EV Group
EV Group (EVG) provides innovative process solutions and expertise that serve leading-edge and future semiconductor designs and chip integration schemes.
- +43 7712 5311 0
- Sales@EVGroup.com
- DI Erich Thallner Strasse 1
St.Florian am Inn, A-4782
Australia
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Product
Temporary Bonding Systems
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Temporary bonding is an essential process to offer mechanical support for thin or to-be-thinned wafers, important for 3D ICs, power devices and FoWLP wafers, as well as for handling fragile substrates like compound semiconductors. A device wafer is bonded to a carrier wafer with the help of an intermediate temporary bonding adhesive, allowing the typically fragile device wafer to be processed with additional mechanical support. After the critical processes, the wafer stack is debonded. EVG’s outstanding bonding know-how is reflected in its temporary bonding equipment, which has been provided by the company since 2001.
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Product
Bonding
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With our extensive experience in designing and manufacturing precision wafer bonding equipment, EVG is well recognized for setting industry standards in wafer bonding. EVG wafer bonding systems can be configured for R&D, pilot-line or high-volume production, and for any direct or interlayer-based bonding process, including sophisticated low-temperature covalent bonding. With this portfolio of technologies and equipment, EVG addresses markets for advanced packaging and 3D integration, MEMS, as well as advanced compound semiconductor and SOI substrates, holding the leading position and dominant market share.
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Product
UV-NIL / SmartNIL® Systems
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EV Group provides a complete product line for UV-based nanoimprint lithography (UV-NIL), including different single-step imprinting systems, large-area imprinters as well as step-and-repeat systems for efficient master fabrication. Besides soft UV-NIL, EVG offers its proprietary SmartNIL technology with multiple-use polymer stamp technology. The efficient and robust SmartNIL process provides high pattern fidelity, highly uniform patterned layers and minimum residual layers, combined with easy scalability in wafer size and production volume. EVG´s SmartNIL redeems the long-term promise of nanoimprinting being a high-performance, low-cost and volume-capable manufacturing technology for mass production of micro- and nanoscale structures.
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Product
Lithography
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EVG’s key competencies in lithographic technology lie in the high-throughput contact and proximity exposure capabilities of its mask aligners and its newly developed, revolutionary and highly versatile maskless exposure lithography systems. These capabilities are complemented by its resist coating and resist development systems with advanced in-house process competences and hands-on development skills.
