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SHR-1116 - 2D/3D Semiconductor Package Bump Testing System The SHR-1116 is a system that tests the height and quality of semiconductor package bumps by using state-of-the-art 2D/3D testing technology. The system can handle various types of testing of the entire semiconductor package, including bump height, volume and warpage, and achieves high-speed, high-accuracy testing. Nidec-Read offers products from ACERIS (Canada) to suit the specifications of each user.
FC CSP - Bump Inspection HDI Bump Inspection
4300FP - Semi-automatic Wafer Bump Testing The Nordson DAGE 4300FP eliminates manual handling of expensive wafers. It improves cleanliness through isolation of bondtester and wafer handler and increases productivity through semi-automatic testing.
Prime - 3D In-line After Printing Substrate Bump Inspection System 3D In-line After Printing Substrate Bump Inspection System
VS Series - Probe Card · Vertical contact Probe Card with Spring · Suitable for Area array Bump Test.
Wafer Scanner For both standard and flip chip wafers, the Wafer Scanner™ Inspection Series provides superior yield management for 3D/2D bump and RDL metrology, bump and RDL defect and macro defect inspection throughout post-fab processes.
Hand Wired Type VPC - Probe Card Vertical probe for solder bump devices, contact with area array pads layout. Hand wired type space transformer.
MLO\MLC Type VPC - Probe Card Vertical probe for solder bump devices, contact with area array pads layout. Multi-Layer-Organic space transformer.
LCD Driver (CP) - Probe Card 40um pitch, gold bump LCD driver IC. 1x2 dual-site technology available.
JVX6200iF - Galaxy JVX6200iF features small spot XRF, for robust measurement of complex patterning. JV's technology roadmap is inline with µ-bump scaling and can measure bumps smaller than15µm. JV tools can measure solder cap (~3µm) on top of Cu pillar as single bump
Falcon 800 - Measurement and metrology system Camtek has developed the Falcon 800 line of advanced measurement and metrology systems for inspecting bumped wafers and ensuring that bumps meet their tight dimensional tolerances.
Sigmatech UltraSurf M - Sub-Nanometric Measurement Compact microscope for sub-nanometric measurement. Powerful analysis software. Applications: R&D labs for Step height, bump size, Roughness, surface topography
SpringTouch™ - WLCSP Test with Spring Pin Probes SV's new SpringTouch™ is an ideal solution for WLCSP test with spring pin probes that have the capability to overcome the bump height variation across the wafer. The crown-tip shape self-aligns to the solder bump, eliminating deformation and the need for reflow. The SpringTouch is capable of pitches as low as 150um and can be adapted for testing singulated die.
GX-U - DC 2-wire Cylindrical Inductive Proximity Sensor This GX-U series improved drastically the sensing range in comparison with (our) conventional item, so that the sufficient setting is possible. Also the trouble which the object bump into the sensor will be decreased.
LCD Driver For LCD Driver IC supporting Au bump fine pitch. Enables to test 1x2 and 2x1 DUT layouts by Multi Square method. In addition to conventional needle material ReW, new material is provided to support stable and reduce cleaning frequency.
4000 - Multipurpose Bondtester The 4000 bondtester is multipurpose, capable of performing all pull and shear applications. The 4000 bondtester can be configured as a simple wire pull tester and upgraded to provide ball shear, die shear, bump pull, vectored-pull, or tweezer pull tests.
Stamper Tester Quick stamper quality test for replicators and manufacturers. High-resolution line-scan camera detects all relevant stamper defects, including inner area. Includes acceleration defects such as bumps.
4000W - Wafer Handling System The Nordson DAGE 4000W system enables the industry standard 4000 multipurpose bondtester to interface with an industry standard wafer handler system. This wafer handling system provides automatic loading from the cassette, bump testing (shear or pull), and then unloading of the six or eight inch wafers.
4300 - Bondtester The Nordson DAGE 4300 bondtester complements the proven semi-automatic 4000W Wafer Handling System and has been designed in accordance with the strict standards of semiconductor foundries and subcontractors to meet the growing demand for handling and bump shear testing on 300mm wafers.
GATS-3200 - Fastest Flying Probe Test System for Semiconductor Substrate Interconnect Test * Test individual packages or
* Test Multi-image panels with Step&Repeat Function
* single flying probe top using very high speed voice coil motor (VCM) technology
* 50 - 100 tests per second ... high throughput
* Dual Flying Probe Top for testing bump-to-bump nets
* flying probe head allows testing of all nets including each power and ground point
* 4-wire test capability
Apollo - Vertical Probe Cards Apollo vertical probe cards are suitable for area-array and perimeter-layout probing applications, including both flip chip and pre-bump or aluminum pad application. Broad range of probe diameters and tip geometries, scalable to 135um pitch.
ToxiRAE 3 - Single-gas monitor The ToxiRAE 3 is a full-featured single-gas monitor that offers unequaled cost of ownership value. The ToxiRAE 3 is compatible with the AutoRAE Lite bump and calibration station. STEL, TWA, low, and high alarms can also be recorded. The detector is warranted for 2 years and maintenance free with replaceable battery.
ScanINSPECT BPI - Inspection System ScanINSPECT provides a simple and user-friendly alternative to inaccurate and time-consuming manual inspection methods or expensive high-end AOI systems. ScanINSPECT uses a simple Windows user interface integrated with an image-processing unit. This combination allows 100% inspection of ball or bump placement on a wide variety of substrates and device types.
Wafer Sort TestEdge offers complete wafer sort solutions. Our range of wafer sort capabilities demonstrates our ability to handle a wide range of devices and device characteristics. State of the art Electroglas probers Sort experience with high probe count Less than 4 mil pitch on probes Experience with C4 Bump and Aluminum pad Experience on Bipolar, CMOS, GaAs, & SiGe Overhead sort or cable harness sort Microsite testing capability
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