Showing results: 31 - 45 of 79 items found.
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PMC-CIV-COM-ISO -
ALPHI Technology Corporation
User Programmable AlteraCyclone IV FPGA 484 BGA:• Stand alone possibility• Single wide PMC Module• 20 LVDS,2 RS-422,1 RS-232• Optional User clock oscillator
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PMC-CycloneII-64LVTTL -
ALPHI Technology Corporation
User Programmable Altera Cyclone II FPGA 672 BGA, EP2C35, EP2C50, EP2C70, Stand alone possibility, Single wide PMC Module, 64 LVTL, Optional User clock oscillator
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Ironwood Electronics
- Pluggable BGA adapter system (Giga-snaP™) – Surface mount package emulators – Package convertors & Fix adapters – Prototype, probe & analysis adapters – Receptacles, extenders, rotators and socket plugs– Electronic modules
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Ironwood Electronics
Ironwood Electronics Grypper Y contact is design to work with BGA devices with solder balls/bumps with no equator or small exposure where the standard Grypper cannot reliably hold on to the solder ball. The Y shape, working with the sliding lid, allows reliable contact and ensures device retention in high vibration application. Lower forces, <25 grams, makes insertion easier too and the less aggressive contacting allows 40+ insertions of the same device. The Sliding Lid can be configured to include heat sinking. The Y contact designs cover BGA devices from 0.35mm pitch and larger and the short electrical length has superior electrical performance.
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Royce Instruments
Royce bond testing systems can handle a variety of testing applications including wire bond pull testing, wire bond ball shear testing, BGA ball shear testing, die shear testing, and high speed ball shear testing.
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RW1210 -
Manncorp
Safely and precisely rework SMD, BGA, or LED chips. This all-in-one solution covers rework needs for even the most complex, densely populated PCBAs. Yet it is easy to use, enabling technicians to quickly master delicate alignment, placement, and heating controls.
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RTX-113HV -
Glenbrook Technologies
A high performance real-time X-ray inspection system designed for inspection of multi-layer, assembled printed circuit boards, with dense metal BGAs, and recommended for lead free inspection requirements. Our RTX-113HV system meets all your needs for inspecting BGA packages.
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Star-Rec -
W.M. Hague Company
Test entire HDI panel at once, or step & repeat in the "feed" direction. Fastest BGA Strip test system available. Star-Rec comes standard with: * loader * board cleaner * CCD Camera Alignment * electrical test section * fail and pass re-stackers * Board Marker
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X-eye 6300 -
SEC Co., Ltd.
Automatically inspects the defects of products in customer's line with high-speed 3D CT tomography.Able to inspect every defects of Double-sided PCBA & BGA mounted components precisely by solving overlapped X-ray image issue.Inspection speed of 3 sec/1FOV from loading to automatic Good/NG judgement.
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TTV -
Thermal Engineering Associates, Inc.
Using the TTC-1002 Thermal Test Chip as a basis, TEA offers TTVs in flip-chip, bare die, BGA packages for a variety of thermal simulation, reliability, qualification, heat sink characterization, and TIM characterization activities. Selective unused balls are sequentially connected together for daisy-chain applications.
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MS-1000 -
Micro Square Co., Ltd.
The MS-1000 is a highly portable microscope for exclusive use with BGA, CSP, and QFP. It is highly efficient in inspecting portions which cannot be inspected by the X-ray inspection method.Specifically, it is efficient for inspecting the following conditions: fillets of soldered balls, melted condition of soldered parts, cracks, defective soldering, etc.
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Arcadia Test
Board stress analysis is an increasingly critical part of the test fixture build process today. Probe densities under BGA devices put tremendous pressure onto the solder joints of these devices. If the fixture is not designed properly, immediate damage can occur to the BGA’s, or even more devastating, future damage, which creates field failures. We can provide strain testing before shipping your fixture to insure that there are not excessive forces placed on your BGA parts. With the use of National Instruments Strain equipment, and tri-directional rosettes, we cycle test the board/fixture and measure and record the amount of strain from each corner of each BGA. Any over limit conditions are corrected before shipment. This service insures that your products will not be damaged at ICT, and help to reduce field failures from damaged components, compromised solder joints, or lifted pads.
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TopJTAG Probe -
TopJTAG
TopJTAG Probe is an easy-to-use boundary-scan (IEEE 1149.1 JTAG) based software for hardware debugging. The software allows to view and control pin states of the devices in a JTAG chain. TopJTAG Probe can be of invaluable help to monitor/control pins of fine-pitch and BGA chips and to check PCB interconnects for shorts and opens.
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CrossLink -
Lattice Semiconductor
*Two 4-lane MIPI D-PHY transceivers at 6 Gbps per PHY*15 programmable source synchronous I/O pairs for camera and display interfacing*Available in amazingly small 2.46 mm x 2.46 mm WLCSP packages and BGA packages with 0.4 mm, 0.5 mm and 0.65 mm pitch
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Quadra 3 -
Nordson Corporation
Quadra™ 3 is your partner for high quality X-ray inspection for production line quality control. Detect a wide range of manufacturing defects including BGA, QFN and IGBT attachment, PTH filling, interfacial voiding, component cracking and counterfeit device screening. High quality, high magnification inspection for product applications.