EV Group
EV Group (EVG) provides innovative process solutions and expertise that serve leading-edge and future semiconductor designs and chip integration schemes.
- +43 7712 5311 0
- Sales@EVGroup.com
- DI Erich Thallner Strasse 1
St.Florian am Inn, A-4782
Australia
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Product
Resist Processing Systems
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The EVG100 series resist processing systems establish new standards in quality and flexibility for photoresist coating and developing. Designed to provide the widest range of process variations, the EVG100 series’ modularity offers spin and spray coating, developing, bake and chill modules to suit individual production requirements. These systems accommodate the processing of an extensive range of materials such as positive and negative resists, polyimides, double-sided coating of thin resist layers, high viscosity resists, and edge protection coatings. These systems can handle more than one substrate size, from 2" to 300 mm diameter, rectangle, square or even irregular shaped substrates, with no or very short tooling time. This allows the development of new devices or processes on an industrial level, which not only requires high flexibility but also controlled and repeatable processing. EVG has built up many years of spin and spray coating experience for demanding applications and incorporates this knowledge into the EVG100 series, where our process know-how can be leveraged to support our customers.
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Product
Die-To-Wafer Bonding Systems
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Several different D2W bonding methods are available and selected depending upon the application and customer requirements. In direct placement D2W (DP-D2W) bonding, the singulated dies are bonded to the target wafer one by one using a pick-and-place flip-chip bonder. Plasma activation and cleaning of the surfaces of the dies on the handler wafer are essential steps for establishing a high-yielding bond and electrical interface between the dies and target wafer. This is where the EVG320 D2W activation system comes in.
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Product
Automated Measurement System
EVG®40NT
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The EVG40 NT (stand-alone tool) and the AVM (HVM-integrated module) enable measurement of lithography relevant parameters like critical dimension, as well as bond alignment accuracy.Because of the high-measurement accuracy, it is possible to verify compliance to tight process specifications and instantly optimize integrated process parameters.
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Product
Layer Release Systems
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EVG's IR LayerRelease Technology is a fully front-end-compatible layer release technology that features an infrared (IR) laser that can pass through silicon, which is transparent to the IR laser wavelength. Coupled with the use of specially formulated inorganic layers, this technology enables an IR laser-initiated release of any ultra-thin film or layer from silicon carriers with nanometer precision.
