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Showing results: 571 - 585 of 592 items found.

  • Ultra-Compact Immunity Tester

    AXOS8 - Laplace Instruments Ltd.

    The AXOS8 is an ultra-compact immunity tester that performs all the most commonly used transient immunity tests, including Surge, EFT, Dips/Interrupts and AC/Surge Magnetic Field. The simplified user interface provides quick selection of tests and test levels, and even lets you change test parameters “on the fly” while running a test.The actual EUT power mains voltage and current are indicated in the display. Using the Electronic-Fuse function, the user can set an upper limit for EUT power mains current. This feature is useful to protect the EUT from unnecessary damage.Whether you test to the IEC 61000 series “CE Mark” standards, the IEC 60601 Medical Device standards, or any number of telecom and product specific standards, the AXOS8 tester is your one stop test station for everything from precompliance to full compliance to product development testing.A wide range of cost-efficient Coupling / Decoupling Networks for symmetrical and asymmetrical data- and signal-lines is available as an option.

  • 4 Digit Temperature Meter (5 Channels)

    CM1-TX5 - Chuan Sheng Electronics Co., Ltd.

    RS-485 Modbus RTU protocol (with communication LED indicator)RS-485 address 1~255Communication Baudrate 9600, 19200, 38400, 57600, 115.2KParity check N81, N82, E81, O81Input 5 channels of signal selectable:thermocouple/PT100.5 channels of input can be set to play 1~10 seconds loop display.1~5 channels of display value limits can be set, and the number of channels of carousel display screens can be set by yourself.5 channels of input signals with LED unit cycle display.Standard 2 groups of alarms Hi, LO with communication LED indicators to ensure the normal operation of the field system.Suitable for HVAC refrigeration and air conditioning PLC, DDC, PC brands to achieve remote real-time monitoringCan be used in solar panels, medical control, clean room, ice water host, boiler, motor, chemical plant, power plant, school energy-saving control, remote control of power monitoring panel

  • PICMG 1.3 Half-size CPU Card With LGA1150 4th Gen Intel® Core™ I7/i5/i3 & Celeron® Processor, Intel® Q87, SATA3, USB 3.0, DVI-I/LVDS And Dual LANs

    SHB230 - Axiomtek Co., Ltd.

    The SHB230 is high-performing PICMG 1.3 half-size single board computer.The SHB230 based on the Intel® Q87 PCH is designed to support 4th Generation Intel® Core™ i7/i5/i3 and Celeron® processors (codename: Haswell/Haswell Refresh) in the LGA1150 socket.The slot CPU card is equipped with two DDR3-1333/1600 SO-DIMM sockets with up to 16 GB memory capacity to meet customers needs.The PICMG 1.3 specification brings advantages of PCI Express to this single board computer that offers four PCIe x1 or one PCIe x4, and one PCIe x16 routed to the backplane.The onboard two SATA interfaces support RAID 0/1 functions to ensure reliable storage for multiple applications.Utilizing with the latest Intel® technologies, this PICMG 1.3 system host board is an ideal solution for DVR, medical equipment, industrial automation, process control, and network security market.

  • COM Express Type 6 Compact Module With Intel® Atom® X5 And X7 Processor

    CEM312 - Axiomtek Co., Ltd.

    The CEM312 supports Intel® Atom® x5 and x7 processors in a board size of 95 x 95 mm. It has two 204-pin DDR3L-1600 SO-DIMMs with up to 8GB of system memory and an optional eMMC for a maximum of 64GB memory. The COM Express Type 6 module is integrated with Intel® Gen 9 graphics and supported with DX12.0, OCL 2.0 and OGL 4.3 for immersive graphics and media performance with a resolution up to 4K. Moreover, the industrial grade system on module can operate under wide temperature ranging from -40 to 85°C (-40°F to 185°F). The Intel® Atom®-based computer module also offers diverse comprehensive I/O interfaces to meet requirements for a variety of industrial applications. The CEM312 can serve as an excellent solution for graphics-intensive, industrial IoT applications such as industrial control, medical imaging, digital signage, gaming, military, and networking.

  • Microelectronics And Packaging AOI

    Machine Vision Products

    Machine Vision Products, Inc. has extensive experience in a wide range of Microelectronics and Packaging applications. MVP works with the world’s leading manufacturers on a global basis. From multiple die and wire technologies to leadframe, ball grid array and surface inspection applications, MVP has the widest applications toolbox of any AOI provider. MVP takes pride in the fact that they supply many complex inspection solutions to diverse industries such as Automotive, Telecoms, Medical Devices, Military, and Space. MVP’s 900 Series is the base platform upon which all Microelectronics and Packaging inspection solutions are based. The 900 series 2D capabilities provide metrology and defect detection using a propriety Quad-Color lighting, Telecentric optics and resolutions down to 1um. 3D height measurement capabilities allow for in-line high speed inspection of Dies, paste deposition, positional accuracy, volume and height with a resolution down to 1.13um.

  • ATX Motherboard With LGA1151 Socket 7th/6th Gen Intel® Core™ Processor, Intel® H110, USB 3.0, SATA 3.0, Dual LAN, VGA, DisplayPort, HDMI And MSATA

    IMB501 - Axiomtek Co., Ltd.

    The IMB501 is powered by the LGA1151 socket 7th/6th generation Intel® Core™ i7/i5/i3, Pentium® & Celeron® processors with Intel® H110 chipset. The IMB501 utilizes two high bandwidth 288-pin DDR4-2400/2133/1866 with system memory up to 32GB to meet the needs for high memory capacity and high data transfer speed. The upcoming industrial-grade ATX motherboard offers long-term support and upgradeability that can ensure the best performance and lifespan for its extended industrial computer system. To allow flexible and rapid development of custom functions, the industrial-grade ATX motherboard comes with rich expansion options including one PCIe x16 slot, two PCIe x4 slots (only support x1 signal), four PCI slots, and one PCI Express Mini Card slot. The ATX mainboard is suitable for industrial automation, factory automation, advanced communication, gaming, entertainment, POS/kiosk, surveillance, medical, just to name a few.

  • 3.5” Embedded SBC With Intel® Atom® X5-E3940 Processor, LVDS, HDMI, 2 GbE LANs And Audio

    CAPA310 - Axiomtek Co., Ltd.

    The CAPA310 features the onboard quad-core Intel® Atom® x5-E3940 processor (codename: Apollo Lake). The fanless small form factor embedded board is highly reliable with an extended operating temperature range of -40°C to +80°C and a wide range power input of 12V to 24V DC. This industrial-grade 3.5-inch embedded board is feature-rich and expandable, with stunning graphical performance. The CAPA310 is a highly versatile platform designed for Industrial IoT and intelligent systems such as industrial automation, self-service terminals, digital signage, POS/kiosk displays, medical, and more. To ensure flexible configuration and expandability, the CAPA310 has an emphasis on expandability with a full-size PCIe Mini Card slot and an optional ZIO connector for additional PCIe, LPC, USB and SMBus. Additionally, this compact embedded board features the Intel® integrated Gfx graphic engine to deliver high-resolution HD support for display interfaces: HDMI, LVDS and optional VGA. It is perfectly suited for gaming and signage applications.

  • High-Resolution Thermographic Camera

    Ceres T 640 Series - Xenics

    The Ceres T 640 series is based upon the Dione 640 OEM thermal imaging core with 640×480 pixels and 12 µm pixel pitch and NETD of less than 50 mK. The camera offers superior on-board thermographic performance (accuracy, stability) in the temperature range up to 400 °C.The Ceres T 640 camera outputs full frame images at 60 Hz via either a CameraLink or GigE Vision interface – all GenICam compliant.The compact size and excellent thermographic stability and accuracy, and GenICam compliant interfacing allow for easy integration in demanding industrial thermography applications.The camera offers one standard option of lens and thermal calibration pack.The compact Ceres T 640 series find application in process monitoring, medical and scientific and advanced research.Benefits & Features• Compact size and high-performance• Superior on-board thermographic performance (stability, accuracy)• GenICam compliant• Uncooled operation

  • Compact, Industrial Thermal Camera

    Ceres V 640 Series - Xenics

    The Ceres V 640 series is based upon the Dione 640 OEM thermal imaging core with 640×480 pixels and 12 µm pixel pitch and NETD of less than 40 mK (available upon request) or 50 mK. The camera offers superior thermal imaging capabilities, thanks to the state-of-the-art microbolometer detector and on-board image processing.The Ceres V 640 camera outputs full frame images at 60 Hz via either a CameraLink or GigE Vision interface – all GenICam compliant.The compact size Ceres V 640 series offers excellent image quality and find applications in industrial machine vision, medical, scientific and security thermal imaging systems.The camera offers either a no lens configuration or with different HFOV (Horizontal Field-Of-View) options.Benefits & Features• Compact and high-resolution• Superior on-board image processing performance (optimized image quality)• GenICam compliant• Uncooled operation

  • COM Express Type 6 Basic Module With Intel® Xeon® And 6th Gen Intel® Core™ I7/i5/i3 Processor, Intel® CM236/QM170/HM170

    CEM500 - Axiomtek Co., Ltd.

    The CEM500, a COM Express Type 6 basic module, is based on the 14 nm Intel® Xeon® processor E3-1505M v5 and 6th generation Intel® Core™ i7/i5/i3 processor (codename: Skylake-H) with Intel® CM236/QM170/HM170 chipset. The outstanding Intel® Gen 9 HD Graphics enables the CEM500 driving multiple 4K displays without the need of a discrete graphics card. Two DDR4-2133 SO-DIMM supporting up to 32 GB system memory capacity and four SATA-600 with RAID 0, 1, 5, and 10 are available. Additionally, the rugged COM Express computer-on-module Type 6 supports an industrial operating temperature range of -40°C to 85°C for applications in extreme harsh environment. With its full solid, outstanding computing performance and low power consumption design, the CEM500 is targeted at telecommunication, medical imaging, digital signage, gaming machines, military, human machine interface, industrial automation controllers and IIoT applications.

  • Compact, High-resolution Thermal Camera

    Ceres V 1280 Series - Xenics

    The Ceres V 1280 series is based upon the Dione 1280 OEM thermal imaging core with 1280×1024 pixels and 12 µm pixel pitch and NETD of less than 40 mK (available upon request) or 50 mK. The camera offers superior thermal imaging capabilities, thanks to the state-of-the-art microbolometer detector and on-board image processing.The Ceres V 1280 camera outputs full frame images at 60 Hz via either a CameraLink or at 45 Hz via a GigE Vision interface – all GenICam compliant.The compact size Ceres V 1280 series offers excellent image quality and find applications in industrial machine vision, medical, scientific and security thermal imaging systems.The camera offers either a no lens configuration or with different HFOV (Horizontal Field-Of-View) options.Benefits & Features• Compact and high-resolution• Superior on-board image processing performance (optimized image quality)• GenICam compliant• Uncooled operation

  • 3.5” Embedded SBC With AMD® RYZEN™ Embedded V1807B/V1605B APU, DisplayPort, 2 HDMI, LVDS And 4 GbE LAN

    CAPA13R - Axiomtek Co., Ltd.

    The CAPA13R is powered by the onboard AMD RYZEN™ Embedded V1807B/V1605B processor with Radeon™ Vega graphics. The 4K embedded board is well-suited for graphics-intensive applications such as medical imaging, video surveillance, 3D simulators, optical quality control, digital signage, kiosks/POI, thin clients, and more. The integrated AMD RadeonTM RX Vega graphics with support of DirectX 12 and OpenGL 4.5 marks the cutting edge of embedded graphics. The CAPA13R can deliver truly impressive user experiences and outstanding 3D graphics quality through two HDMI, one DisplayPort and one LVDS interfaces. Its onboard CPU is attached on the rear side of the board, which can aid with heat dissipation and offers flexibility for easy system integration and minimum maintenance. Moreover, the CAPA13R offers multiple expansion interfaces with one M.2 Key E slot for wireless modules and one M.2 key B slot for storage cards. One 260-pin SO-DIMM socket on the CAPA13R supports up to 16GB of DDR4-2400 (V1605B) and DDR4-3200 (V1807B) memory. The system has a +12V DC power input.

  • COM Express Type 6 Basic Module With Intel® Xeon® E3/7th Gen Intel® Core™ I7/i5/i3 Processors And Intel® CM238/QM175/HM175

    CEM510 - Axiomtek Co., Ltd.

    The CEM510 is based on the Intel® Xeon® E3 and 7th generation Intel® Core™ i7/i5/i3 processors with Intel® CM238/QM175/HM175 chipset. The 125 x 95 mm system-on-module was designed for graphics-intensive applications over the Industrial IoT, including industrial control, medical imaging, digital signage, and gaming machines. The embedded module is equipped with dual 260-pin DDR4-2133 SO-DIMM slots with up to 32GB system memory. Its wide operating temperature range of -40°C to +85°C strengthens the adaptability of various harsh conditions. For evaluation and development purposes, Axiomtek also has the CEB94011, a carrier board designed to operate with the CEM510 for additional I/O and expansions interfaces. Integrated with Intel® Gen 9 graphics, and with the support of DX12.0, OCL 2.0 and OGL 4.3, the module presents excellent graphics performance with resolution up to 4K (3840 x 2160 @ 30 Hz). Three independent displays are supported through LVDS and three DDI ports supporting HDMI, DisplayPort, and DVI (one DDI supporting optional VGA).

  • PICMG 1.3 Full-size CPU Card With LGA1150 4th Gen Intel® Core™ I7/i5/i3 Processor, Intel® Q87, SATA3, USB 3.0, DVI-D, VGA, DisplayPort And Dual LAN

    SHB130 - Axiomtek Co., Ltd.

    The PICMG 1.3 full-size CPU card, SHB130, designed for the new architecture 4th Generation Intel® Core™ processors (codename: Haswell/Haswell Refresh) with Intel® Q87 chipset on 22nm technology using LGA1150 socket. The outstanding SHB130 with new Intel® architecture delivers up to double the graphics performance over the previous generation. The new graphics solution has high levels of integration to enable new form factors and designs with excellent visual quality built in. In addition, The PICMG 1.3 full-size CPU card comes with two DDR3 1333/1600 MHz unbuffered ECC DIMM slots up to 16 GB of system memory and six SATA 6Gbps ports with RAID 0, 1, 5, 10. The PCI Express 2.0 available on the new Intel® Core™ processor provides flexible x16, x4 or x1 lanes for versatile applications. The high performance SHB130 with improved graphics ability is ideal for applications such as network security, storage server, POS, kiosk, medical, gaming, digital signage, and surveillance security monitoring.

  • AERINOS Sigfox IoT

    Infinite Industrial Informatics Lt

    Sigfox is a communication protocol that is used to read data from sensors through a fixed network of base stations. It works like a low cost “SMS” service. As an end-user, you only need to buy a subscription to connect to the data network operated by SIGFOX. Sigfox employs a proprietary Ultra Narrow Band (UNB) radio technology that enables communication using the Industrial, Scientific and Medical ISM radio band, which uses 868MHz in Europe and 902MHz in the US. It has the advantage of covering larger areas than other fixed local systems.The overall Sigfox network topology has been designed to provide a scalable, high-capacity network, with very low energy consumption, while maintaining a simple and easy to rollout star-based cell infrastructure. The density of the cells in the Sigfox network is based on an average range of about 30-50km in rural areas and in urban areas, where there are usually more obstructions and noise is greater, the range may be reduced to between 3 and 10km.According to the latest numbers, Sigfox has a nationwide live coverage in 6 countries and in 14 other countries it is deploying and rolling out ts network. By end 2018, the ambition is to cover 60 markets.

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