Showing results: 556 - 570 of 692 items found.
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E-CAM130_TRICUTX2 -
e-con Systems Inc.
e-CAM130_TRICUTX2 (TRICamera) is a multiple camera solution for NVIDIA® Jetson TX2 developer kit that consists of three 13 MP 4-Lane MIPI CSI-2 camera board and an base board to interface with the J22 connector on the Jetson TX2. Each camera is based on the camera module e-CAM137_CUMI1335_MOD, 1/3.2" AR1335 color CMOS image sensor from ON Semiconductor® and integrated high performance Image Signal Processor (ISP).
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Hilkar
Line and load reactors are generally serial-connected to the input and/or output terminals of three phase equipment such as motor speed controllers, inverters and UPS systems. These equipment make use of semiconductor switches such as IGBTs, thyristors, and diodes and therefore create harmonic distortion and high switching over-voltages (dv/dt). Use of such equipment has been becoming more widespread as the technology advances. However, the negative effects of these equipment should not be overlooked.
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Hilkar
Line and load reactors are generally serial-connected to the input and/or output terminals of three phase equipment such as motor speed controllers, inverters and UPS systems. These equipment make use of semiconductor switches such as IGBTs, thyristors, and diodes and therefore create harmonic distortion and high switching over-voltages (dv/dt). Use of such equipment has been becoming more widespread as the technology advances. However, the negative effects of these equipment should not be overlooked.
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786320-01 -
NI
1-Slot, 100 MVector/s PXI Digital Pattern Instrument - The PXIe‑6571 is designed for semiconductor characterization and production test. It includes the Digital Pattern Editor for configuring pin maps, specifications, levels, timing, and patterns. It also includes debugging tools … like Shmoo, digital scope, and viewers for history RAM, pin states, and system status. The PXIe-6571 requires a chassis with 82 W slot cooling capacity, such as the PXIe-1095.
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Tokyo Seimitsu Co., Ltd.
The requirement for the wafer quality is getting higher and the condition of wafer edge is getting more important. The edge grinders “W-GM series” process edge grinding of various kind of materials such as Silicon, sapphire and SiC.As a solution for that, Our W-GM series are highly rated among manufactures of silicon, compound materials and other wafer shaped materials. Wafer edge grinding machine also draws the attention as a solution for the yield loss due to the knife edge of device wafer in the back end process. In the semiconductor manufacturing process, from the wafer manufacturing to the device manufacturing, the quality improvement of wafer edge is necessary in recent years.We make proposals that achieve the improvement of quality, CoO and yield with our machine.
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SPEA S.p.A.
SPEA’s Power Module Test Cells are the complete industrial equipment oriented to the production test requirements of IGBT semiconductor power modules for consumer, transportation, energy production, industrial applications.SPEA’s Power Module Test Cells provide a turnkey solution for the automated handling, contacting and testing of these products, with the capability to force and measure the very high current (up to 1000 A) and voltage (up to 2500 V) values required for a complete, reliable test.
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TopLine Corp.
BGA and CCGA Column Grid Array, solder columns and a wide range of daisy chain semiconductor packages, and test vehicle PC boards. TopLine assists thousands of customers define and refine their SMT and microelectronics assembly processes. ver 1000 different dummy packages and practice kits. Typical applications include machine evaluation, acceptance testing, solder training, temperature profiling, re-certification, prototype design, practice and demonstrations.
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Ansys Corporation
Continual advances in semiconductor technology enable transformational products for artificial intelligence, machine learning, 5G, automotive, networking, cloud and edge compute applications. Ubiquitous connectivity, low latency and faster data rates enable billions of smart devices. These devices rely on advanced, low-power FinFET designs and state-of-the-art 2.5D/3D integrated circuit (IC) packaging technologies to deliver the required power, performance, area and reliability goals.
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60-310-102 -
Pickering Interfaces Ltd.
The 60-310 is a 2-pole Matrix Module available in 300x2, 200x2 and 100x2 formats. It is capable of cold switching 1000VDC and has a maximum carry current of 1A. It is designed for high voltage applications including circuit board isolation testing, relay testing, semiconductor breakdown monitoring and cable harness insulation testing. The 60-310 is designed in accordance with the LXI Standard 1.4 and is supplied in a 2U high, full rack width case with 500mm depth.
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AM3200-Series -
Maury Microwave Corporation
AMCAD Engineering has created professional, industry-proven pulsing technology for both standalone IV-testing (Pulsed IV, PIV) as well as pulsed-bias load pull (Pulsed Load Pull, PLP) and high-voltage power semiconductor applications. Systems come equipped with a mainframe controller which includes integrated power supplies. Input and output pulser modules (probes, pulsers) are selected for specific applications and are available in bipolar ±25V/1A and high-voltage 250V/30A models.
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Zygo Corporation
ZYGO nano-position sensors are widely used in closed-loop motion control systems like photolithography and semiconductor inspection tool stages, as well as for deformable optical systems. We have pioneered innovations in the displacement and position sensors for over 30 years, and we work closely with applications requiring the highest precision and reliability. Our team of applications experts is ready and able to help you tackle your position metrology needs.
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E-CAM130_CUXVR -
e-con Systems Inc.
e-CAM130_CUXVR is a synchronized multiple 4K camera solution for NVIDIA® Jetson AGX Xavier™ development kit that has up to four 13 MP 4-Lane MIPI CSI-2 camera boards. Each camera is based on the camera module e-CAM137_CUMI1335_MOD, 1/3.2" AR1335 color CMOS image sensor from ON Semiconductor® and integrated high performance Image Signal Processor (ISP). All these four cameras are connected to the base board using 30 cm micro-coaxial cable. These four 4-lane MIPI camera modules can be synchronously streamed in 4K resolution, which will be best fit for high end multi camera solution. Customers can opt to purchase anything between single camera to four cameras as according to their requirement.
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e-CAM31_MI0330_MOD -
e-con Systems Inc.
e-CAM31_MI0330_MOD is a high performance, small form factor, 3.4 MP Autofocus Low Light Camera Module with Liquid Lens. It is based on AR0330 CMOS Image sensor from ON Semiconductor®. This Autofocus Liquid Lens Camera Module has slave mode for precise frame-rate control and for synchronizing two sensors. e-CAM31_MI0330_MOD – Liquid lens camera module has superior low light performance. It supports Full HD @ 60fps for maximum video performance. It also has a support for external mechanical shutter and an on-chip phase-locked loop (PLL) oscillator. The dedicated ISP performs the entire Auto functions like auto white balance, auto exposure control in addition to complete image signal processing pipeline.
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E-CAM55_CUMI0521_MOD -
e-con Systems Inc.
e-CAM55_CUMI0521_MOD is a small form factor, 5 MP fixed focus camera module based on AR0521 CMOS image sensor from ON Semiconductor® has a dedicated, high-performance Image Signal Processor chip (ISP) on-board that performs all the Auto functions (Auto White Balance, Auto Exposure control) in addition to complete image signal processing pipeline that provides best-in-class images and video. This low light camera module can stream uncompressed VGA (640 x 480) at 75 fps, HD (1280 x 720) at 100 fps, 1280 x 960 at 75 fps, FHD (1920 x 1080) at 65 fps, 2560 x 1440 at 38fps, 2592 x 1944 at 28 fps.
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New Jersey Micro Electronic Testing, Inc.
NJMET is proud to provide procurement and testing services to the commercial, military, aerospace, industrial automotive and medical industries. We also provide custom engineering consultation services. NJMET Inc. is AS9100/ISO9001:2008 certified and has recently successfully completed of The Defense Logistic Agency’s (DLA) laboratory suitability assessment and is qualified to test federal stock classes (FSC) 5961 (Semiconductor Devices) and FSC 5962 (Microcircuits) to DLA’s QTSL test requirements.
