Showing results: 136 - 138 of 138 items found.
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NEX LS -
Applied Rigaku Technologies, Inc
Featuring advanced third generation EDXRF technology, the Rigaku NEX LS represents the next evolution of scanning multi-element process coatings analyzers for web or coil applications. To deliver superior analytical performance and reliability, the EDXRF measuring head assembly was derived from the established Rigaku NEX Series high-resolution benchtop instrumentation. With this proven technology, the Rigaku NEX LS delivers rapid, non-destructive, multi-element analyses — for coat weight, coating thickness and/or composition — for elements from aluminum (Al) through uranium (U). The measuring head is mounted on a rigid beam and is equipped with a linear traversing mechanism positioned over a roller so that the head-to-surface distance is constant. Common applications include silicone release coaters, converters, denesting Si for vacuum-formed plastics, RoHS compliance, conversion coatings, metalized plastic, top coatings on metal coil and fire retardants on fabric.
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MTI Instruments
MTI Instruments'' semiconductor wafer metrology tools consist of a complete line of wafer measurement systems for virtually any material including Silicon wafer (Si), Gallium Arsenide wafer (GaAs), Germanium wafer (Ge) and Indium Phosphide wafer (InP). From manual to semi-automated wafer inspection systems, the Proforma line of wafer metrology inspection tools is ideal for wafer thickness, wafer bow, wafer warp, resistivity, site and global flatness measurement. Our proprietary push/pull capacitance probes provide outstanding accuracy throughout their large measurement range, allowing measurement of highly warped wafers and stacked wafers. MTII''s solar metrology tools include off line manual systems for wafer thickness and Total Thickness Variation (TTV), as well as, in-process measurement systems capable of measuring wafer thickness, TTV and wafer bow at the speed of 5 wafers/second.
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ASTM D882 -
National Technical Systems
This test method covers the determination of tensile properties of plastics in the form of thin sheeting and films (less than 1.0 mm (0.04 in.) in thickness). Film is defined in Terminology D883 as an optional term for sheeting having a nominal thickness no greater than 0.25 mm (0.010 in.). Tensile properties of plastics 1.0 mm (0.04 in.) or greater in thickness shall be determined according to Test Method D638. This test method can be used to test all plastics within the thickness range described and the capacity of the machine employed. Specimen extension can be measured by grip separation, extension indicators, or displacement of gage marks. The procedure for determining the tensile modulus of elasticity is included at one strain rate. The modulus determination is generally based on the use of grip separation as a measure of extension; however, the desirability of using extensometers, is recognized and provision for the use of such instrumentation is incorporated in the procedure. Test data obtained by this test method is relevant and appropriate for use in engineering design. The values stated in SI units are to be regarded as the standard. The values in parentheses are provided for information only. This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.
