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Humidity Sensors
digital humidity sensor with integrated temperature sensor that provides excellent measurement accuracy at very low power. The device measures humidity based on a novel capacitive sensor. The humidity and temperature sensors are factory calibrated. The innovative WLCSP (Wafer Level Chip Scale Package) simplifies board design with the use of an ultra-compact package. The sensing element of the HDC1008 is placed on the bottom part of the device, which makes the HDC1008 more robust against dirt, dust, and other environmental contaminants. The HDC1008 is functional within the full 40C to +125C temperature range.
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High Parallel Test Handlers
High parallelism test in strip or singulated device batch handling on carriers, WLCSP post singulation test.
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Serial EEPROM
STMicroelectronics is the world's #1 supplier of Serial EEPROM thanks to development of leading-edge technology, recognized product robustness and high manufacturing capacity. ST focuses on the availability of the complete portfolio with short lead times, high flexibility in volume and worldwide distribution through selected partners. ST's comprehensive portfolio offers reliable SPI, I2C and Microwire products in SO8N, TSSOP8, DFN2X3, DFN5, WLCSP and bare die packages.
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Probe Cards
These cards are compatible with WLCSP and can be customized according to pin positions. They can be used for a pitch of up to 180 μm. We are developing a product for a pitch of 150 μm, to be compatible with narrower pitches.
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HDMI/DVI Transmitters
HDMI® transmitters and DVI transmitters remain in high demand in many professional, consumer, and automotive video applications. Analog Devices’ diverse solutions offer competitive advantages such as automotive qualification, low power, and small packages (3.4 mm × 3.4 mm WLCSP). Our range of HDMI/DVI transmitters provide conversion of a range of formats such as HDMI, MIPI, and TTL to HDMI video data. Typical applications include set-top boxes, video distribution, and digital cameras. In these applications, Analog Devices’ HDMI transmitters and DVI transmitters offer proven interoperability over years of implementation into many products. Our HDMI parts also support HDCP for encrypted content protection.
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Futureproof Your Control PLD And Bridging Designs
MachXO3
*Up to 9400 LUTs with up to 384 I/O pins*Instant-on 1 ms boot-up with background upgrade, Hitless I/O reconfigure and dual-boot error recovery*Available with 3.3/2.5 V core or low power 1.2 V core – including additional options on 9400 LUT devices*MachXO3LF includes programmable Flash and User Flash Memory (UFM)*Available in amazingly small (2.50 x 2.50 mm, 0.4 mm pitch) WLCSP packages and BGA packages with 0.50 mm and 0.80 mm pitch
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Open Top BGA Sockets
Ironwood has the most comprehensive collection of open top BGA and QFN sockets that can be used for qualification application, silicon FIB testing, system development, thermal characterization, burn-in application, etc. IC socket can be defined as an electromechanical device, which provides removable interface between IC package and system circuit board with minimal effect on signal integrity. Typical packages include BGA, LGA, QFN, QFP, WLCSP, etc. Open top allows access to the top side of IC. Below is an example BGA socket that uses low cost elastomer contact technology.
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Low Power FPGA Featuring Hardened MIPI D-PHY, LVDS, SLVS, SubLVDS, & Open LDI Bridging
CrossLink
*Two 4-lane MIPI D-PHY transceivers at 6 Gbps per PHY*15 programmable source synchronous I/O pairs for camera and display interfacing*Available in amazingly small 2.46 mm x 2.46 mm WLCSP packages and BGA packages with 0.4 mm, 0.5 mm and 0.65 mm pitch
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WLCSP Probe Heads
Smiths Interconnect offers Wafer Level Chip Scale Package (WLCSP) Probe Heads utilizing spring probe technology which provide high parallelism in test, superior signal integrity and high speed / RF testing capability.
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MEMS And Sensor Test Automation Platform
Sense+
Sense+™ ultra-precise MEMS & sensor test automation platform allows for significant improvement in test accuracy, parallelism for a lower cost of test, and the ability to handle and inspect, small delicate sensors. Fully configured, Sense+ delivers a one-pass automated test, inspection, and metrology for the most complex MEMS devices including <1 mm WLCSP.
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Fine Pitch Probes
Fine pitch probes are spring contact probes with pitches between 0.10 / 4mil and 1.00mm / 40mil.In this pitch, direct soldering and the use of mounting receptacles is usually no longer possible. Therefore, almost all fine pitch probes are designed as double-sided spring-loaded contact probes. Fine pitch probes are installed in corresponding test sockets, which enable exact contacting of the test points. Feinmetall fine pitch probes are suitable for common components such as BGA, LGA, QFP, QFN or WLCSP. Precision and 100% quality control characterize these probes.In smaller pitches of 60 – 300µm, carrier needles (beams) are also used.
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Wafer Probe Heads
WLCSP test is the applying final test conditions at Wafer Level. WLCSP testing is driven in lowering the cost of test of devices through economical methods of manufacturing and testing.
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Probe Head
cViper
cViper™ is an ultra-fine pitch probe head for RF and high speed digital WLCSP. cViper is ideal for lab and large volume production test for precision analog, RF, sensors and mobility devices. Low loop inductance and high bandwidth up to 27 GHz, cViper offers low and stable contact resistance for singulated devices or wafer-level test. A variety of contact materials to optimize performance are available with device pitch down to 100 µm.
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Film Frame Test Handler
4170-IH
High throughput ・High withstand load, and high thrust table ・Expansion of the strip attachment area ：260(L) X 300(W) [Withinφ300mm for WLCSP]・LOT control by barcode/2D code reader ・Easy device type exchange only test socket and display screen setting・Auto-cleaning function unit is installed to clean the socket at any desired timing.・8/12 inches ring conversion ・S2/S8 regulation compliance・SEMI G85 compliance・SECS/GEM compliance
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Packaging Manufacturing
KLA’s extensive portfolio of packaging solutions accelerates the manufacturing process for outsourced semiconductor assembly and test (OSAT) providers, device manufacturers and foundries for a wide range of packaging applications. Innovations in advanced packaging, such as 2.5D/3D IC integration using through silicon vias (TSVs), wafer-level chip scale packaging (WLCSP), fan-out wafer-level packaging (FOWLP) and heterogeneous integration as well as a wide range of IC substrates create new and evolving process requirements. KLA offers systems for packaging inspection, metrology, die sorting and data analytics focused on meeting quality standards and increasing yield before and after singulation. SPTS provides a broad range of etch and deposition process solutions for advanced packaging applications. Orbotech offers a portfolio of technologies that includes automated optical inspection (AOI), automated optical shaping (AOS), direct imaging (DI), UV laser drilling, inkjet/additive printing and software solutions to ensure manufacture of the highest quality of IC substrates.
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Test Contactor/WLCSP Probe Head
ACE
ACE™ test sockets offer optimal RF performance for fine pitch FBGA, QFN and wafer-level packages for Power Amplifiers, RF switches and mobile communications. Supporting pitches down to 0.4 mm, ACE features an innovative design that provides superior performance, improved yields and power efficiency.ACE probe heads deliver exceptional electrical performance, both DC and RF. Manufactured from HyperCore™ base material, a proprietary material of Cohu’s Everett Charles Technologies, ACE probes have the electrical properties of BeCu with the non-oxidizing properties of a precious metal. The short signal path, sharp tips, and large contact area between plungers provide high current conductance and reliable contact with less force.
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High-Throughput Film Frame Handler
MCT FH-1200
FH-1200™ film frame test handler is designed to handle leadless devices mounted on film frame, such as QFN, DFN, WLCSP, BGA, µBGA and eWLB packages. The FH-1200 enables high parallelism testing of post-saw IC devices at ambient temperature. It can accommodate 200 mm and 300 mm wafer rings and custom shapes onto which multiple strips can be mounted. No change kits are required regardless of package size (if same frame is used).
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Test Contactor/Probe HEad
cRacer
The cRacer™ test contactor and probe head portfolio offer solutions for 5G mmWave FR2 up to 54+ GHz.cRacer utilizes robust spring probe technology for testing singulated packages or probe heads for wafer probe (bumped/pad) applications with fine pitch and WLCSP compatibility – ranging from 100 µm to 650 µm, covering the majority of 5G devices.cRacer features a stainless-steel spring for tri-temp testing and performance in operating temperatures -55°C to +155°C.
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Flexible Test And Scan Solution For FFC Devices
Ismeca NY32W
32-position turret test and scan platform for semiconductors on film-frame wafer media, providing the highest inspection yield for WLCSP and Bare Dies. Integrating innovative hardware and software technologies such as intelligent features that enable extended autonomous operation and productivity.
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Test Contactor/Probe Head
Atlas
QuadTech™ probe solution with cruciform tip strength that stands up to lateral force without bending, plus an enhanced compliance window to accommodate package stack height tolerance.Atlas™ test contactor offers electrical performance that allows the customer to test to the true performance of the device. Atlas WLCSP test contactors achieve mechanical reliability with a rigid “cruciform” tip applied to Cohu’s QuadTech flat probe technology. The Atlas offers a short electrical path, with lower capacitance and inductance, that is ideal for functional and AC parametric testing of WLCSP devices that require high system bandwidth and throughput gains in large multisite test applications.
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Mems-Based Probe Cards
MEMSFlex
Nidec SV Probe proprietary MEMSFlex™ Probes are a perfect complement to our probe card technologies, ideal for many advanced testing applications including Flip Chip, WLCSP, Solder Bump, CuPillar and Pad. Featuring a fine 3D MEMS coil spring and electro-formed Ni-pipe, these probes are manufactured using a continuous, automated, manufacturing process, we can support a wide array of custom pin pitches within a short cycle. Other features include:
