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- Virginia Panel Corporation
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Ultrasonic Generators
F&K Physiktechnik develops and manufactures fully digital ultrasonic generators. Ultrasonic power levels are available for fine wire bonding as well as for heavy wire and die bonding applications. All generators could be used with our ultrasonic transducers, but also with third party transducers.
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Radar solution for fill level in DC & die casting
For quality control in DC casting (direct chill casting) and die casting, a continuous, high-precision level control of the steel and aluminum melt in the casting pit is required. Our radar sensors measure the filling level of molten steel, copper or aluminum in DC casting with a measurement accuracy in the sub-millimeter range – even at metal temperatures of up to 1600 degrees Celsius.
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Ultra Broadband SSPA
Exodus Advanced Communications
Exodus Chip & Wire Hybrid ultra broadband amplifiers feature GaN, GaAsFET discrete die on ceramic substrate covering frequency ranges from 4GHz to 26.5GHz and power levels exceeding 500W.
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Wafer Test
Silicon Turnkey Solution, Inc.
Most foundries provide wafers already probed to a set of DC parameters at room temperature to ensure they meet a basic subset of the package-part specification. Beyond this basic set of tests, more rigorous testing is often needed to meet specifications requiring die to be 100 percent probed, identify and segregate devices with higher performance levels and guarantee that parts will perform to a certain specification level.
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Mid-end
Growth in the advanced packaging market and the challenges raised by the various packaging types requires the highest level of inspection and metrology, ensuring high yields of each die as well as of the whole package.
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Wafer/Chip/Package Semi-automated ESD Tester
400SW
Tokyo Electronics Trading Co., Ltd.
Semi-automated ESD tester featuring Ecdm 400E, Universal ESD Simulator. Used with a manual wafer probing system or a die manipulator, wafer or die level semi-auto ESD test can be done, as well as packaged device test. Damage is detected by V-I curve or leakage current change detection. Stress level and measurement points are programmed by personal computor via GP-IB. Once test terminals are selected, ESD endurance is automatically measured.
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Local and Lattice Stress Measurement
127 Raman
Local and Lattice Stress Measurement, Die level Topography for in-die and in-device stress and composition control.
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Probe Series
CAPELLA Series
MPI Photonics Automation is the industry leading provider of turnkey test solutions for the LED / Mini LED manufacturing industry. With more than 10,000 MPI probers installed worldwide, the CAPELLA series of probers have a proven track record of superior performance and reliability. The CAPELLA series probers support electrical and optical characterization of all LED product types (Vertical chip, Lateral chip, Flip-chip) from wafer to packaged die level. Whether you need a high-performance, cost-effective or specialty prober system, MPI PA has the most comprehensive range of LED wafer/chip probers to meet your exacting requirements.
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Open-source CAD tool to simulate 2D and 3D-ICs.
IntSim v2.0
Simulate and optimize 2D and 3D-ICs. Pre-silicon estimates for die size, number of metal levels, size of each metal level and chip power.
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Gas Analysis
Our infrared gas detectors provide superior sensitivity and reliability that may be translated into a more effective early warning system when monitoring atmospheres for gases at trace levels. Our technology also offers the opportunity to perform sophisticated gas analysis. One example: To assure personal safety during a medical procedure, our gas detectors deliver a precise monitoring of the ratio of exhaled gases of a hospital patient who is under general anesthesiology. Another example, no canary need die in a mine if Dexter gas detectors are installed on the job. Infrared lead detectors, whether mobile or mounted, can be a critical element in your health and safety strategy at home and on the job, whatever life forms it is your responsibility to protect.
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Die Test Handler
3112
Chroma 3112 is a productive pick & place handler for high volume single- or multi-site bare die testing.
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Radarlösungen für die Landwirtschaft
OndoSense Radarsensoren tragen dazu bei, die Produktivität Ihrer Landmaschinen und den Ertrag Ihrer Felder zu erhöhen, den Einsatz von Dünger oder Pflanzenschutzmitteln zu verringern sowie Arbeitsprozesse in der Landwirtschaft zu automatisieren und zu optimieren.
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Drawing Die And Wire Measurement
Wire Diameter And Roundness Measurement
Optik Elektronik Gerätetechnik GmbH
The DGMS is a measuring system for diameter and roundness of wires, drawing dies and enameling dies. The wire diameter is measured highly accurate by an image processing system. To measure the roundness, an additional special holder is necessary to rotate the wire for the diameter measurement in several azimuths. The accuracy of the measurement is ‹1micron.
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Inspection System for Die Casting
X-eye 7000BS
Appropriate for medium•large size component inspection and detecting surface structure and defects(inside voids and cracks etc).Due to high-energy, high-power Micro-focus X-ray Open Tube, maintenance cost's reduced significantly and enables long-term use with only replacing consumables.Customization is available with selecting main parts by customers depends on their needs for size and material.
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Wafer & Die Inspection
SemiProbe wafer inspection system (WIS) examines, locates and identifies defects created during wafer manufacturing, probing, bumping, dicing or general handling. This provides microelectronic device manufacturers with accurate, timely quality assurance and process information. The WIS has single sided and double sided wafer mapping capabilities and can improve efficiency, reduce manufacturing costs, increase yields and shorten time to market.
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Die Cast Products
Astronics’ start-to-finish die casting, CNC, painting, and finishing provides customers with vertically-integrated manufacturing. Close collaboration between customers and our in-house multidisciplinary teams reduce manufacturing time and delivery lead times.
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Patented DPEM Process for Die Removal
DPEM (Decapsulate Plastic Encapsulated Module) is DPACI’s patented Turn-Key Solution to replacement of obsolete high reliability devices in legacy systems. From dissolving the plastic encapsulation of a semiconductor device to re-bonding new wires onto a chip or package lead frame, complete solutions are offered. DPACI retains reliability test data as well as customer testimonials for the process and can share this information on a need-to-know basis.
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Laser Levels
Shenzhen UYIGAO Electronic Technology Co., Ltd
UYIGAO laser level is a construction tool which measures levelness by projecting a red or green light beam onto a flat surface. Laser levels are used to deduct how level or straight a surface is by projecting a light beam across or around it.
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Level Controllers
Measure and control fluid levels in a contained area or facilitate automatic filling and emptying operations with Omega's dependable single and multi-sensor level controllers.
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Laser Levels
Fast, accurate and portable, PLS laser levels save time and money versus traditional layout methods using a bubble vials, plumb bobs or complex measurements. Compare the benefits PLS laser tools: Beam quality will be bright, thin and crisp. Drop tested with water and dust Ingress Protection (IP). Designed for the professional contractor with self-leveling technology. Green Laser Levels, Rotary Lasers, Point Lasers and Line and Combo Lasers.
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TOOL STACK (DIE)
CASTING AL PASTE
Pigmented paste, provided with:Elevated sliding power Very high anti-sticking capacityHigh consistency also at high process temperatures.
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Exposure Level Tester
ELT-400
*Wide frequency range (1 Hz - 400 kHz)*Standard-compliant measurement*Acceptance measurements compliant with CE standard IEC/EN 62233 and Generic Standard IEC 62311*Limit value traces conforming to ICNIRP 1998, 2010 and EMF Directive 2013/35/EU*Real time measurement with RMS and peak detectors*External FFT signal analysis for determining the frequency components via three channel analog output (one channel for each spatial axis) e.g. with the aid of a digital oscilloscope.
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Bi-Directional Level Translator
IFB-10001
Easily connect Arduino or other 5V microcontrollers to ~3.3V sensors. Based on the TI TXB0108 auto-sensing, bi-directional level translator, this module provides access to all 8 channels of the TXB0108 and has a built-in 300mA LDO with 200mV max dropout voltage at full load. Regulated 3.3V output allows this single board to both interface withandpower 3.3V sensors. An important feature of this module is the ability to operate SPI and other digital lines (not including I2C) at high-speed, whereas the 'NXP level shifter' maxes out at 400kHz and resistor dividers fail much earlier. The TXB0108, integrated with the LP3981 LDO, provide a fast, reliable solution to mismatched interface voltages that exceeds the performance of other solutions.
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Level Monitoring
Magnetic level switches are used for the monitoring and control of liquid level in tanks. These level switches are specifically manufactured to customer specifications. The float switches are manufactured with a hermetically sealed contact which is located within the guide tube. The float sliding on the tube contains a ring magnet which activates the sealed contact in a non-contacting fashion. The sealed contacts are available as SPST (N/O or N/C) or SPDT (N/O + N/C). The float sliding up and down on the guide tube is the only moving part on the M-series magnetic float switches.
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Signal Level Meters
GAOTek offers a wide range of high performance and inexpensive TV and CATV signal level strength meters. TV signal strength meters and testers are required when installing or maintaining analog TV and digital TV systems and closed CCTV systems. The devices can effectively and accurately measure the analog channels and digital channels signal strength and are the preferred choice of TV installation technicians.
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Paper Die Cutter
The Paper Die Cutter is used for preparing the standard specimens for ring crush test, tensile test or others. The precise cutting mechanism with a sharp blade is helpful to make your specimen easily.
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Level Test Set
ET 91
100 Hz to 2.4 MHz selective/wideband Level Meter & Generator,with Spectrum Analyser and Z/RL/LCL Bridge
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Hydrostatic Level Sensor
2250
The Signet 2250 Hydrostatic Level Sensor for level and depth control has a one-piece injection-molded PVDF body and ceramic diaphragm for superior compatibility in corrosive liquids. Utilizing hydrostatic pressure, the 2250 Level Sensor disregards false level signals from steam vapors, foam or any other debris on the liquid surface. Two pressure ranges allow for optimal resolution matched to your sensing needs. Solid state circuitry eliminates drift (no internal potentiometers).
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Ultrasonic Level Measurement
Ultrasonic technology is a perfect choice for level applications that require low cost, non-contact measurement of liquids and slurries for level, distance, volume and open channel flow. These products have excellent accuracy and will handle measurements up to 30’.
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Entry Level OTDR
palmOTDR-S120 Series
● The cost effective and the fully functional OTDR ● Graphic display of test results PC Software Download ● Quick start: <5 seconds USB Driver Download ● Perfect user interface, handheld & lightweight (1kg) ● Hotkeys: Easy to use, push-and-test ● 1000 test records storage ● Bellcore file format (.sor) ● PC software for batch data processing ● USB data interface, driver-free ● Multiple languages: EN/DE/IT/FR/ES/PT/RU/KR/VN/CN etc. ● 10 hours continuous operation with battery ● Dust-shock proof (2m drop test)
