Bump

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  • FC CSP - Bump Inspection HDI Bump Inspection
    Machvision
  • SHR-1116 - 2D/3D Semiconductor Package Bump Testing System The SHR-1116 is a system that tests the height and quality of semiconductor package bumps by using state-of-the-art 2D/3D testing technology. The system can handle various types of testing of the entire semiconductor package, including bump height, volume and warpage, and achieves high-speed, high-accuracy testing. Nidec-Read offers products from ACERIS (Canada) to suit the specifications of each user.
    Nidec-Read
  • 4300FP - Semi-automatic Wafer Bump Testing The Nordson DAGE 4300FP eliminates manual handling of expensive wafers. It improves cleanliness through isolation of bondtester and wafer handler and increases productivity through semi-automatic testing.
    Nordson Dage
  • 4300FP - Semi-automatic Wafer Bump Testing The Nordson DAGE 4300FP eliminates manual handling of expensive wafers. It improves cleanliness through isolation of bondtester and wafer handler and increases productivity through semi-automatic testing.
    Nordson Dage
  • Prime - 3D In-line After Printing Substrate Bump Inspection System 3D In-line After Printing Substrate Bump Inspection System
    Koh Young Technology
  • Copper Pillar Bump Like in conventional fabrication, integrated circuits are created on the wafer but near the end of the manufacturing process, the attachment pads are metalized on the surface of the chips to make them more receptive to solder. Then solder dots are deposited on each of the pads, and chips are cut, flipped, and positioned so that the solder balls are facing the connectors on the external circuitry.
    Advanpack Solutions
  • VS Series - Probe Card · Vertical contact Probe Card with Spring · Suitable for Area array Bump Test.
    Japan Electronic
  • Wafer Scanner For both standard and flip chip wafers, the Wafer Scanner™ Inspection Series provides superior yield management for 3D/2D bump and RDL metrology, bump and RDL defect and macro defect inspection throughout post-fab processes.
    Tamar Technology
  • Wafer Scanner For both standard and flip chip wafers, the Wafer Scanner™ Inspection Series provides superior yield management for 3D/2D bump and RDL metrology, bump and RDL defect and macro defect inspection throughout post-fab processes.
    Rudolph Technologies
  • LCD Driver (CP) - Probe Card 40um pitch, gold bump LCD driver IC. 1x2 dual-site technology available.
    MPI
  • Hand Wired Type VPC - Probe Card Vertical probe for solder bump devices, contact with area array pads layout. Hand wired type space transformer.
    MPI
  • MLO\MLC Type VPC - Probe Card Vertical probe for solder bump devices, contact with area array pads layout. Multi-Layer-Organic space transformer.
    MPI
  • JVX6200iF - Galaxy JVX6200iF features small spot XRF, for robust measurement of complex patterning. JV's technology roadmap is inline with µ-bump scaling and can measure bumps smaller than15µm. JV tools can measure solder cap (~3µm) on top of Cu pillar as single bump
    Jordan Valley Semiconductors
  • Falcon 800 - Measurement and metrology system Camtek has developed the Falcon 800 line of advanced measurement and metrology systems for inspecting bumped wafers and ensuring that bumps meet their tight dimensional tolerances.
    Camtek Intelligent
  • Sigmatech UltraSurf M - Sub-Nanometric Measurement Compact microscope for sub-nanometric measurement. Powerful analysis software. Applications: R&D labs for Step height, bump size, Roughness, surface topography
    Sigmatech
  • DAGE 4000W - Bondtester A modified DAGE 4000 is interfaced with an industry standard wafer handler for automatic loading from the cassette, bump testing (shear or pull), and then unloading of the 6 or 8 inch wafers.
    Nordson Dage
  • LED Wafer Test - LED & LCD Test Solutions APS pins in small diameters and a variety of materials are the answer to the challenge of testing gold bumps and pads without damage to the gold surface in LED wafer test situations. Gold bumps require special care during wafer test to avoid damage. APS probes in the most suitable material and small diameters of .003-.004” have been used successfully in this challenging test situation. The quality of pins provided by APS for LED wafer test is unsurpassed.
    Advanced Probing
  • SpringTouch™ - WLCSP Test with Spring Pin Probes SV's new SpringTouch™ is an ideal solution for WLCSP test with spring pin probes that have the capability to overcome the bump height variation across the wafer. The crown-tip shape self-aligns to the solder bump, eliminating deformation and the need for reflow. The SpringTouch is capable of pitches as low as 150um and can be adapted for testing singulated die.
    SV Probe
  • TMPF-160-256 - Prober For checking panels up to 2 inches in size. The TMPF-160-256 has an overdrive mechanism for adjusting contact pressure, along with a transparent acrylic plate for mounting test pieces so it may be used with light tables. The bump FPC used for making contact, and the contact FPC used on the checker side, are attached by screw pressure-fit connections allowing the bump FPC to be changed easily.
    Taiyo Industrial
  • 4000 - Multipurpose Bondtester The 4000 bondtester is multipurpose, capable of performing all pull and shear applications. The 4000 bondtester can be configured as a simple wire pull tester and upgraded to provide ball shear, die shear, bump pull, vectored-pull, or tweezer pull tests.
    Nordson Dage
  • LCD Driver For LCD Driver IC supporting Au bump fine pitch. Enables to test 1x2 and 2x1 DUT layouts by Multi Square method. In addition to conventional needle material ReW, new material is provided to support stable and reduce cleaning frequency.
    Micronics JAPAN Co.ltd
  • Stamper Tester Quick stamper quality test for replicators and manufacturers. High-resolution line-scan camera detects all relevant stamper defects, including inner area. Includes acceleration defects such as bumps.
    Dr.schwab Inspection
  • 4000W - Wafer Handling System The Nordson DAGE 4000W system enables the industry standard 4000 multipurpose bondtester to interface with an industry standard wafer handler system. This wafer handling system provides automatic loading from the cassette, bump testing (shear or pull), and then unloading of the six or eight inch wafers.
    Nordson Dage
  • 4300 - Bondtester The Nordson DAGE 4300 bondtester complements the proven semi-automatic 4000W Wafer Handling System and has been designed in accordance with the strict standards of semiconductor foundries and subcontractors to meet the growing demand for handling and bump shear testing on 300mm wafers.
    Nordson Dage

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