Showing results: 241 - 247 of 247 items found.
-
AIM GmbH
AIM’s Fibre Channel test, simulation and analysis modules use our field proven Common Core hardware design giving you the best performance, best feature set and highest functional integration on the market. The use of SoC (System on Chip) based core designs with one dual core RISC processor per port, massive and scalable DDR3 memory and IRIG-B time encoder/decoder functions are standard. The new ultra high performance intelligent 4-lane PCIe 2.0 interface modules offer 2 ports with full function test, simulation, monitoring and analyzer functions for Fibre Channel networks. The dual core processor provides onboard processing and data transfer capabilities for the most demanding Fibre Channel applications including upper layer protocol support done on board level. Large and high data throughput DDR3 RAM is accessible for the onboard processor as is a high performance FPGA implementing the customized Fibre Channel interfaces enabling the board to analyze incoming and modify outgoing data in real time. Each module provides 2 Fibre Channel compliant full duplex ports, implementing the full link level services. SFP cages make it suitable for different media types as optical or electrical network technologies. Ports operate either in Traffic Simulator or Analyzer/Monitor mode with support for port related Frame Statistics. Sophisticated packet capturing mechanism and monitoring features are complimented with powerful triggering and filtering capabilities.
-
AIM GmbH
> ARINC818 is a specification which has become an Industry standard for the transmission of uncompressed digital video. This commercial standard uses Fibre Channel as a point-to-point communication link for low latency with the ARINC818 defining the packetized protocol for transmission of the digital video information. It is highly flexible and can be used for a variety of onboard display systems in both commercial and military applications. AIM’s ARINC818 cards use our field proven Common Core hardware design giving the best performance, best feature set and highest functional integration on the market. The use of SoC (System on Chip) based core designs with one dual core RISC processor per port, massive DDR3 memory and IRIG-B time encoder/decoder functions are standard. The ARINC818 modules are available in PCIe formats.The new ultra high performance intelligent 4-lane PCIe 2.0 interface modules offer 2 ports with full function test, simulation, monitoring and analyzer functions for ARINC818 interfaces. The dual core processor provides onboard processing and data transfer capabilities for the most demanding applications including ARINC818 support done on board level. Large and high data throughput DDR3 RAM is accessible for the onboard processor as is a high performance FPGA implementing the customized ARINC818 Interfaces enabling the board to analyze incoming data in real time. Each module provides 2 ARINC818 compliant ports. SFP cages make it suitable for different media types as optical or electrical network technologies. Each module is delivered with a Board Support Package (BSP) containing the onboard driver software, a full Application Programming Interface (API) and detailed getting started and programming guides. Powerful PBA.pro databus test and analysis software is optionally available for all our ARINC818 cards.
-
MIC-6330 -
Advantech Co. Ltd.
Based on the Intel® Xeon® E3 Lv5 and Lv6 embedded platform, the MIC-6330 builds on the success of Advantech’s 6U VPX boards, and is the first 3U VPX product launched by Advantech. Together with the Intel® processor, the MIC-6330 offers intense computational ability in a very compact form factor. The MIC-6330 provides configurable connectivity (up to four ports) of PCI Express via the backplane to the highest performance mainstream peripherals and I/O cards, and vast I/O functions for extended interconnectivity and controllability. The MIC-6330 meets various computing needs, including vPro™ and workstation capabilities, by using the Intel® CM236/CM238 PCH. The MIC-6330 offers high storage capacity at up to SATA 6Gbps transfer speed. Four USB2.0 ports and one USB 3.0 port to the backplane fulfill requirements for extra I/O ports or storage, up to 5Gbps data rate. Four GbE ports (two ports configurable as SERDES) support system level IP connectivity, and the UART interfaces (RS-232/422/485 selectable) can be leveraged as an interface to legacy devices and consoles. Like Advantech’s 6U VPX products, the MIC-6330 supports multiple displays, and the maximum resolution of the MIC-6330 is 4K, empowered by the Intel® integrated graphics engine. The MIC-6330 also offers a High Definition Audio to the backplane interface for media demands. With the standard ruggedized convection cooled heatsink or the optional air-cooled heatsink, the MIC-6330 is tailored for harsh environmental applications and adaptable to various chassis designs. The industrial NAND Flash, and the soldered onboard DDR4 ECC memory chips are appropriate for a variety of vehicle applications for the maximum reliability. The MIC-6330 is sophisticated and suitable for various purposes. An onboard X8D XMC site with PCIE x8 gen.3 connectivity can host high speed offload or I/O mezzanines for project-specific applications. For applications that need the maximum expandability, the XMC interface can be modified to add another DisplayPort and the 2 more UART. The optional front I/O module facilitates the development and qualification process, and also enables the possibility of the front panel access.
-
MIC-6311 -
Advantech Co. Ltd.
Advantech’s MIC-6311 is a single processor VPX blade based on the 4th generation Intel® Core™ i3/i5/i7 platform. It enables the highest performance available in 6U VPX form factor with two SRIOx4 ports in the VPX data plane and two PCI Express x8 gen. 3 lanes in the VPX expansion plane for workstation and compute intense applications. The two Serial RapidIO ports offer the possibility to interface the MIC-6311 to digital front ends such as DSP and FPGA cards via a high speed, low latency deterministic interconnect. In addition, PCI Express ports with up to 8GB/s throughput offer a high performance interface to mainstream peripherals and IO cards. With a SO-DIMM socket and additional soldered, onboard DRAM with ECC in a dual channel design running up to 1600MT/s, the MIC-6311 offers the ability to fit harsh environments while maintaining maximum memory throughput and supporting memory expansion using the latest SO DIMM technology. Moreover, the 4th generation Intel® Core™ processors offer increased cache size and efficiency as well as instruction set improvements which make the MIC-6311 a high performance compute engine with outstanding floating point and vector processing performance. Tailored for rugged environments, MIC-6311 has been designed to support ruggedized convection cooled heat sinks. Additionally, it implements an onboard soldered, industrial SSD for maximum reliability. By using the latest powerful PCH (Lynx Point) from Intel®, with its advanced SATA controller advanced storage options are supported such as a 2.5" SATA III HDD/SSD socket offering high storage capacity with up to 6Gbps transfer speed. A CFast socket provides an alternative for implementing a cost efficient, pluggable SSD. An onboard XMC/PMC site with PCIe x8 gen.3 connectivity can host high speed offload or I/O mezzanines. Two USB 3.0 ports in front panel can connect to the external devices with up to 5Gbps data rate. Network and remote connectivity can be achieved via a RS232 console (RJ45) and two GbE RJ45 ports, powered by Intel®’s latest Gigabit Ethernet Controiller, the i350. The processor’s integrated enhanced graphics engine Iris offers up to 2x the graphic performance compared to previous generation solutions. Triple independent display support can be implemented by using the MIC-6311’s VGA front panel port and two Display port / HDMI interfaces on rear transition modules. Audio port support via the backplane interface enhances media support. Three SATA ports (SATAIII) and four USB ports (2x USB 3.0, 2x USB 3.0) are also connected to backplane to fulfill the demand for extra IO ports or storage. Two GbE/ SERDES ports support system level IP connectivity and two UART interfaces can be leveraged to interface to legacy devices and consoles.
-
MIC-6314 -
Advantech Co. Ltd.
The MIC-6314 is Advantech’s next generation single processor 6U VPX blade, based on the 4th/ 5th Generation Intel® Core™ embedded platform with increased cache size and efficiency, as well as instruction set improvements. The MIC-6314 provides two configurable PCIE x 8 ports in the VPX data plane and two PCI Express ports x8 lanes in the VPX expansion plane to enable the highest performance available in the 6U VPX form factor compute intense applications. These PCIE interfaces offer high speed up to PCIE gen. 2 (5Gb/s) throughput, low latency, scalable, error recoverable deterministic interconnectivity to the mainstream peripherals and I/O cards such as DSP and FPGA cards. The PCIE widths and ports on the data plane and the extension plane of MIC-6314 is user configurable, which make MIC-6314 capable to replace the PCIE switch blade in a small system. With a SO-DIMM socket and additional soldered, onboard DRAM with ECC in a dual channel design running up to 1600MT/s, the MIC-6314 can be integrated into various harsh environments while maintaining maximum memory throughput, and supports memory expansion by using the latest SO-DIMM technology simultaneously. Tailored for harsh environments, the MIC-6314 has a native ruggedized convection cooled heat sink adaptable to various chassis environments; with the alternated optional air cooled heat sink, additional I/O is provided on the front panel. An onboard soldered, industrial SSD is included for maximum reliability, and a SSD socket is also available for a cost-efficient, modular storage. By using Intel®’s powerful PCH (Lynx Point) with its advanced SATA controller, the MIC-6314 offers high storage capacity at up to 6Gbps transfer speed. An onboard XMC site with PCIe x8 gen.3 connectivity can host high speed offload or I/O mezzanines. Two USB 3.0 ports on the front panel can connect to external devices with up to 5Gbps data rate. Network and remote connectivity can be achieved via a RS-232 console (RJ-45) and two GbE RJ-45 ports, powered by Intel®’s latest Gigabit Ethernet controller. The Intel® next generation graphics engine Iris Pro offers up to 2x the graphic performance compared to previous generation solutions. Triple independent display support can be implemented by using VGA and 2 DVI ports on MIC6314. Audio is powered by a ALC892 controller via the backplane interface, and provides media support. A PCIEinterface is reserved for the optional M.2 high speed storage.Besides the modern M.2 storage, three SATA III one SATA II and four USB ports (2x USB 3.0, 2x USB 3.0) are also connected to the backplane to fulfill the demand for extra IO ports or storage. Four GbE ports (two SERDES selectable) support system level IP connectivity, and four UART interfaces (RS232/422/485selectable) can be leveraged to interface to legacy devices and consoles.
-
MIC-6313 -
Advantech Co. Ltd.
The MIC-6313 is Advantech’s next generation single processor 6U VPX blade, based on the 4th/ 5th Generation Intel® Core™ and Intel® Xeon® Processor E3 Lv4 embedded platform. To enable the highest performance available in the 6U VPX form factor for workstation and compute intense applications, the four Serial RapidIO ports in the VPX data plane offer high speed up to 5Gb/s, low latency, scalable, error recoverable deterministic interconnectivity to digital front ends such as DSP and FPGA cards. In addition, two PCI Express ports x8 lanes in the VPX expansion plane, with up to PCI Express gen. 2 (5Gb/s) throughput offer a high performance interface to mainstream peripherals and I/O cards. With a SO-DIMM socket and additional soldered, onboard DRAM with ECC in a dual channel design running up to 1600MT/s, the MIC-6313 can be integrated into various harsh environments while maintaining maximum memory throughput, and supports memory expansion by using the latest SO-DIMM technology simultaneously. In addition, the 4th/ 5th generation Intel® Core™ and Xeon® E3 Lv4 embedded processors offer increased cache size and efficiency, as well as instruction set improvements, which make the MIC-6313 a high performance compute engine with outstanding floating point and vector processing performance. Tailored for harsh environments, the MIC-6313 has a native ruggedized convection cooled heat sink adaptable to various chassis environments; with the alternative optional air cooled heat sink, additional I/O is provided on the front panel. An onboard soldered, industrial SSD is included for maximum reliability, and a CFast/ SSD socket is also available for a costefficient, modular storage. By using Intel®’s powerful PCH (Lynx Point) with its advanced SATA controller, the MIC-6313 offers high storage capacity at up to 6Gbps transfer speed. An onboard XMC site with PCIe x8 gen.3 connectivity can host high speed offload or I/O mezzanines. Two USB 3.0 ports on the front panel can connect to external devices with up to 5Gbps data rate. Network and remote connectivity can be achieved via a RS-232 console (RJ-45) and two GbE RJ-45 ports, powered by Intel®’s latest Gigabit Ethernet controller. The next generation graphics engine Intel® Iris Pro offers up to 2x the graphic performance compared to previous generation solutions. Triple independent display support can be implemented by using the MIC-6313’s DVI front panel port and two DVI interfaces on rear transition modules. Audio is powered by a ALC892 controller via the backplane interface, and provides media support. Four SATA ports (SATAIII) and four USB ports (2x USB 3.0, 2x USB 3.0) are also connected to the backplane to fulfill the demand for extra IO ports or storage. Four GbE ports (two SERDES selectable) support system level IP connectivity, and four UART interfaces (RS232/422/485 selectable) can be leveraged to interface to legacy devices and consoles.
-
Xeltek
Features:Until now,Support IC manufacturer, pcs devices and keeps growing.1)High speed thanks to the flexible hardware engine. Programming speed adjustable for complicated application environments brought by user target board, length of ISP cable etc.2)Stand-alone and PC-Hosted (USB2.0 High Speed) dual mode;3)Supports ISP programming of devices with I2C, SPI, UART, BDM, MON, MW, JTAG, CAN, ICC, RS232 and any other serial port.4)ATE interface;5)Over-current and ESD protection to protect your equipment;6)DLL and API for easy integration into customers’ system.Hardware Specifications:1) ISP cable integrates I2C, SPI, UART, BDM, MON, MW, JTAG, CAN, ICC, RS232 interfaces。2) VDD (0-5.5V /0.5A) and Vpp (0-15V / 0.2A) lines provided to power the target board and the target devices.3) Cable driver circuit supports target devices of voltage level 1.5-5V and is ESD protected.4) USB 2.0 (high speed) interface for PC hosted mode and management of project files on SD card.5) A 20 Characters x 4 lines LCD and a 6-key keypad are built with it for stand-alone operation. In stand-alone mode project files are stored on the SD card (up to 16GB). The number of the project files is limited only by the capacity of the SD card.6) ATE interface is built for easy external hardware control. 6 lines SEL0-SEL5 are for project selection (maximum 64 files); 2 command lines START and STOP; 3 STATUS lines PASS, FAIL and BUSY. All signals are optical-isolated.7) A universal AC adaptor of DC12V/2A is included for power supply.8)WINDOWS XP/Vista/Win7/Win8/Win10 32/64bit compatibility.Software Specifications:1) Supports almost all devices with ISP interface.2) Supports Jam and Staple files from ACTEL and ALTERA; Direct C files from ACTEL.3) Programming speed selectable (High, Normal and Low) for complicated applications such as different cable lengths, different target load characters.4) Dynamic buffer function. Application examples include device S/N, MAC address, frequency or transducer calibration etc.5) File format on SD: FAT16, FAT32.6) Functions for IP protection: Project security, SD security, batch control, administration management etc. 7) API and DLL provided for easy integration into customers’ system like ICT and ATE.8) Software provides the features for multiple units to work concurrently controlled by USB HUB.Applications:1)R&D application like in-circuit test and debug.2)Volume production. Devices may be programmed after the board is fully assembled. One example is the serial number writing to an on-board serial device.3)Field application. Comes with portability, stand-alone mode and mobile data storage media (SD card), it is suitable for field test, debug and data acquisition.4)Third application modules. Friend s/w interface (DLL and Virtual Com communication command set) and h/w interface ( ATE and USB) are provided and make it very easy for customers to integrate ISP01 as a functional module into their systems. One example is the ICT equipment. With this integration user can finish in-circuit test and in-circuit programming in one step.
