Onto Innovation
Onto Innovation collaborates with its customers around the globe to develop innovative, data-driven solutions that increase the yield and profitability of their microelectronics and display manufacturing operations. Onto Innovation's comprehensive, state-of-the-art measurement, inspection, data analysis and lithography solutions for semiconductor manufacturing and advanced packaging processes accelerate product and process development, increase yields and reduce costs to enable its customers to be first-to-market with premium products at premium prices.
- 978-253-6200
- info@ontoinnovation.com
- 16 Jonspin Road
Wilmington, Massachusetts 01887
United States of America
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Product
Metrology System
Atlas V
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The new Atlas V metrology system is designed to measure several key steps that include buried features, not visible by CD-SEM and other techniques. Through remarkable improvements in the optical systems, mechanical sub-systems and software algorithms, the Atlas V system can precisely measure the very subtle variations for device parameters and reveal weak process corners for engineers to improve their process robustness in the fab.
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Product
Epi Thickness & Composition System
Element
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The Element system is the tool of record for wafer suppliers for high speed impurity mapping and epi thickness measurement. It is the only tool on the market with the unique combination of transmission and reflection based technology. This system is the industry standard for dielectric monitoring.
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Product
Defect Inspection System
F30
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The F30 System boasts a five-objective turret that enables the resolution-throughput flexibility required by today’s multi-process inspection applications. Equipped with an advanced productivity suite (waferless recipe creation, simultaneous FOUP, recipe server and tool matching), the F30 System redefines inspection cost of ownership expectations.
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Product
330 System
NSX
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With a combination of inspection plus metrology, NSX 330 System measures multiple applications including wafer-level metrology for micro bumps, RDL, kerf, overlay, and through silicon via (TSV) in a single wafer load.
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Product
Lithography
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With steppers for advanced packaging and flat panel display technology, Onto Innovation's latest fleet will meet today's manufacturing challenges head on. Systems are designed to maximize throughput without limited resolution and overlay.
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Product
Metrology System
Echo
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The Echo system is a comprehensive in-line metal film metrology tool for single and multi-layer metal film measurements in leading-edge logic, memory, advanced packaging, and specialty semiconductor devices.
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Product
Enterprise Software
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In the race to digitize semiconductor manufacturing operations, Onto Innovation’s productivity software delivers the competitive advantage you need to capture market share. Our software connects information on a tool, within a factory, or across an entire global supply chain to capitalize on the potential of your biggest asset: your data.
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Product
G3 System
Dragonfly
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Unique 2D imaging technology provides fast, reliable inspection for sub-micron defects to meet today's R&D needs and tomorrow's production demands. Onto Innovation's patented Truebump® Technology combines multiple 3D metrology techniques to deliver accurate 100% bump height metrology and coplanarity.
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Product
Lithography System
JetStep S3500
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The JetStep S3500 panel lithography system is designed specifically for advanced packaging panel production. The system incorporates advanced features that address requirements for panel-level packaging, such as die shift due to placement accuracy or subsequent processing steps, CTE mismatch, panel warpage and panel handling.
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Product
Lithography System
JetStep X500
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The JetStep X500 panel lithography system is optimized for volume manufacturing of high-end AICS and advanced packaging panels. The system incorporates a large field exposure system with advanced features to meet the challenging requirements encountered in production of AICS or panel level packaging, such as; fine resolution to 3µm with large depth of focus (DOF), high overlay accuracy of ±1µm, automatic magnification compensation with independent x and y magnification adjustment of ±100 ppm, and automatic handling of panel substrates of various dimensions, thicknesses, and levels of warp.
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Product
Metrology System
IVS
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The IVS 220 system is the latest generation in the IVS series and has been designed for ultimate precision, TIS (tool induced shift) and throughput on 200mm wafers. The cornerstone of the system’s reliability and stability is its mean time between failure (MTBF) of 2,100 hours. The IVS 280 provides the same capability in a package designed for overhead track handling with full E84 GEM300 capability.
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Product
VX4 System
PrecisionWoRx
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The PrecisionWoRx VX4 System gives test facilities and probe card manufacturers the ability to confidently test tighter pitches and smaller probe tips. The system can be easily configured to specific requirements for a variety of probe card technologies. For processes using cards with very small probe tips, the system’s high-resolution optics deliver a detailed field-of-view for high accuracy and repeatability.
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Product
OCD Solutions
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Onto Innovation’s OCD technology offers powerful OCD modeling and advanced machine learning capability, as well as next-generation real-time regression, offline sensitivity analysis tools and comprehensive GUI and structure input for true multi-variant modeling. Both the Ai Diffract and SpectraProbe software packages deliver advanced capabilities in intuitive and easy to deploy hardware form factors.
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Product
Defect Inspection System
NovusEdge
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The NovusEdge System provides high sensitivity inspection for the edge and backside of bare unpatterned wafers for current and advanced nodes. Multiple modules can be configured on the same automation platform for increased throughput while maintaining a small footprint for an improved cost of ownership.
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Product
Metrology System
Aspect
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Memory density increases with both layer-pair scaling and tier stacking for memory stacks well over 200 pairs. The Aspect metrology system was designed with these future architectures and scaling strategies in mind. Aspect metrology is demonstrating performance superior to X-ray systems across multiple customer devices through a revolutionary infrared optical system providing full profiling capability to enable critical etch and deposition control, with the speed and process coverage that customers require.
Children
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4D Technology
4D Technology is the leader in high-resolution surface and wavefront measurements for challenging locations and applications. 4D pioneered “dynamic” measurement technology, paving the way for entirely new classes of instruments that change how manufacturers and scientists think about measurement. From the world’s premiere astronomical observatories, to optical manufacturing shops, to aircraft flight lines, 4D gages and instruments provide 3D measures accurately, despite vibration and noise that stop other instruments in their tracks.
