulse output)- 6 digital programmable pulse rise times out of: 300 ps to 50 ns (optional)- 1 built-in pulse width: 100 ns- Optional external pulse width extensions from 5 ns to 500 ns using the external pulse width extender TLP-12012A6- Built-in pulse reflection suppression- Fast measurement time, typically less than 0.2 s per pulse including one-point DC measurement between pulses- Efficient software for system control and waveform data management- The software can control automatic probers for fast measurements of complete wafers- Integrated interlock safety shut-down- Industrial isolated and EMI/ESD protected USB control interface
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VCO Series -
SignalCore, Inc.
The SC5510A and SC5511A are VCO-based, synthesized signal sources with very low phase noise and an amplitude control of 0.01 dB throughout its -30 dBm to +15 dBm output power range. By utilizing a unique multiple phase-locked loop architecture, phase spurs are kept below -70 dBc across the entire tuning range, even at 1 Hz step resolution. Download the data sheet to see how the impressive features and specifications of these modules make them stand out when compared to other small modular synthesizers. These 20 GHz signal sources include an additional, independent RF2 channel with a tunable frequency range from 100 MHz to 3 GHz and a tuning resolution of 25 MHz. The extra channel makes the modules suitable for either single-stage RF conversion systems or dual-stage image suppression up/down converter systems. Both modules make great general-purpose laboratory signal sources where demanding low phase noise and signal purity are required. They are both ideal choices as an integrated clock source for fast DAC and ADC applications, especially those that require variable sampling rates. Full implementation instructions, GUI, driver software, and example code are provided with each module.
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TLP-12010C -
High Power Pulse Instruments GmbH
- High pulse output current up to 120 A (short circuit)- Ultra-fast 50 Ω high voltage pulse output with typical rise time 100 ps (0 A to 40 A) and 300 ps in high-current mode (0 A to 120 A)- Wafer, package and system level TLP, VF-TLP and HMM testing- Up to 180 kW peak output power into 50 Ω load- Built-in HMM pulse up to ±32 kV in 50 Ω-configuration- High speed 50 Ω trigger output for oscilloscopes (synchronous to high voltage pulse output)- 6 USB programmable pulse rise times: 100 ps to 50 ns (custom selectable)- 8 (optional 9) programmable pulse widths: 0.5 ns (optional), 1 ns to 100 ns (0 A to 40 A), 1 built-in pulse width: 100 ns (>40 A)- The optional pulse width extender TLP-3011C enables pulse width up to 1.6 µs in 68 GPIB programmable steps (0 A to 40 A)- Optional external pulse width extensions from 5 ns to 500 ns (>40 A to 120 A)using the external pulse width extender TLP-12012A6- Built-in pulse reflection suppression- Fast measurement time, typically less than 0.2 s per pulse including one-point DC measurement between pulses- Efficient sofware for system control and waveform data management- The sofware can control automatic probers for fast measurements of complete wafers- Combines TLP-12010A and TLP-4010C into one system- Can be operated together with TLP-12012A6 and TLP-3011C pulse width extenders- Integrated interlock safety shut-down- Industrial isolated and EMI/ESD protected USB control interface
