HenergySolar
A PV (photovoltaic) module and solar cell manufacturer.
- 008621-56185657
- 4006-048-365-607
- sales@henergysolar.com
- #16 GuangHua Road
TongZhou Industry Distric, Beijing
China
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Product
Sapphire/SIC Wafer Flatness and Surface Appearance System
FM200
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Sapphire/SIC wafer flatness and surface appearance system provide a previous surface flatness testing solution, though non-contract lighting testing to record the whole information of the surface, rapid and fast measurement for various of surfaces, line and all kinds of surface information.
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Product
Quick Silicon Discriminator
HS-QSD
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HS-QSD Quick Silicon Discriminator is specially designed for silicon sorting，it can quickly test the silicon type, heavy-dopedt, and can be widely used in all kinds of silicon sorting, like granular polysilicon material, break semiconduct silicon wafer, chunk material, top and tail material and so on. With the three probes, it could show type and heavy type simultaneously, strongly improved the sorting efficiency.
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Product
Semiconductor Large Range Type Tester
HS-PSTT
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HS-PSTT large Range Type Tester is a high-grade semiconductor material Type testing equipment,has the feature that testing large range,special suitable for testing the high-Resistivity Silicon Material(contains Silicon Core, phosphorus stick, Boron stick and so on),the resistivity require range is 0.0001～19999Ω·cm, Covers all measurement requirements of various silicon material type testing at the semiconductor and solar energy level at present .
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Product
Automatic Online Flatness and Surface Appearance System
UltraSort200
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The UltraSort continues our 25 year tradition of providing metrology solutions to semiconductor wafer manufacturers. Designed for volume wafer production, this automated system offers superior performance in rapid, repeatable, accurate, noncontact qualification of silicon and alternative substrate wafers.
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Product
Large Range Resistivity Tester
HS-SFRT
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HS-SFRT silicon filament resistivity tester is an advanced silicon cylinder resistivity tester, which can measure silicon filament, silicon phosphorus ingot, silicon boron ingot, seed crystal and so on. As it eliminates Peltier effect, Seebeck effect, minority carrier inject effect and so on, So it improve the accuracy greatly. The testing resistivity ranges from 0.0005Ω·cm to 50000Ω·cm. It is accurate, stable and convenient and a good friend to Siemens polysilicon material producer, SH4 polysilicon material producer, UMG polysilicon material producer and so on.
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Product
Minority Carrier Lifetime Tester
HS-CLT
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HS-CLT Minority Carrier Lifetime Tester has strong functions. It can not only measure carrier lifetime of wafer but also silicon ingot, silicon filament,silicon phosphorus ingot,silicon boron ingot, seed crystal and other irregular shape silicon material.The minority carrier testing ranges from 1μs to 6000μs, the minimum resistivity is 0.1Ω.cm, (can be extensive to 0.01Ω.cm). Dynamic curve monitoring in the whole process.
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Product
Sapphire 3D Microscope
WDI-2000
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The Sapphire 3D Microscope: HS-WDI-2000 was designed with high quality lighting parts and a good optical system design,can get a very clear image.with the digital camera,it can provide the image in time, widely used in LED,Solar,SEMI…
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Product
Surface Quality Measurement System
SQM-500W
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SQM-500 Surface quality Measurement system is used for the surface cleanness testing and analyze of sample. SQM provide a quantitative analysis of the cleanness of the surface, which was the first announced by us. The system can be used to non-contract detect the contamination of the surface and provide an accurate result immediately. The result can provide a powerful and real data for analyze, which is the insurance for the quality.
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Product
Wafer Defect observing instrument
HS-WDI
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Application■Semiconductor wafer■Solar wafer■Solar Cell■Thin-film Cell
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Product
Non-Contact Mapping Life Time System
MWR-2S-3
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The device is designed for express non-destructive contactless local measurement of non-equilibrium charge carrier effective lifetime in silicon substrates, epi-wafers and solar cells at different stages of manufacturing cycle. It can be used for incoming and outcoming inspection of silicon ingots and wafers, tuning and periodic inspection of semiconductor and solar cell technology quality. Lifetime determination is based on measuring photoconductivity decay after pulselight photo-exciting with usage of reflected microwave as a probe.
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Product
QE System
PVE300
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The PVE300 system is a monolithic,turnkey solution for photovoltaic material and device characterization;a key component in research, or as part of a production-line quality process.
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Product
Semi-Automatic Contactless Wafer Detector
NCS-200SA
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Semi-Automatically, non-contact measurement of wafer thickness, TTV ,bow,Point and flatness.Portable and easy to set-up, the Proforma 300/G measures all wafer materials including Silicon, Gallium-Arsenide, Indium-Phosphide and wafers mounted to sapphire or tape.the powerful software can test all the data above within several seconds,all the design according to SEMI standard and the ASTM,make sure the data can be easily unify. the system can used for several sample size,like 75 mm, 100 mm, 125 mm, 150 mm, 200 mm
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Product
Saw Mark Tester
SRT-301
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SRT-301 Saw Mark Tester is used to Measure Line-mark depth of the wafer surface,it has the advantages such. As easy carried, Conveniently operated Liquid crystal display, energy conservation and so on, At the same time,it has the built-in printer and rechargeable batteries , All design are up to the standards of JIS,DIN,ISO,ANSI.
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Product
Silicon O/C Content Tester
OCT-2000
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Manual, non-contact measurement of wafer thickness, TTV and bow. Portable and easy to set-up, the Proforma 300/G measures all wafer materials including Silicon, Gallium-Arsenide, Indium-Phosphide and wafers mounted to sapphire or tape.
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Product
Minority Carrier Life Time System
MWR-SIM
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MWR-SIM Lifetime determination is based on measuring photoconductivity decay after pulselight photo-exciting with usage of reflected microwave as probe.It enables repetition and contactless of measurement and does not require specialsurface treatment before measurement or wafer cutting.
