Product

Connector, 104-Pin D-Type Female, Solder Bucket, 5A, 4-40 UNC Screwlocks

C104DFR-2SB-1A

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Pickering Interfaces Inc.

C104DFR-2SB-1A - Pickering Interfaces Inc.

This 104-pin female D-type connector allows users to create their own cable assemblies. Cable connection is via solder buckets - supplied with rear cable entry backshell. This connector is suitable for use with Pickering modules that use the 104-pin D-type connector.

Product

Replacement Solder Tip Lead Set for D410/D610

Dx10-SI

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Teledyne LeCroy

Dx10-SI - Teledyne LeCroy

- Choice of 4 GHz or 6 GHz bandwidth models- Up to 5 Vpk-pk dynamic range with low noise- ±3 V offset range- Low loading and high impedance for minimal signal disturbance- Ideal for DDR2, DDR3, LPDDR2- Deluxe soft carrying case- Innovative QuickLink architecture- Wide variety of tips and leads-- Solder-In Lead-- Optional Positioner (Browser) Tip-- Quick Connect Lead-- Square Pin Lead-- HiTemp Solder-In Lead

Product

Selective Wave Soldering Optical Inspection Machine

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Landrex Technologies Co., Ltd.

Landrex Technologies Co., Ltd.

Selective Wave Soldering Optical Inspection Machine

Product

Solder Wettability Tester

5200ZC

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Rhesca Co., Ltd.

5200ZC - Rhesca Co., Ltd.

The current machine (5200TN) was developed as a comprehensive machine that covers solderability test standards around the world, but we have added a high cost performance machine to the lineup that has realized the request of "single function + low price", which many people who are using the successive machines of SAT2000-5000-5100 type.

Product

Ball Rebound Resilience Tester

UI-FT95

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Unuo Instruments

UI-FT95 - Unuo Instruments

Ball Rebound Resilience Tester is used to test foam resilience by vertically dropping a steel ball on foam from required height.

Product

LVDT Displacement Sensors With Ball Swivel Heads

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INELTA Sensorsysteme GmbH & Co. KG

INELTA Sensorsysteme GmbH & Co. KG

This LVDT Series is made for a rough, industrial use. The housing having a diameter of 20mm is fastened "floating" to the application using two ball swivel heads. There is a diversity of displacements up to 200m possible.

Product

Ball Pressure Test

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Premier Electrosystems

Premier Electrosystems

Premier Electrosystems' Ball Pressure Test is used to determine dimensional stability under stress at elevated temperatures. It analyses the relationship between the degree of deformation and the temperature when the test specimen is subjected to a constant load.

Product

Replacement Solder tip lead set for D420/D620

Dx20-SI

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Teledyne LeCroy

Dx20-SI - Teledyne LeCroy

- Choice of 4 GHz or 6 GHz bandwidth models- Up to 5 Vpk-pk dynamic range with low noise- ±3 V offset range- Low loading and high impedance for minimal signal disturbance- Ideal for DDR2, DDR3, LPDDR2- Deluxe soft carrying case- Innovative QuickLink architecture- Wide variety of tips and leads-- Solder-In Lead-- Optional Positioner (Browser) Tip-- Quick Connect Lead-- Square Pin Lead-- HiTemp Solder-In Lead

Product

Ball Pressure Test Apparatus

CX-Q03

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Shenzhen Chuangxin Instruments Co., Ltd.

CX-Q03 - Shenzhen Chuangxin Instruments Co., Ltd.

The Ball Pressure Apparatus is used to check the integrity of dielectric materials by exerting 20N force. The BPA10 is called out in IEC 60335, 60950, 61010, UL, CSA and European Norms. It is used to check the integrity of dielectric materials by exerting 20N force. The Ball Pressure Apparatus is made of stainless steel for long life. Since accelerated life procedures are used for this oven test, more than one apparatus may be useful for parallel testing.

Product

Replacement Solder Tip Leadset for Use with D420/620

Dx20-SI-HiTEMP

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Teledyne LeCroy

Dx20-SI-HiTEMP - Teledyne LeCroy

The 90 cm HiTemp cables and Solder-In lead can be used for controlled situations where the differential amplifier module needs to be removed from the extreme temperature environment. Ideally suited for testing scenarios where the temperature can fluctuate from -40 °C to +105 °C.