EV Group
EV Group (EVG) provides innovative process solutions and expertise that serve leading-edge and future semiconductor designs and chip integration schemes.
- +43 7712 5311 0
- Sales@EVGroup.com
- DI Erich Thallner Strasse 1
St.Florian am Inn, A-4782
Australia
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Product
Hot Embossing Systems
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EV Group’s series of high-precision hot embossing systems are based on the company’s market-leading wafer bonding technology. Excellent pressure and temperature control as well as uniformity over large areas allow for high accuracy imprints. Hot embossing is a cost-effective and flexible fabrication technology with very high replication accuracy for feature sizes down to 50 nm. The systems are well suited for embossing complex micro- and nanostructures and high-aspect ratio features into a wide range of polymer substrates or spin-on-polymers. The combination with stamp-to-substrate alignment allows alignment of hot embossing to pre-processed substrate structures.
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Product
Process Development Services
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EV Group’s comprehensive process knowledge is a result of our decades of experience. This knowledge creates benefits and advantages for our customers from the early stages of process development to the final goal of high-volume production where our process engineering services offer comprehensive technical support and advice to the semiconductor industry. With state-of-the-art application labs at our headquarters in Austria, along with North America and Asia, EV Group is focused on delivering superior process expertise to our growing global customer base every step of the way. We can provide support for initial development through final integration at the customer’s site. Process know-how is key to achieving the shortest time to market for your product.
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Product
Lithography
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EVG’s key competencies in lithographic technology lie in the high-throughput contact and proximity exposure capabilities of its mask aligners and its newly developed, revolutionary and highly versatile maskless exposure lithography systems. These capabilities are complemented by its resist coating and resist development systems with advanced in-house process competences and hands-on development skills.
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Product
IR Inspection System
EVG®20
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The EVG 20 offers a fast inspection method, especially for fusion bonded wafers. A live imageof the entire wafer via IR transmission supports void detection down to a radius of 0.5 mm. The infrared inspection system is a perfect match for fusion bonding processes either as the stand-alone EVG 20 tool or as a station in EVG''s integrated bonding systems.
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Product
Bonding
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With our extensive experience in designing and manufacturing precision wafer bonding equipment, EVG is well recognized for setting industry standards in wafer bonding. EVG wafer bonding systems can be configured for R&D, pilot-line or high-volume production, and for any direct or interlayer-based bonding process, including sophisticated low-temperature covalent bonding. With this portfolio of technologies and equipment, EVG addresses markets for advanced packaging and 3D integration, MEMS, as well as advanced compound semiconductor and SOI substrates, holding the leading position and dominant market share.
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Product
Automated Measurement System
EVG®40NT
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The EVG40 NT (stand-alone tool) and the AVM (HVM-integrated module) enable measurement of lithography relevant parameters like critical dimension, as well as bond alignment accuracy.Because of the high-measurement accuracy, it is possible to verify compliance to tight process specifications and instantly optimize integrated process parameters.
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Product
Layer Release Systems
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EVG's IR LayerRelease Technology is a fully front-end-compatible layer release technology that features an infrared (IR) laser that can pass through silicon, which is transparent to the IR laser wavelength. Coupled with the use of specially formulated inorganic layers, this technology enables an IR laser-initiated release of any ultra-thin film or layer from silicon carriers with nanometer precision.
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Product
Integrated Lithography Track Systems
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Lithography track systems complete the EVG lithography product family with a fully integrated production system and high grade of automation combining mask alignment and exposure with integrated pre- and post-processing. Based on a modular platform, the HERCULES lithography track system merges EVG’s established optical mask alignment technology with integrated cleaning, resist coating, baking and resist development modules. This turns the HERCULES platform into a “one stop shop”, where pre-processed wafers are loaded into the tool and fully structured processed wafers are returned.
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Product
Die-To-Wafer Bonding Systems
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Several different D2W bonding methods are available and selected depending upon the application and customer requirements. In direct placement D2W (DP-D2W) bonding, the singulated dies are bonded to the target wafer one by one using a pick-and-place flip-chip bonder. Plasma activation and cleaning of the surfaces of the dies on the handler wafer are essential steps for establishing a high-yielding bond and electrical interface between the dies and target wafer. This is where the EVG320 D2W activation system comes in.
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Product
UV-NIL / SmartNIL® Systems
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EV Group provides a complete product line for UV-based nanoimprint lithography (UV-NIL), including different single-step imprinting systems, large-area imprinters as well as step-and-repeat systems for efficient master fabrication. Besides soft UV-NIL, EVG offers its proprietary SmartNIL technology with multiple-use polymer stamp technology. The efficient and robust SmartNIL process provides high pattern fidelity, highly uniform patterned layers and minimum residual layers, combined with easy scalability in wafer size and production volume. EVG´s SmartNIL redeems the long-term promise of nanoimprinting being a high-performance, low-cost and volume-capable manufacturing technology for mass production of micro- and nanoscale structures.
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Product
Resist Processing Systems
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The EVG100 series resist processing systems establish new standards in quality and flexibility for photoresist coating and developing. Designed to provide the widest range of process variations, the EVG100 series’ modularity offers spin and spray coating, developing, bake and chill modules to suit individual production requirements. These systems accommodate the processing of an extensive range of materials such as positive and negative resists, polyimides, double-sided coating of thin resist layers, high viscosity resists, and edge protection coatings. These systems can handle more than one substrate size, from 2" to 300 mm diameter, rectangle, square or even irregular shaped substrates, with no or very short tooling time. This allows the development of new devices or processes on an industrial level, which not only requires high flexibility but also controlled and repeatable processing. EVG has built up many years of spin and spray coating experience for demanding applications and incorporates this knowledge into the EVG100 series, where our process know-how can be leveraged to support our customers.
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Product
Hybrid And Fusion Bonding Systems
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Hybrid bonding extends fusion bonding with embedded metal pads in the bond interface, allowing face-to-face connection of wafers. The main application for hybrid bonding is advanced 3D device stacking.
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Product
Metrology Systems
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Metrology is essential to control, optimize and ensure the highest yield in semiconductor manufacturing processes. By implementing feedback loops, both process control and process parameter correction are enabled, which allow compliance to tighter process requirements. EVG's metrology solutions are optimized for lithography and all types of bonding applications, and use non-destructive measurement methods. Customers can choose between integration of the metrology technology within fully automated process equipment, or stand-alone metrology systems serving multiple process steps.
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Product
Nanoimprint Lithography
NIL
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EVG is the market-leading supplier of nanoimprint lithography (NIL) equipment and integration processes. EVG pioneered and mastered NIL from a research approach more than 15 years ago, to implementation in volume production on various substrate sizes from 2 inch compound semiconductor wafers to 300 mm wafers and even on large-area panels. NIL is the most promising and cost-effective process for generating nanometer-scale-resolution patterns for a variety of commercial applications in bioMEMS, microfluidics, electronics and, most recently, various diffractive optical elements.
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Product
LITHOSCALE® Maskless Exposure Lithography Systems
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Maskless exposure lithography systems represent an entirely new product platform of EVG lithography equipment.
