Interposers Specifications

LGA - Ardent Concepts, Inc.

Molded 1mm Pitch BGA Sockets using Connect-R™ technology are available off the shelf to meet your immediate needs. These durable multi-GHz BGA socket solutions offer low loss compression mount connection for processors, FPGAs, ASIC, MMICS and other high performance devices. Ardent BGA Sockets can be modified for any package size up to 50mm x 50mm with short lead times. RC Connect-R BGA Sockets & LGA Interposers are perfect for RF applications with temperature excursions and can stand up to the most demanding environmental factors. Hardware options are available for a variety of temperature control and mounting configurations.