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4300FP - Semi-automatic Wafer Bump Testing The Nordson DAGE 4300FP eliminates manual handling of expensive wafers. It improves cleanliness through isolation of bondtester and wafer handler and increases productivity through semi-automatic testing.
SHR-1116 - 2D/3D Semiconductor Package Bump Testing System The SHR-1116 is a system that tests the height and quality of semiconductor package bumps by using state-of-the-art 2D/3D testing technology. The system can handle various types of testing of the entire semiconductor package, including bump height, volume and warpage, and achieves high-speed, high-accuracy testing. Nidec-Read offers products from ACERIS (Canada) to suit the specifications of each user.
FC CSP - Bump Inspection HDI Bump Inspection
Prime - 3D In-line After Printing Substrate Bump Inspection System 3D In-line After Printing Substrate Bump Inspection System
TV220 - TDR FOR CATV BROADBAND High Voltage Tolerant: Will not be damaged by high voltages (up to 400V (DC + peak AC). High Bandwidth: Tests more of your system capacity enabling users to pinpoint the faults that can cause micro-reflections which can be damaging to digital transmissions. High SNR: The TV220 also has extremely high signal-to-noise ratio (SNR). Proprietary circuit design and software reduce the noise level so that bumps on the trace represent real faults, not just noise. Events previously difficult or impossible to find, are clearly visible with the TV220. This means that you can clearly see faults further away. High-resolution performance allows the TV220 to locate problem components in the customer drop. The TV220 uses a pulse width of only 1ns, which means the operator can identify multiple events that are less than 2ft apart. This enables the technician to tell which of two components on a cable is causing the problem, even when they are close together. This is particularly important in troubleshooting drops, because components such as splitters and ground blocks can be closely spaced.
VS Series - Probe Card · Vertical contact Probe Card with Spring · Suitable for Area array Bump Test.
Wafer Scanner For both standard and flip chip wafers, the Wafer Scanner™ Inspection Series provides superior yield management for 3D/2D bump and RDL metrology, bump and RDL defect and macro defect inspection throughout post-fab processes.
Hand Wired Type VPC - Probe Card Vertical probe for solder bump devices, contact with area array pads layout. Hand wired type space transformer.
MLO\MLC Type VPC - Probe Card Vertical probe for solder bump devices, contact with area array pads layout. Multi-Layer-Organic space transformer.
LCD Driver (CP) - Probe Card 40um pitch, gold bump LCD driver IC. 1x2 dual-site technology available.
JVX6200iF - Galaxy JVX6200iF features small spot XRF, for robust measurement of complex patterning. JV's technology roadmap is inline with µ-bump scaling and can measure bumps smaller than15µm. JV tools can measure solder cap (~3µm) on top of Cu pillar as single bump
Sigmatech UltraSurf M - Sub-Nanometric Measurement Compact microscope for sub-nanometric measurement. Powerful analysis software. Applications: R&D labs for Step height, bump size, Roughness, surface topography
Falcon 800 - Measurement and metrology system Camtek has developed the Falcon 800 line of advanced measurement and metrology systems for inspecting bumped wafers and ensuring that bumps meet their tight dimensional tolerances.
SpringTouch™ - WLCSP Test with Spring Pin Probes SV's new SpringTouch™ is an ideal solution for WLCSP test with spring pin probes that have the capability to overcome the bump height variation across the wafer. The crown-tip shape self-aligns to the solder bump, eliminating deformation and the need for reflow. The SpringTouch is capable of pitches as low as 150um and can be adapted for testing singulated die.
4300 - Bondtester The Nordson DAGE 4300 bondtester complements the proven semi-automatic 4000W Wafer Handling System and has been designed in accordance with the strict standards of semiconductor foundries and subcontractors to meet the growing demand for handling and bump shear testing on 300mm wafers.
Stamper Tester Quick stamper quality test for replicators and manufacturers. High-resolution line-scan camera detects all relevant stamper defects, including inner area. Includes acceleration defects such as bumps.
4000 - Multipurpose Bondtester The 4000 bondtester is multipurpose, capable of performing all pull and shear applications. The 4000 bondtester can be configured as a simple wire pull tester and upgraded to provide ball shear, die shear, bump pull, vectored-pull, or tweezer pull tests.
4000W - Wafer Handling System The Nordson DAGE 4000W system enables the industry standard 4000 multipurpose bondtester to interface with an industry standard wafer handler system. This wafer handling system provides automatic loading from the cassette, bump testing (shear or pull), and then unloading of the six or eight inch wafers.
LCD Driver For LCD Driver IC supporting Au bump fine pitch. Enables to test 1x2 and 2x1 DUT layouts by Multi Square method. In addition to conventional needle material ReW, new material is provided to support stable and reduce cleaning frequency.
GX-U - DC 2-wire Cylindrical Inductive Proximity Sensor This GX-U series improved drastically the sensing range in comparison with (our) conventional item, so that the sufficient setting is possible. Also the trouble which the object bump into the sensor will be decreased.
GATS-3200 - Fastest Flying Probe Test System for Semiconductor Substrate Interconnect Test * Test individual packages or
* Test Multi-image panels with Step&Repeat Function
* single flying probe top using very high speed voice coil motor (VCM) technology
* 50 - 100 tests per second ... high throughput
* Dual Flying Probe Top for testing bump-to-bump nets
* flying probe head allows testing of all nets including each power and ground point
* 4-wire test capability
Wafer Sort TestEdge offers complete wafer sort solutions. Our range of wafer sort capabilities demonstrates our ability to handle a wide range of devices and device characteristics. State of the art Electroglas probers Sort experience with high probe count Less than 4 mil pitch on probes Experience with C4 Bump and Aluminum pad Experience on Bipolar, CMOS, GaAs, & SiGe Overhead sort or cable harness sort Microsite testing capability
Falcon 500 PD - Wafer inspection systems Post-dicing inspection offers the last opportunity to capture defects from preceding processes while the dice are still packed in wafer format. Camtek's Falcon 500PD line of automatic framed wafer inspection systems delivers superb detection of surface and probe mark defects, bump size and placement deviations, as well as dicing-related defects.
WI-2xx0 - Wafer Inspectors The WI-2200 and -2300 Wafer Inspectors perform 100% automated optical inspection and metrology of microelectronic devices on a variety of wafer substrates, surface inspection, and 2D bump inspection. Key market segments for this automated optical inspection system include semiconductor IC, optoelectronics, advanced packaging, and MEMS.
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