Solder Paste Measurement
assures volume and area of paste application.
See Also: Solder Paste, Solder Paste Inspection
- Pickering Interfaces Inc.
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37-Pin D-Type Female Solder Bucket
92-960-037-F
Accessory allows a user to create their own PCB based termination solution mounted directly on the front of the product or on the end of a cable. Interfacing PCBs should be designed with suitable clearances for the voltage the application requires. 37-Pin Female connectors can be directly mated to a corresponding Pickering Switching Module while Male versions can be used to interface to a Female cable assembly termination.
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5D SPI
On Mek Solder Paset Inspection systems, items which are better inspected in 2D, such as area offset and bridging, are viewed in full colour. Using colour inspection the ISO-Spector S2 SPI can tell the difference between paste, solder mask, silk screen and other PCB features and the SPI system can intelligently give you accurate results. Volume and height measurement in 3D are combined with the 2D inspection in Real-time, to give a True colour 3D image. Other 3D SPI systems only inspect in the 3rd dimension, (Z axis) and make extrapolated assumptions about the 2D image.
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AOI & SPI Test Systems
Xceed AOI
Most defects in the circuit-board assembly are due to the solder paste or the process of printing solder paste. Since the transition to lead-free soldering, a whole new spectrum of problems has emerged in older paste printing and its due processes. Incomplete coalescence of ball grid array (BGA) spheres and solder paste deposits are failure modes that have increased in frequency since the transition to lead-free soldering. The Xceed enables true 3D measurement and provides the most accurate and repeatable inspection results with the minimum false calls. It’s designed with Advanced Signal Processing which gives results in noise-less, clear, and accurate 3D images.
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Printing / Squeegee Force
CmPrint
Measurement of the Force-Time Curve while Printing. The first step into the manufacturing of electronic printed circuit boards (PCBs) is printing. The solder paste is printed on the PCB using a stencil. The equal distribution of the paste pressure is crucial and affects the overall quality of the finished circuit board. An important influencing factor is the accuracy and reproducibility of the squeegee force.
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Solder Paste Inspection Machine
3D SPI
The 6500 series is the measurement equipment provided by Jiezhi Technology for the small pads of solder paste printed on the PCB board. It will cause defects such as sharpness, offset, more tin, and less tin printing during solder paste printing. Causes defects in the later stage of production, this equipment can find problems in advance
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PXI FPGA & Measurement Accelerator
Keysight PXI FPGA & measurement accelerator provide digital-pre-distortion (DPD) and envelope tracking (ET) measurements that are embedded in high performance FPGA processing cards.
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Solder Paste
MVP Versa (3D SPI)
The first part of any SMT process is Paste. MVPs Versa and 900 Series platforms provide high accuracy paste inspection. High accuracy paste measurements are made using a choice of 10um or 5um 3D measurement systems.
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Solder Paste Inspection System
LaserVision SP3D Mini
The LaserVision SP3D Mini offers the same level of overall measurement capabilities as the VisionPro SP3D. Utilizing a lower cost microscope platform and the ability for customers to supply their own PC if needed, the SP3D Mini sets the "affordable" boundary on reliable, low cost SPI solutions.
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3D Solder Paste Inspection
aSPIre 3
Industry-leading measurement accuracy and inspection reliability- Perfect solution to eliminate shadow problems, base plane settings, and problems with projection direction- Full 3D foreign material inspection solution for the entire PCB- High productivity through the highest accuracy
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Solder Paste Wetting Tester
SP-2
SP-2 is wettability testing machine forsolder paste, parts electrode and PC board,adopted SP-Tension-Method (Temperature Profile Method).
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Solder Paste Inspection System
KY8030-3
The new KY8030-3 delivers 3x fasterinspection without compromisingperformance and accuracy.Using patented dual projection,the system eliminates the criticalShadow problem that all 3D SPI systemscan be vulnerable to.Additionally, the new KY8030-3 has solvedthe PCB Warp problem that seriouslyimpacts inspection accuracyand reliability of result.
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3D Solder Paste Inspection Machine (3D-SPI)
3Si Series
Saki's 3D SPI identifies critical defects and assists with process improvement.
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High Speed Solder Paste Inspection
VisionPro HSi
The VisionPro HSi offers high speed solder paste inspection. Utilizing the most advanced high resolution staging and sensor technologies, the VisionPro HSi provides the accuracy and reliability needed to compliment your overall screen print process improvement strategy.
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PXIe Measurement Accelerator
M9451A
The M9451A PXIe Measurement Accelerator combined with Option DPD Digital Pre-Distortion & Envelope Tracking Gateware shows what is possible when you combine state of the art FPGA's with Keysight's trusted measurement expertise and PXIe's high speed data handling. As part of Keysight's RF PA/FEM Characterization & Test, Reference Solution, this combination provides unprecedented performance for demanding envelope tracking and digital pre-distortion measurements required for testing modern...show more -
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Solder Paste Analysis
SPA1000
The SPA 1000 also introduces new process control capability by accurately measuring the suitability of the solder paste prior to its implementation on the production line. It achieves this by determining the "Open-Time" for the paste. It also performs the Slump Test and both of these methods provide a "Go/No Go" answer in less than 30 minutes to ensure minimum delay for the production line.
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Solder Test Pallet
WaveRIDER® NL 2
The wave soldering process is one of the most challenging procedures to set up. The ECD WaveRIDER NL 2 greatly simplifies wave solder set up and ensures perfect repeatability, time after time. Board recipe preheat temperatures, conveyor speed, wave height, contact times and parallelism are all measured and monitored using the WaveRIDER NL 2 process pallet.
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Measurement
Encoder
Encoder is used for measuring the relative position (displacement), displacement velocity and direction by means of optical angular or linear displacement sensors (encoders) connected to the ADC input channels.
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Solder Paste Inspection
3D SPI
Checking all the relevant points in the production process is essential, especially in terms of analyzing the causes of defects, fixing them, and – most importantly – preventing them in the future. That’s why solder paste printing is of fundamental importance for manufacturing complex assemblies: If paste printing isn’t performed correctly, the defect can impact the subsequent assembly and the soldering process, resulting in a tilted component or a poor or missing solder joint.
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3D Solder Paste Inspection system
PI Series
PI Series is a new generation 3D Solder Paste Inspection system that overcomes the limitations of traditional SPIs and satisfy all your inspection needs. The PI Series allows to easily implement Solder Paste Inspection in any PCBA line. These new generation systems are very intuitive to use, allowing non-experienced persons to get expected results.
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Measurement
Site VSWR
The Site VSWR measurement is done according to CISPR 16-1-4 in the frequency range from 1 GHz to 18 GHz using broadband omni directional antennas in horizontal and vertical polarisation. The volumetric test method is applied (test volume needs to be specified), test distance 3 m - any other distance upon request. The ground plane has to be covered with absorbing material.
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Measurement
Power Meter
Power Meter is used for determining the power of the electrical current coming to the input channels of ADC modules and FFT spectrum analyzers, or that of the electromagnetic signal.
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Solder Cup Connector Kit
Y1141A
Used to build custom cables for 34951, 34952 – 50-pin Dsub male – 125 V.
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Solder Cup Connector Kit
Y1140A
Used to build custom cables for 34922, 34924 – 78-pin Dsub female – 60 V
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Temperature measurement
Thermometers and transmitters for the process industry. Endress+Hauser offers a complete assortment of compact thermometers, modular thermometers, thermowells, measurement inserts, transmitters and accessories for all types of process industries such as Oil & Gas, Chemicals, Food & Beverage, Life Sciences, Primaries & Metal, Power & Energy.
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Measurement Module
Micro/2000®
The Micro/2000® chlorine analyzer from Wallace & Tiernan® systems is used with either the MFC electronics or the new SFC electronics.
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Measurement Software
Revolutionary, industry-standard, easy-to-use 3D measurement software and CAD modules.
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Ambient Measurement
A measurement of the concentration of a substance or pollutant within the immediate environs of an organism; taken to relate it to the amount of possible exposure.
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37-Pin D-Type Female Solder Pin HV
40-960-037-F-HV
This connector is designed to allow users to directly terminate cables with soldered connections.
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Measurement & Test
Electronic test engineers use a variety of precision instruments for R&D, vendor verification, and production testing. ETPS can supply a number of general test instruments that can be used in stand alone mode or automated for high throughput testing. Dedicated battery test systems with automatic charge and discharge modes with data logging are available. The standard 16 and 32 channel systems have range up to 5VDC ensuring their suitability for a wide variety of cells.
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Resistance Measurement
PROMET
High-precision micro-ohm measuring systems with adjustable DC test current for determining resistances on circuit breakers or inductive loads such as transformers, for example. The high-precision ohm meters of the PROMET series are used to determine very low electrical resistances in the µΩ range. The adjustable test current of up to 600 A in combination with a four-wire measuring method delivers measurement results which meet stringent accuracy requirements. State-of-the-art power electronics c...show more -
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Gain-Compression Measurements
S96086B
The S96086B, gain compression measurements provides fast and accurate characterization of input power, output power, gain, and phase at the compression point of an amplifier, over a specified frequency and power range, with a simple setup
