Intel
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Intel® SDM Small
Intel® SDM Small is 60 mm x 100 mm with a maximum thickness of 20 mm, so it can easily slot into ultra-slim displays that require minimal space with maximum performance.
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Intel Xeon E3 Processor AMC, PCIe Gen3
AMC756
The AMC756 is a Processor AMC (PrAMC) in a single module, mid-size AdvancedMC (AMC) form factor based on the Intel® Xeon® Processor E3-1505M v6 (Kaby Lake) with CM238 PCH. The processor base frequency is 3.0 GHz with max turbo frequency of 4.0 GHz. The module follows the AMC.1, AMC.2 and the AMC.3 specifications.
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Intel Xeon E3 Processor AMC, PCIe Gen3
AMC758
The AMC758 is a Processor AMC (PrAMC) in a double module, mid-size AdvancedMC (AMC) form factor based on the Intel® Xeon® Processor E3-1505M v6 (Kaby Lake) with CM238 PCH. The processor base frequency is 3.0 GHz with max turbo frequency of 4.0 GHz. The module follows the AMC.1, AMC.2 and the AMC.3 specifications.
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Intel® SDM Large
Intel® SDM Large measures just 175 x 100 mm and a maximum z-height of 1.6 mm, which is well-suited for ultra slim displays. The Intel® SDM–L is optimized for digital signage, interactive flat panel displays, interactive touch computers, video walls, etc.
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COM Express Basic Size Type 6 Module with 11th Gen Intel® Core™, Intel® Xeon® and Intel® Celeron® Processors
Express-TL
ADLINK’s Express-TL COM Express Type 6 Basic size module is based on the 11th Gen Intel® Core™, Xeon® W and Celeron® 6000 processor, and is the first COM Express module to support PCI Express x16 Gen4, effectively doubling the bandwidth of previous generation COM Express modules. With a combined 8 cores, 16 threads, and up to 128GB memory, the Express-TL brings uncompromised system performance and responsiveness to your solution. Featuring brand new Gen 12 Intel® UHD Graphics and Intel® AVX-512 Vector Neural Network Instructions (VNNI), the Express-TL provides AI inferencing performance as much as 3X higher compared to previous generation non-VNNI platforms. The integrated Gen 12 Intel® UHD Graphics core can be configured to support one 8K independent display or four 4K independent displays (HDMI/DP/eDP). In addition, legacy display interfaces such as LVDS and analog VGA are still supported as build options. Key features for today’s applications are support for 2.5 GbE and USB 3.2 with transfer rates of up to 10Gb/s that can transfer image data from cameras faster than previous generation products. Combined with 8 processor cores at 25W TDP, Intel® AVX-512 VNNI, Intel® OpenVINO™ toolkit and Intel® UHD Graphics, the Express-TL is well suited for AI at the edge applications (AIoT/IoT).
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Intel 186 EB & EC Processor Boards
MS 1503
- ATE- Data Acquisition System- Process Control- Industrial Automation
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COM Express® Basic Size Type 2 Module with 6th Gen Intel Core™, Intel Xeon® and Intel Celeron® Processors (formerly codename: Sky Lake-H)
Express-SL2
ADLINK announces a new COM Express Type 2 Computer-on-Module, based on the highly popular Intel® Core processors (formerly codenamed Skylake and Kaby Lake). The Express-SL2/KL2 supports all type 2 related legacy I/O and thereby allows customers to extend the production life of existing type 2 based systems for at least another 10 years.
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High Performance Intel Mission Computer
ComSys-5363
The ComSys-5362 is a rugged COTS mission computer. A server grade Intel Core™ i7-7820EQ Xeon E3 CPU supports signal processing for critical applications. Highly configurable, application-specific I/O. Removable drive bay for two 2.5“ SSDs.
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Industrial Mini-ITX Motherboard With Intel® N97 Processor
AmITX-ALN
- Intel Alder Lake N SoC processors, N97- Single channel DDR4 3200 MHz memory up to 32 GB- Triple independent display: HDMI 2.0b, DP 1.4a (from Type C), VGA, LVDS or eDP- Dual GbE ports: 2x 2.5GbE- Expansion slots: 1x PCIe Gen3 x1, 1x USB 3.2 Gen2 Type C, 4x USB 3.2 Gen1, 6x USB 2.0, 1x M.2 B-key, 1x M.2 E-key, 1x M.2 M-key- 12 to 28V DC-in
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Qseven Module With Intel® Atom® X5 And X7 Processors
Q7M310
*Intel® Atom® x5 and x7 processor (Apollo Lake)*8GB DDR3L memory onboard*4 lanes of PCI Express slot*2 SATA-600*2 USB 3.0 and 4 USB 2.0
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MXM 3.1 Type A based on Intel® Arc™ GPU
MXM-AXe
Integrating Intel’s latest line of powerful, discrete graphics — Intel® Arc™ — ADLINK introduces its MXM-AXe, one of the industry’s first MXM (R3.1) Type A discrete GPU modules. Packing hardware ray tracing, AI acceleration, and support for 4x 4K displays, the module enhances responsiveness, precision, and reliability for graphics-demanding, time-sensitive edge applications in commercial gaming, healthcare, media processing, and transportation. ADLINK MXM-AXe provides up to 8 hardware ray-tracing cores, 128 execution units, 4GB GDDR6, and 8x PCIe Gen4 at maximum 35W TGP and the industry’s first full AV1 hardware encoding.
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PC/104-Plus SBC with Intel E3800 CPU
ARIES
The Aries PC/104-Plus single board computer from Diamond Systems uses the Intel “Bay Trail” E3800 series processor to deliver an unmatched combination of performance, price and power consumption. Packed with real-world features, Aries provides a complete solution for most embedded applications in a single board, saving you space, time, and money.
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Open Pluggable Specification (OPS) Digital Signage Player With LGA1151 Socket 7th/6th Gen Intel® Core™ I7/i5/i3 & Celeron® Processor And Intel® H110
OPS500-501-H
The OPS500-501-H is an OPS compliant digital signage player supporting dual displays with 4K at 60Hz resolution. The smart cableless open pluggable digital signage module is powered by the latest 7th/6th generation Intel® Core™ and Celeron® processors (codename: Skylake) with the Intel® H110 chipset, providing outstanding performance at a lower cost. It supports LGA1151 socket-type CPUs to offer greater flexibility for CPU selection. In addition, the OPS signage module has one 260-pin DDR4-2133 SO-DIMM socket with up to 16 GB memory capacity. The high-performance OPS500-501-H is a perfect solution for multi-display applications in airport information board, shopping mall, corporate, education, hospitality, religious organization, bank, retail store, restaurant, performing art center, and many more.
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COM Express Basic Size Type 7 Module with Intel Atom® C3000 SoC
Express-DN7
The Express-DN7 is a COM Express® COM.0 R3.0 Basic Size Type 7 module supporting the 64-bit Intel Atom® C3000 processor (formerly “Denverton-NS”) system-on-chip (SoC). 16 CPU cores with 31W TDP and integrated 10G Ethernet make the Express-DN7 especially suited for customers who need excellent computing performance with low power consumption, such as edge computing applications, in a long product life solution.
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Mini-ITX SBC With LGA1150 Socket 4th Gen Intel® Core™ Processor, Intel® H81, HDMI/VGA/LVDS, Dual LANs And USB 3.0
MANO881
The MANO881 Mini-ITX motherboard with Intel® H81 Express chipset supports the 4th generation Intel® Core™ and Celeron® (Haswell) processors. This feature-rich Industrial SBC has two sockets for DDR3 system memory of up to 16 GB. The high-performance mini-ITX motherboard MANO881 supports one PCIe x16 slot and integrated with Intel® HD 5000 graphics supports powerful graphic processing and dual-display capability through HDMI, VGA and LVDS interfaces. The outstanding embedded board also includes rich I/O expansions which can help system integrators to develop solutions quickly at a more competitive price. The MANO881 is excellent for in-vehicle PCs, medical imaging and gaming devices, in-flight entertainment systems, industrial automation systems, and other portable devices.
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3U Intel® Celeron® 2000E 2.2GHz Processor-Based PXI Controller
PXI-3930
The ADLINK PXI-3930 PXI embedded controller, based on the Intel® Celeron® 2000E 2.2GHz processor matches superior performance with an unprecedented price point. Specifically conceived for hybrid PXI-based testing systems, the ADLINK PXI-3930 delivers a rugged and stable platform for a wide variety of testing and measurement applications.
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Single/Dual Intel® Movidius™ Myriad™ X MA2485 embedded VPU Module
EDL-mPCIe-MA2485
The EDL-mPCIe-MA2485 PCIe mini-card features Intel® Movidius™ Myriad™ X VPU, providing an easy and flexible solution for computer vision and deep learning acceleration. Able to solve complex AI hardware design challenges, it enables integration of vision-based accelerators and inference engines to implement deep learning solutions at the edge.
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3U CompactPCI Serial 9th Gen Intel Xeon®/Core™ i7 Processor Blade
cPCI-A3525 Series
CompactPCI® Serial (PICMG CPCI-S.0) is a new modular computer standard officially adopted by PICMG in 2011. The CompactPCI Serial standard defines a completely new connector to support high-speed serial interfaces including PCI Express, SATA, USB and Ethernet. A CompactPCI Serial backplane has six high-speed connectors P1 to P6 on the system slot but only P1 is mandatory on peripheral slots, P2 to P6 being optional. A CompactPCI Serial system can comprise a total of nine blades (one system blade and eight peripheral I/O blades) through an Ethernet full mesh or single star architecture. The CompactPCI® Serial standard is the next-generation of the CompactPCI® specification and provides more flexibility and higher speed and bandwidth in modular system solutions.
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COM Express Type 6 Basic Module With Intel® Xeon® And 6th Gen Intel® Core™ I7/i5/i3 Processor, Intel® CM236/QM170/HM170
CEM500
The CEM500, a COM Express Type 6 basic module, is based on the 14 nm Intel® Xeon® processor E3-1505M v5 and 6th generation Intel® Core™ i7/i5/i3 processor (codename: Skylake-H) with Intel® CM236/QM170/HM170 chipset. The outstanding Intel® Gen 9 HD Graphics enables the CEM500 driving multiple 4K displays without the need of a discrete graphics card. Two DDR4-2133 SO-DIMM supporting up to 32 GB system memory capacity and four SATA-600 with RAID 0, 1, 5, and 10 are available. Additionally, the rugged COM Express computer-on-module Type 6 supports an industrial operating temperature range of -40°C to 85°C for applications in extreme harsh environment. With its full solid, outstanding computing performance and low power consumption design, the CEM500 is targeted at telecommunication, medical imaging, digital signage, gaming machines, military, human machine interface, industrial automation controllers and IIoT applications.
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Intel® Xeon™ D SoC (Skylake-D), PCIe Gen3 And Dual 40GbE, 6U VPX
VPX762
The VPX762 is a processor module (VITA 46) for general purpose processing in demanding applications. Based on the Intel Xeon D-2183IT or D-2143IT processor, the efficient SoC design has low power consumption and integrated PCH technology.
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Powerful 4th Generation Intel® Core™ i7 Processor-Based Fanless Embedded Computer
MXE-5400
ADLINK’s new Matrix MXE-5400 series of rugged designed quad-core fanless computers, featuring the latest 4th generation Intel® Core™ i7-4700EQ processor (Formerly Haswell) delivers outstanding processor performance with minimum power consumption. Intel’s Quick Sync Technology and Core IPG equip the MXE-5400 with market-leading performance boost in image/video related applications.
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COM Express Type 6 Compact Module With 7th Gen Intel® Core™ & Celeron® Processor
CEM511
The CEM511, a new COM Express Type 6 Compact form factor module, is powered by the latest 7th generation Intel® Core™ i7/i5/i3 processor (Kabylake-U) for high-performance applications. The palm-sized CEM511 is packed with a variety of rich features including low power consumption, industrial wide temperature range support and impressive graphic processing capability. The COM Express® Type 6 Compact module supports two DDR4-2133 SO-DIMM sockets with a maximum system memory capacity of up to 32GB. It has a rugged design with an extended operating temperature range from -40°C to +85°C (-40°F to +185°F) to satisfy different harsh environment demands. The system on module also delivers outstanding computing, graphics and media performance through its Intel® Gen 9 graphics engine, DirectX 12.0, OCL 2.0, OGL4.3 features and 4K resolution (4096 x 2160 @ 30 Hz) support. Therefore, the power efficient CEM511 is designed for graphics-intensive applications over the Industrial IoT, including industrial control system, medical imaging, digital signage, gaming machines, military, and networking.
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Extreme Rugged PC/104 Single Board Computer with Intel® Atom™ Processor System-on-Chip
CM1-BT1
The CMx-BTx is a PC/104-based, Single Board Computer (SBC), fully compliant with the PCI-104 Specification, Version 1.1 and partially compliant with the PC/104 Specification, Version 2.6. PC/104 SBCs are very compact and highly integrated computers. This SBC features the 22nm, Intel® Bay Trail SoC. The board provides a DDR3L SO-DIMM socket, a PC/104 connector, a PCI-104 connector, two USB 2.0 ports, one USB 3.0 port, up to two Gigabit Ethernet ports, up to two SATA 3 Gb/s ports, one dedicated HD-Audio panel connector, one VGA port, one LVDS port, up to four COM ports, one mini-PCIe slot (with one USB 2.0 port included). The CMx-BTx can be run with only 5 volts and is capable of running operating systems like DOS, Windows XP/7/8 in either 32-bit or 64-bit configuration, Linux, VxWorks, and others. Another feature included on the board is a fail safe BIOS that enables the user to start the module even if the original BIOS is corrupted.
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IC-3171, 1.9 GHz Intel Celeron Dual-Core Processor, 4-GigE Port, 2-USB 3.0 Port Industrial Controller
784963-01
The IC‑3171 is a high-performance, fanless industrial controller for developers who require a high level of processing power and connectivity for automation and control applications in extreme environments. The IC‑3171 provides connectivity for communication and synchronization to EtherCAT and Ethernet CompactRIO chassis, EtherCAT motion drives, GigE Vision and USB3 Vision cameras, and other automation equipment. In addition, this controller has onboard isolated, TTL, and differential digital I/O, so it can perform synchronization and control tasks without additional tethered I/O.
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SMARC Short Size Module, Intel® Atom® X7000 Series (Amston Lake) Processors
LEC-ASL
The ADLINK LEC-ASL is a SMARC module that supports 2/4/8 cores Intel® Atom® x7000RE (x7211RE, x7213RE, x7433RE, x7835RE) and x7000C (x7203C, x7405C, x7809C) Processors (formerly Amston Lake) with integrated Intel® UHD graphics and high-speed interfaces. LEC-ASL modules support up 16GB LPDDR5 memory, up to 256GB eMMC storage (build option) and are also available with rugged operating temperature range and low power envelope, making them a perfect match for mission critical fanless edge computing applications that run 24/7.
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Intel® Xeon™ SoC, PCIe Gen3 And 10GbE (XAUI), 6U VPX
VPX752
The VPX752 is a processor module (VITA 46) for general purpose processing in demanding applications. Based on the Intel 5th generation Xeon-D processor, the efficient SoC design has low power consumption and integrated PCH technology.
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Fanless Robotic Controller with Intel® Xeon®/Core™ Processor
ROScube-I
ADLINK ROScube-I is a real-time ROS 2 enabled robotic controller based on Intel® Xeon® 9th Gen Intel® Core™ i7/i3 and 8th Gen Intel® Core™ i5 processors featuring exceptional I/O connectivity supporting a wide variety of sensors and actuators for unlimited robotic applications. Also supported are Intel® VPU and NVIDIA GPU cards for computation of AI algorithms and inference. The extension box allows for convenient functional and performance expansion. ROScube-I supports the full complement of resources developed with ADLINK Neuron SDK, a perfect platform for development of industrial use service robotic applications such as autonomous mobile robots (AMR) and autonomous mobile industrial robots (AMIR).
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Intel® Movidius™ Myriad™-Based Industrial AI Smart Camera for the Edge
NEON-1000-MDX Series
ADLINK's NEON-1000 Series of industrial smart cameras supports the Intel® Movidius™ Myriad™ X VPU and a range of image sensors, providing users the flexibility to handle a wide variety of applications.
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3.5” Embedded SBC With 4th/5th Generation Intel® Core™ I7/i5/i3 & Celeron® Processor, Intel® HM86 (Intel® QM87 Optional), LVDS/ VGA/Dual HDMI,Dual LANs And Audio
CAPA881
The CAPA881 3.5-inch embedded board supports the 22nm 4th generation Intel® Core™ i7/i5/i3 processors (codename: Haswell) with Intel® HM86 or Intel® QM87 chipset (optional). The 3.5-inch single board computer comes with a DDR3L SO-DIMM socket up to 8 GB. The highly integrated 3.5-inch embedded board features high performance, graphics, power efficiency, security, and remote management capabilities (Intel® AMT), making it ideal for a broad range of intelligent systems such as embedded applications, gaming, DSA, DVR, IoT/M2M-related, network computing, and many more.
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Pico-ITX SBC With Intel® Pentium® Processor N4200 & Celeron® Processor N3350, HDMI/LVDS And LAN
PICO312
The PICO312 is a palm-sized fanless pico-ITX motherboard built with the latest 14 nm Intel® Pentium® processor N4200 or Celeron® processor N3350 (codename: Apollo Lake SoC). One 204-pin DDR3L-1867 SO-DIMM socket supports system memory up to 8GB. The tiny 2.5” pico-ITX embedded board features Intel® Gen9 graphics engine bringing a true high definition visual experience with dual display configurations through one LVDS and HDMI. In addition, it was designed for special needs of fanless operation under temperature from -20°C to +70°C. The PICO312 features a full-sized PCI Express Mini Card slot in support of mSATA and a pair of expansion connectors with additional signals including one PCIe x1 lane, one LPC, one DDI, four USB 3.0 ports, one SMBus and one HD audio, giving this SBC high expandability to meet all requirements.
