High Power Burn-in

The LRS-9424B Laser Reliability and Burn-In Test System is the second generation of ILX Lightwave?s successful 9424 platform and offers precision and flexibility at an affordable price. With up to 1024 devices in the LRS-9424B?s compact chamber, you?ll be able to increase throughput and lower your overall cost of test. The LRS-9424B?s proven l ...more

High-Power Burn-In Up to 200 Watts. Individual temperature control for each DUT up to 200 W. Tests devices at a maximum temperature of 150° C. 11 programmable voltage regulators per burn-in board. 800 amps of DUT power available per burn-in board. ...more

High-Power Burn-In. Individual temperature control for each device under test up to 35 watts. Tests devices at a maximum temperature of 150° C. System capacity with individual temperature control is up to 384 devices. When individual temperature control is not a requirement, capacity increases based on the size of the devices. ...more

High-Power Burn-In System. This system is for burn-in of devices up to 20 watts is available with ABES-IV or ABES-V electronics and test capability. Individual temperature control for each device under test up to 20 Watts.Tests high-pin-count devices to IEEE Standard 1149 specifications. Optional per-socket temperature control on up to 24 devi ...more

XDC provides clean, reliable power for benchtop, ATE systems, burn-in, production test and OEM applications. ...more

High-Power Burn-In Up to 600 Watts. Individual temperature control for each device under test up to 600 W. Tests devices at a maximum temperature of 150° C. 16 programmable voltage regulators per burn-in board. Liquid-cooled heat sink per device under test. ...more

High-Power Burn-In Up to 150 Watts. Individual temperature control for each device under test up to 150-watts. Programmable temperature control up to 150° C. 800 amps of DUT power available per burn-in board. ASIC architecture for per-pin timing, testing, and formatting of pattern data. ...more

High-Power Burn-In Up to 150 Watts. Individual temperature control for each device under test up to 150 watts. ASIC architecture for per-pin timing, testing, and formatting of pattern data. Up to 128 digital I/O channels per burn-in board. Tests devices at a maximum temperature of 150° C. ...more

As compared to traditional burn in, TDI's typical three hour HASS cycle is equivalent to 125 hours of static burn-in at +50 C. HASS has the benefits of utilizing: Continuous thermal expansion and contraction stresses to precipitate mechanical flaws such as die cracks, poor wire bonds and cold solder joints. Dynamic output loading and input power ...more

As compared to traditional burn in, TDI's typical three hour HASS cycle is equivalent to 125 hours of static burn-in at +50 C. HASS has the benefits of utilizing: Continuous thermal expansion and contraction stresses to precipitate mechanical flaws such as die cracks, poor wire bonds and cold solder joints. Dynamic output loading and input power c ...more