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VFTLP

tests simulate IC or SOC ESD events with pulse lengths < 10ns and deep sub nanosecond rise times.


Showing results: 1 - 8 of 8 items found.

  • VFTLP+ Test System

    4012 - Barth Electronics, Inc

    The Model 4012 VFTLP+™ test system was developed in early 2000 to add high speed measurements to the usual I-V plot, to measure and record the real TDDB waveform which causes oxide failure.*Accurate measurements of this waveform have finally been identified by Barth Electronics Inc. and CDM protection can now be based on known dimensional design parameters. We identify the response of your CDM protection circuits with 100ps risetime pulses which simulate the real CDM test. This is the only way with which to provide the total gate oxide threat voltage data.*Convenient, precise, repeatable operation*Computer controlled for automated testing

  • TLP Tester lineup

    Hanwa Electronic Ind. Co.,Ltd.

    The tester can implement simulate operating characteristic of protective circuit In addition capable of the VFTLP test.

  • Manual Probearm for HBM and Flex-Pitch Applications

    TPA-GFM - High Power Pulse Instruments GmbH

    *Electrically isolated probearm for GND needle contact or general purpose DC, twin-wire HBM or flexible pitch VF-TLP/TLP/HMM/HBM force/sense probing based on the HPPI GF-A flexible pitch setup.*Suitable to mount the GF-A ground fixture needle for flexible pitch measurements. In addition a cable (e.g. for HBM) can be directly connected to the contact pin.*High stability

  • Flexible Probearm for HBM and Flex-Pitch Applications

    TPA-GFG - High Power Pulse Instruments GmbH

    *Electrically isolated probearm for GND needle contact or general purpose DC, twin-wire HBM or flexible pitch VF-TLP/TLP/HMM/HBM force/sense probing based on the HPPI GF-A flexible pitch setup.*Flexible rotation of the probearm by precision gear 80:1*Suitable to mount the GF-A ground fixture needle for flexible pitch measurements. In addition a cable (e.g. for HBM) can be directly connected to the contact pin.*High stability

  • Compact TLP/VF-TLP/HMM Probearm Set for Temperature Measurements

    PHD-4001A - High Power Pulse Instruments GmbH

    *Electrically isolated probearm kit for VF-TLP, TLP, HMM, HBM force and sense probingbased on the GGB Picoprobe Model 10 replacement probe tips*Buried coaxial cable channel for thermo-chuck in isolated chamber temperature measurements*Compatible with GGB Picoprobe Model 10 replacement probetips*Compatible with all standard micropositioner interfaces*High precision rotation of the probearm by backlash-free 80:1 gear*Rugged stainless steel design*SMA connectors

  • Transmission Line Pulse Testing

    ESDEMC Technology LLC

    Transmission Line Pulse testing, or TLP testing, is a method for semiconductor characterization of Electrostatic Discharge (ESD) protection structures. In the Transmission Line Pulse test, high current pulses are applied to the pin under test (PUT) at successively higher levels through a coaxial cable of specified length. The applied pulses are of a current amplitude and duration representative of the Human Body Model (HBM) event (or a Charged Device Model – CDM – event in the case of Very Fast TLP, or VF-TLP).

  • Pulsed IV-Curve Solutions

    ESDEMC Technology LLC

    Pulsed IV-Curve Test and Analysis System is our new development for 2015. It is an advanced and compact pulsed IV-curve characterization system designed to simulate pulsed ESD events such as TLP, vf-TLP, HMM, HBM, EFT, and LV-Surge. It will monitor the transient voltage and current waveform during the pulse in ps or ns segment, and test the pre- and post-pulse status (leakage current, breakdown voltage, biasing current, static IV curve, etc) of the device under test (DUT), such as protection devices, semiconductors, circuit modules, touch panel sensor, etc.

  • 120 A High Voltage 50 Ω Pulse Generator

    TLP-12010C - High Power Pulse Instruments GmbH

    - High pulse output current up to 120 A (short circuit)- Ultra-fast 50 Ω high voltage pulse output with typical rise time 100 ps (0 A to 40 A) and 300 ps in high-current mode (0 A to 120 A)- Wafer, package and system level TLP, VF-TLP and HMM testing- Up to 180 kW peak output power into 50 Ω load- Built-in HMM pulse up to ±32 kV in 50 Ω-configuration- High speed 50 Ω trigger output for oscilloscopes (synchronous to high voltage pulse output)- 6 USB programmable pulse rise times: 100 ps to 50 ns (custom selectable)- 8 (optional 9) programmable pulse widths: 0.5 ns (optional), 1 ns to 100 ns (0 A to 40 A), 1 built-in pulse width: 100 ns (>40 A)- The optional pulse width extender TLP-3011C enables pulse width up to 1.6 µs in 68 GPIB programmable steps (0 A to 40 A)- Optional external pulse width extensions from 5 ns to 500 ns (>40 A to 120 A)using the external pulse width extender TLP-12012A6- Built-in pulse reflection suppression- Fast measurement time, typically less than 0.2 s per pulse including one-point DC measurement between pulses- Efficient sofware for system control and waveform data management- The sofware can control automatic probers for fast measurements of complete wafers- Combines TLP-12010A and TLP-4010C into one system- Can be operated together with TLP-12012A6 and TLP-3011C pulse width extenders- Integrated interlock safety shut-down- Industrial isolated and EMI/ESD protected USB control interface

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