Showing results: 16 - 24 of 24 items found.
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Atlas V -
Onto Innovation
The new Atlas V metrology system is designed to measure several key steps that include buried features, not visible by CD-SEM and other techniques. Through remarkable improvements in the optical systems, mechanical sub-systems and software algorithms, the Atlas V system can precisely measure the very subtle variations for device parameters and reveal weak process corners for engineers to improve their process robustness in the fab.
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IMPULSE V -
Onto Innovation
With tighter wafer-to-wafer and within-wafer uniformity tolerances, integrated metrology systems are in use across various semiconductor processing steps. Based on demonstrated high-resolution optical technology, the IMPULSE V system provides higher sensitivity to thin film residue measurements during the CMP process. The IMPULSE platform boasts the industry’s most reliable hardware with best-in-class reliability and productivity metrics.
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Aspect -
Onto Innovation
Memory density increases with both layer-pair scaling and tier stacking for memory stacks well over 200 pairs. The Aspect metrology system was designed with these future architectures and scaling strategies in mind. Aspect metrology is demonstrating performance superior to X-ray systems across multiple customer devices through a revolutionary infrared optical system providing full profiling capability to enable critical etch and deposition control, with the speed and process coverage that customers require.
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JetStep S3500 -
Onto Innovation
The JetStep S3500 panel lithography system is designed specifically for advanced packaging panel production. The system incorporates advanced features that address requirements for panel-level packaging, such as die shift due to placement accuracy or subsequent processing steps, CTE mismatch, panel warpage and panel handling.
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Element -
Onto Innovation
The Element system is the tool of record for wafer suppliers for high speed impurity mapping and epi thickness measurement. It is the only tool on the market with the unique combination of transmission and reflection based technology. This system is the industry standard for dielectric monitoring.
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Dragonfly -
Onto Innovation
Unique 2D imaging technology provides fast, reliable inspection for sub-micron defects to meet today's R&D needs and tomorrow's production demands. Onto Innovation's patented Truebump® Technology combines multiple 3D metrology techniques to deliver accurate 100% bump height metrology and coplanarity.
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JetStep G35 -
Onto Innovation
The Jetstep G35 system is a high volume manufacturing imaging system for up to Gen 3.5 displays.The JetStep G35 system enables high resolution imaging down to 1.5µm combined with registration and stitching accuracy required by most advanced manufacturing of high resolution displays.
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JetStep G45 -
Onto Innovation
The JetStep G45 System features <1.5μm resolution capability across a field size diameter of >200mm. Low distortion optics combined with high-speed precision motions enables the system to achieve overlay of <0.5μm.
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NovusEdge -
Onto Innovation
The NovusEdge System provides high sensitivity inspection for the edge and backside of bare unpatterned wafers for current and advanced nodes. Multiple modules can be configured on the same automation platform for increased throughput while maintaining a small footprint for an improved cost of ownership.
