OAI
OAI is a leading manufacturer of reliable, precision equipment for MEMS, semiconductors, nanotechnology, cleanroom automation, and for UV light measurement.
- 800-843-8259
408-232-0600 - 408-433-9904
- sales@oainet.com
- 464 South Hillview Drive
Milpitas, CA 95035
United States of America
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Product
Large Area UV Light Source
Model 30L
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The OAI UV Light Source Grande is a large area collimated light source. The device is available with output power up to 10KW. Utilizing collimating mirrors, the UV Light Source Grande is a highly efficient UV light source intended for a variety of larger-scale applications.
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Product
Handheld Surface & Volume Low Resistivity Meter for Conductive Materials
Loresta AX
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The Loresta AX Resistivity Meter a handheld unit measures the low resistivity of samples with consistent accuracy. This resistivity meter measures resistivity using a wide variety of probes. The Loresta AX uses a standard RCF that enables the user to input other RCF''s if known.
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Product
Automated Front & Backside Mask Aligner System
Model 6000
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With over 4 decades of manufacturing in the semiconductor industry, OAI meets the growing challenge of a dynamic market with an elite class of production photolithography equipment. Built on the proven OAI modular platform, the Model 6000 has front and backside alignment that is fully automated with a submicron printing capability as well as submicron top to bottom front side alignment accuracy which delivers performance that is unmatched at any price. Choose either topside or optional backside alignment which uses OAI’s customized advanced recognition pattern software. These Mask Aligners have OAI’s Advanced Beam Optics with better than ±3% uniformity and a throughput of 200 wafers per hour in first mask mode, which results in higher yields. The Series 6000 can handle a wide variety of wafers from thick and bonded substrates (up to 7000 microns), warped wafers (up to 7 mm-10mm), thin substrates (down to 100 micron thick), and thick photo resist.
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Product
Stand-alone I-V Test Systems
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OAI offers a complete line of high performance I -V Testers. I -V Testers and I -V Rider software may be ordered as a stand -alone system or integrated into any OAI Solar Simulator. Three standard ranges of I -V Testers are available; ≤1A, 1 -5A, 5 -10A, and 20A. Higher current testers are available as custom options. An OAI Application Engineer will work with you to insure that the I -V Tester and I -V Rider software you choose is optimized for your specific application.
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Product
Integrated I-V Test Systems
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The OAI Integrated I-V Test System is perfect for R&D as well as production, the OAI Integrated I-V Test System delivers extremely accurate solar cell performance measurement. OAI’s advanced fully Integrated I-V Test System is designed to overcome the limitations of flash testing by providing a highly optimized pulse width and voltage sweep rate to match any type of solar cell’s high capacitance and slow dielectric response speed. As a result, the system produces extremely accurate measurements of solar cell I-V parameters and efficiency while leading to the most accurate test results.
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Product
Wafer Bonder
AML
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Wafer bonding has found many applications in the field of MST, MEMS and micro engineering. These include the fabrication of pressure sensors, accelerometers, micro-pumps and other fluid handling devices. The process is also used for first-order packaging of silicon microstructures to isolate package-induced stresses. The OAI AML Wafer Bonder facilitates both the alignment and bonding to be performed in-situ, in a high vacuum chamber. For anodic bonding the wafers are loaded cold and heated in the process chamber. For high accuracy alignment the wafers are aligned and brought into contact only after the process temperature has been reached, thus avoiding differential thermal expansion effects which can compromise alignment. The AML Wafer Bonder is excellent for anodic bonding, silicon direct and thermal compression bonding applications. These features enable the bonder to be used with virtually any processing tool.
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Product
Large Substrate Mask Aligner
Model 6020
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The Model 6020 is a large substrate Production Mask Aligner or Auto-flood Exposure System for RDL First Level Advanced Packaging (PLP) and markets requiring exposure of large glass panels. It is engineered with OAI’s precision, reliability, and quality that is found in all of OAI’s products. The features include wedge effect leveling, superb process repeatability, ≤ 2.0µm printing resolution, and remote diagnostics. Using robotic handling, the system can stand alone or be fully integrated with photo resist processing.
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Product
Calibration Services
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For over 25 years, OAI (Optical Associate Inc.), is the leader in NIST traceable calibration of instruments for measuring Ultra Violet (UV) light. Originally designed to meet the demanding needs of the semiconductor wafer fabrication industry, OAI developed the most repeatable NIST traceable calibration in the industry.
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Product
Tabletop Front & Backside Mask Aligner
Model 200IR
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The OAI Model 200IR Mask Aligner is a tabletop system that requires minimal clean room space. It is a cost-effective alternative for R&D or limited scale, pilot production. Utilizing an innovative, air bearing / vacuum chuck leveling system, the substrate is leveled quickly and gently, for parallel photo mask alignment and uniform contact across the wafer during contact exposure. The Model 200IR Mask Aligner is capable of one micron resolution and alignment precision. It has an alignment module which features mask insert sets and quick-change wafer chucks that enable the use of a variety of substrates and masks without requiring tools for reconfiguration. The alignment module incorporates micrometers for X, Y, and z-axis.
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Product
Tabletop Mask Aligner
Model 200
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The OAI Model 200 Mask Aligner is a cost-effective high performance mask Aligner that has been engineered with industry proven components that have made OAI a leader in the photolithography capital equipment industry. The Model 200 is a tableop mask Aligner that requires minimal cleanroom space. It offers an economic alternative for R&D, or limited scale, pilot production. Utilizing an innovative, air bearing / vacuum chuck leveling system, the substrate is leveled quickly and gently, for parallel photo mask alignment and uniform contact across the wafer during contact exposure. The system is capable of one micron resolution and alignment precision.
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Product
TriSOL Class AAA 0.25º Collimation Angle Solar Simulators
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For high performance space applications, OAI offers a 0.25 Collimation Angle Solar Simulator. It is engineered with the technology built on OAI’s 47 years of experience working with light. Features include 100mmx100mm beam size, long lens housing, AM 1.5 G and AMO spectrum up to 1800 nm or any custom spectrum, and intensity controlled up to 1.25 SUNS. These solar simulators are built with OAI’s precision, quality and reliability.
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Product
Custom Solutions for Mask Aligners
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OAI offers custom designed solutions built to your unique specification.
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Product
Exposure Systems
Model 2012AF & 2012SM
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The Model 2012AF Flood Exposure System provides a cost-effective method for automated flood exposure. Designed to accommodate wafers from 8” to 300mm, the tool features automated FOUP loading. Mask and substrate changeover can be accomplished quickly and easily adding to both versatility and high-volume throughput of this production tool.The Model 2012SM Automated Edge-bead Exposure System provides a cost-effective method for edge-bead removal using standard shadow mask technology. Designed to accommodate wafers from 8” to 300mm, the tool features automated FOUP loading. Mask and substrate changeover can be accomplished quickly and easily adding to both versatility and high-volume throughput of this production tool.
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Product
Testing for Si Solar Cells Using High Performance CCD
EL Imaging Tester
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EL Testing for Si Solar Cells using High Performance CCD. The determination of luminescence (photo emissions) in solar cells is an important characterization tool. Typical solar cells often have defects which limit the efficiency or lifetime of a cell. Many of these defects are visualized with Luminescence Imaging. By using this technique, the manufacturing process can be optimized to produce better cells. Luminescence Imaging takes advantage of the radiative inter-band recombination of excited charge carriers in solar cells. The emitted photons can be captured with a sensitive CCD camera to obtain an image of the distribution of the radiative recombination in the cell. This distribution is determined by the local excitation level, allowing the detection of electrical losses, thus mapping the diffusion length of minority carriers as the emitted light is low intensity and in the near infra-red range, the CCD camera has a high sensitivity wavelength from 900 to 1100 nm with little thermal noise. This CCD camera provides excellent resolution of 1024 x 1024 pixels with a large 1μm pixel size, multi-megahertz readout speed, and robust USB 2.0 connectivity. The EL CCD Camera is the ultimate high-performance CCD camera for electroluminescence and photoluminescence imaging for Photovoltaic (PV) Cells and Modules. This camera combines low noise electronics and optimal sensitivity in NIR.















