Reflow
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Compact Reflow Checker
RCP-200
Unprecedented miniature size, high precision, stable, and well-reproducible temperature control of reflow furnace. Proprietary "Heat Resistant Micro Connector" makes it possible to measure at 6 points.
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Reflow / Wave Solder Process Dashboard
Vantage
Real-time dashboard for all reflow ovens in the factory. Accessible from all authorized PCs and mobile devices anywhere. KIC Vantage is a factory level Industry 4.0 smart factory system for reflow and cure data management and analytics. It truly does give you the best vantage, gaining insight into your reflow and cure processes throughout the factory.
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4-zone Full Convection SMT Reflow Oven
CR4000C
At just over 6 1/2 feet long, the CR4000C full-convection reflow oven fits production areas where floor space is tight without sacrificing performance. High-mass heating panels and high-speed blowers allow the oven to reach temperatures up to 300˚C for lead-free reflow.
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Datapaq Reflow Tracker System
Monitor the temperatures for every soldering application – including wave, reflow, vapor phase, selective and rework stations – in real-time with the Datapaq Reflow Tracker Systems. Ideal for the electronics manufacturing and semiconductor applications.
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8-Zone SMT Reflow Oven
CR8000
A combination of 8 independently controlled full-convection heating zones (16), 2 cooling zones, and low-velocity, low turbulence air flow allows the CR8000 reflow oven to provide you with thermal accuracy of ±1°C and a ΔT of ±2°C across PCB assemblies to 22" (570 mm) wide. This high-performance model takes up less floorspace than comparable alternatives on the market and offers a throughput that can keep pace with even high-volume production requirements.
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Pre-reflow AOI
Zenith LiTE
Minimizes Shadow Problems with 4way projectionEasy Programming with parametric approachReal time defect diagnosis and root cause removalrortified 2D features using 9 channel RGB lights100% 3D measurement inspection.
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Circuit Card Assembly
Teledyne Advanced Electronic Solutions assembles and tests a variety of complex circuit card assemblies (CCAs) using leading edge, advanced technology assembly automation. We specialize in low-volume, high-mix assembly of highly complex CCAs.- RF, analog, high-speed and digital circuits on rigid-flex and Cu core substrates- Typical lot sizes from 3 to 300 pieces- 4 high speed, flexible SMT lines- Production processes for components from 0201 chips to large grid-array components and connectors- 100% solder paste, automated optical, and x-ray inspection- Forced air convection reflow with inert atmosphere option- Special processes for RF assemblies (filters, shields, etc)- BGA underfill, conformal coating, etc.- Selective and wave solder pin-thru-hole processes- CCA and component bonding processes
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6-Zone SMT Reflow Oven
CR6000
A combination of high-mass heat sources and efficient thermal transfer allows the CR6000 to provide excellent reflow soldering results and throughput with a shorter-than-average heating tunnel. Your 6-zone unit also includes advanced features such as a wide combination pin-over-mesh belt conveyor, partnered pre-loaded KIC Auto Focus profile predictions software, and real-time thermal profiling standard.
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Measuring & Analysis Equipment
Quality management for semiconductor manufacturing processes and liquid crystal panel manufacturing processes, which require nano-order precision. Oxygen analyzers used in firing furnaces and N2 reflow ovens.Water quality meters used to monitor the water quality of plant discharge and the pure water used in semiconductor manufacturing processes.Our measuring and analysis equipment is used in a wide range of fields.
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Sensor
VL53L1
The VL53L1 is a state-of-art Time-of-Flight (ToF) laser-ranging miniature sensor. Housed in a miniature and reflowable package, it integrates a SPAD (Single Photon Avalanche Diodes) array, physical infrared filters and optics to achieve the best ranging performance in various ambient lighting conditions, with range of cover glass options.Unlike conventional IR sensors, VL53L1 uses ST’s latest generation direct ToF technology which allows absolute distance measurement whatever the target color and reflectance. It provides accurate ranging up to 4m and can work at fast speed (60Hz), which makes it the fastest miniature ToF sensor on the market.With patented algorithms and ingenious module construction, VL53L1 is also able to detect different objects within the Field-of-View with depth information (histogram) at 60Hz. Scene browsing and multi-zone detection is now possible with VL53L1, thanks to software customizable detection array for quicker “touch-to-focus” or mini depth-map use cases.
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Software
Interface Analysis
Surface-mount components warp during the reflow process, and the area where they attach also changes shape during assembly. This interface between components is where solder, paste, and gaps created due to thermal expansion combine to create 100% good products, or defects such as Head-in-Pillow, Shorts, and Opens. Fully understanding that critical interface between surfaces is more important than ever.
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Preconditioning
Preconditioning is performed prior to package level reliability testing to simulate the effects of board assembly on non-hermetic devices where moisture may have been absorbed during normal storage. The subsequent exposure to high temperature during infra reflow assembly can cause internal damage such as “pop corning” and delamination.
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Electronic Test & Measurement Equipment
We are known worldwide for the M.O.L.E. Temperature Profiler. The Mole is used in the Electronic, Paint, Food, and the Industrial marketplace. The Mole is a stand alone, 6 channel, temperature profiler that it is used in many harsh processes that require the temperature measuring instrument to be inside the heating chamber or "ride along" with the parts or process being measured over time such as Solder Reflow Ovens and Wave SolderMachines.
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Smart Optimization
A reflow oven or wave solder machine is capable of literally billions of alternative setups. Each combination of zone temperatures and conveyor speed will produce a unique profile for a processed product. KIC's software makes an exhaustive analysis of all the setups and it recommends the very best oven/machine recipe within seconds.
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Oven Performance Checker
OvenRIDER® NL 2+
Regardless of the recipe and what your oven's controls indicate, what your PCB actually experiences at board-level as it goes through the oven can be SIGNIFICANTLY different. Achieve convection reflow oven Verification by separating zonal temperatures from convective heat flow efficiency while verifying conveyor speed for a true picture of oven Lead-Free performance consistency.
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BGA SMT Adapters
Giga-snaP™
Giga-snaP™ 0.75, 0.8, 1.0, and 1.27mm pitch BGA Surface Mount Feet Adapter line of products provide an inexpensive and reliable method for attaching BGA chips to target board. The product line consists of patented female sockets with machined pins epoxy over-molded into an assembly that matches a particular BGA pattern. The epoxy over-molded female BGA socket is soldered to a PCB using standard soldering methods. A corresponding male pin BGA adapter, to which the user attaches their BGA chip, is plugged into the female socket on the board thus interconnecting the chip and the system is ready to go. The SMT adapters have the same solder ball types as the chips they are emulating. These adapters have less than half of the insertion force of competitive adapters, shorter electrical path for highest speed, and can be solder reflowed numerous times. A complete description and drawings of Giga-snaP™ 0.75, 0.8, 1.0, and 1.27mm pitch BGA Surface Mount Feet Adapters can be found at the tables shown below.
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Full 3D Inline Metrological & Imaging AOI
Metrological Full 3D AOI is achieved by measuring all 3 dimensions (X, Y and Height) to detect every measurable solder and component defect pre-reflow and/or post reflow soldering.
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PCBA & Bare Board Cleanliness Tester
Zero-Ion G3
For two decades, thousands of electronics assemblers have relied on the Zero-Ion cleanliness testing to verify the cleanliness of post-reflow printed circuit assemblies and bare boards. Over time, as PCB assemblies have become more complex and more densely populated with surface mount components, and as vigorous quality standards such as ISO, TQM and Six Sigma have become commonplace, the ability to meet—and confirm—cleanliness levels has grown in importance. The Zero-Ion ROSE tester has kept pace with customer requirements, and the Zero-Ion G3 is the most advanced Zero-Ion ever designed, capable of testing assemblies reflowed with any solder paste, including no clean—yet its also one of the most affordable cleanliness testers on the market as well, with performance and ease of use second to none.
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Precision Shunt Chip Resistors
SMV
*5W permanent power at 65C*High pulse power rating*Mounting: Reflow and wave-soldering
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Polymer Aluminum
SP-Cap™
Panasonic Industrial Devices Sales Company of America
Panasonic’s industry leading SP-Cap™ Polymer Aluminum Capacitors, are Surface-Mount (SMT) Capacitors that utilize a conductive polymer as their electrolyte material in a layered aluminum design. SP-Cap Capacitors are primarily used as input and output Capacitors for DC/DC converters due to ultra-low ESR values, high voltage options and the ability to withstand high reflow temperatures. These Capacitors are free from temperature drifts, offering capacitance values up to 560µF and voltage values ranging from 2V to 25V.
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High Carbon Process Carrier Pallets
Composite Family
High Strength, high temperature, semiconductive composite board designed for use as circuit board and flex circuit carrying pallets for solder reflow ovens.
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Reflow Soldering Machines
Shenzhen Leadsmt Technology Co.,Ltd
Used to attach surface-mount components to printed circuit boards (PCBs). It involves applying solder paste to specific locations on a PCB, placing the components on the paste, and then heating the assembly in a reflow oven.
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Reflow Simulator
SRS-1C
Reproduce the temperature profile of Reflow oven. Can observe the melting state of solder paste.
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Grypper G35 / G40
*Package-size PCB footprint: Since the PCB footprint of Grypper is identical to the package, only one PCB design is required, enabling a seamless transition from test and validation through production and reducing overall cost of test*Low insertion force: Unique contact design reduces the insertion force required to insert and retain higher-ball-count packages safely and securely within the test socket*Oxide cutting wipe action: The contact design wipes the side of the solder ball during insertion, breaking through solder oxides ensuring a good electrical connection between contact and solder ball*Signal integrity: A short signal path achieves low inductance and low insertion loss, providing a nearly invisible electrical connection*Test socket has solder balls attached: The G40 contacts have solder balls reflowed onto the contacts to ensure reliable solder volume at the PCB to test socket solder interface.
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10-Zone SMT Reflow Oven
CR10000
10 fully controlled upper and lower convection heating zones allow the CR10000 SMT reflow oven to provide you with a thermal accuracy of ±1˚C. Manncorp’s low-velocity, low-turbulence air flow options produce an even ΔT of ±2°C across PCB assemblies out to 22” (570 mm) wide edge-to-edge backed by throughput that can still keep pace with your high-volume production needs.
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SMT AOI
All MVP products have the unique ability to be deployed in all inspection scenarios from Paste to Post Reflow without changing hardware, allowing maximum utilization of your investment. With Versa, Selecta, Spectra and GEM Platforms, MVP provides the AOI solutions to meet your production requirements.
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Surface Mount Package Emulation
SMT Adapters
Ironwood’s SMT package emulation adapters are often called “surface mount feet” or “emulator bases”. These adapters provide access and interconnections to surface mount lands. Typically, the adapters are soldered to the target board in place of the IC device and provide a pluggable array of pins interface for sockets, probing adapters, package converters, and even board-to-board connections. These adapters are often utilized as a base for many of our probing adapter products. We constantly innovate to provide the most reliable, cost effective interfaces available. For example, many of our PLCC, QFP and SOIC emulation bases use our proprietary shaped solder techniques, replacing expensive, and often fragile, J-lead and Gull Wing leads. Shaped solder parts are easily fluxed and reflowed onto the target system. Our emulator bases can present either a male or female interface at 1.27mm or 1mm or 0.8mm pitch gold plated array pins for pluggable connection.
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Surface Mount Reed Relays from Pickering Electronics
Pickering Electronics Surface Mount Reed Relays contain the highest quality instrumentation grade reed switches making them suitable for the most demanding applications and are suitable for infra-red or vapor phase reflow soldering.
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5-Zone Lead-Free Convection Reflow Oven Includes Pin-Over-Mesh-Belt Conveyor
CR5000
The CR5000 full-convection reflow oven provides consistent, quality performance, low ΔTs across every board, and mid-volume throughput, all in a compact, floor-space-saving footprint. The oven also provides flexibility and easy setup and changeover, thanks to the generously sized pin-edge and mesh belt conveyors, easy to use oven management software, and easy profile setup with the included KIC Auto Focus profile prediction software.
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OM Thermal Stress System
Conductor Analysis Technologies, Inc
The OM Thermal Stress System is a cost-effective performance based reliability test methodology which performs convection reflow assembly simulation and air-to-air thermal cycling. The methodology is utilized by both the IPC PCQR and the IPC 6012-QLM programs. OM systems are available for sale or lease, and test services are provided from both CAT and our service partners.
