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Compression

the result of being pressed.

See Also: Force, Crimp Force, Pull Force, Pull off Force, Push Pull Force, Peeling, Tension, Crush, Extensometers, Bending


Showing results: 316 - 330 of 340 items found.

  • Rubber Testing Equipment

    Dongguan Amade Instruments Technology Co., Ltd

    Rubber testing equipment are used to test the physical properties, chemical properties, thermal properties of uncompounded and compounded rubbers at prescribed conditions to help manufactures or researchers in comprehending the characteristics, updating the formula and improving product quality. Including volatile component, ash content, Mooney viscosity, vulcanization curve, Mooney scorch time, hardness, tensile properties, tearing, the compression performance, impact, friction resistance, fatigue resistance, peel strength, vertical & horizontal combustion, smoke density, limiting oxygen index, the flame spread rate, the surface resistance, surface resistivity, volume resistivity, the breakdown voltage, dielectric strength, dielectric loss, antistatic properties, Aging test (UV, Xenon lamp, carbon arc lamp, ozone) etc.

  • Low Gauge Vacuum Tester

    G4103 - Gunson

    Suitable for use on all petrol engines and easily fits to most vehicles. Accurately measures pressures within the range minus 1 bar (30mHg) to plus 0.7 bar (10psi). Applications include: Engine Fault Finding, by using the gauge as an inlet manifold vacuum tester the following faults can be diagnosed: spark misfires, poor engine compression, mixture tool weak or too rich, ignition too advanced or too retarded, inlet manifold and carburettor air leaks, incorrect valve timing. Turbo boost gauge; testing boost pressure up to 0.7bar (10psi) and Petrol Pump Tester; tests electrical and mechanical petrol pumps (excluding high pressure pumps used on fuel injection engines)

  • Universal Testing Systems up to 600 kN (135,000 lbf) Force Capacity

    5980 Series - Instron

    5980 Floor Model Testing Systems are universal, static testing systems that perform tensile and compression testing; and also perform shear, flexure, peel, tear, cyclic, and bend tests. The 5900 Series are engineered for precision, built for durability, and offer the flexibility for changing requirements. They are designed with standard and optional features that increase testing efficiency and improve the testing experience for the operator. 5980 floor models are robust, heavy-duty frames commonly used for testing high-strength metals and alloys, advanced composites, aerospace and automotive structures, bolts, fasteners, and plate steels. Frames are available in load capacities of 100, 150, 250, 400 and 600 kN; and several variations are available to accommodate requirements for both extended travel and extra wide test space.

  • Wafer Bonder

    AML - OAI

    Wafer bonding has found many applications in the field of MST, MEMS and micro engineering. These include the fabrication of pressure sensors, accelerometers, micro-pumps and other fluid handling devices. The process is also used for first-order packaging of silicon microstructures to isolate package-induced stresses. The OAI AML Wafer Bonder facilitates both the alignment and bonding to be performed in-situ, in a high vacuum chamber. For anodic bonding the wafers are loaded cold and heated in the process chamber. For high accuracy alignment the wafers are aligned and brought into contact only after the process temperature has been reached, thus avoiding differential thermal expansion effects which can compromise alignment. The AML Wafer Bonder is excellent for anodic bonding, silicon direct and thermal compression bonding applications. These features enable the bonder to be used with virtually any processing tool.

  • Single Space Electro-hydraulic Servo Universal Testing Machine

    WAW-F Series - Jinan Testing Equipment IE Corporation

    WAW-F series single space Servo-Hydraulic Testing System Computerized is suitable for testing tension, compression and other strengths of various metallic or nonmetallic materials with high strength. The ultra-large testing space & dual-action actuator with longer stroke enable it to test not only standard specimen, but also longer ones with long elongation every so often. Equipped with the electronics, computer &software packages, it is capable of controlling the test procedures by the predetermined programs. The Servo-Hydraulic Testing System Computerized can also display, record, process and print the test results. The test curves can be drawn automatically in real time. The Servo-Hydraulic Tester of Single Space is easy to operate and is versatile in the applications of metallurgy manufacturers such as steel mills & alloy, reinforced bar, aircraft industry, research institutes, laboratories, calibration institutes etc.

  • Spring Fatigue Testing Machine

    TPJ Series - Jinan Testing Equipment IE Corporation

    Model TPJ Series Mechanical Computer Control Spring Fatigue Testing Machine is mainly used for the fatigue properties of all kinds of coil springs, disc springs, shock absorbers, and seal springs etc. The Spring Fatigue Testing Machine consists of motor, reducer on the connecting cams to drive the connecting rod and make reciprocating motion achieve the compression fatigue movement. The Spring Fatigue Testing Machine is efficient without any pollution to the environment. Equipped with different accessories, the Spring Fatigue Testing Machine can test springs of different sizes. Adopting the single-chip machine control, the Spring Fatigue Testing Machine realizes auto stop function when it reaches the preset test times. The Spring Fatigue Testing System is widely used in quality controls for spring, shock absorber production, and relevant applications.

  • Wafer Bonding Systems

    EV Group

    ith over 15 years experience in designing and manufacturing precision wafer bonding equipment, EVG wafer bonding systems are well recognized in setting industry standards for the MEMS production industry. Besides supporting wafer level and advanced packaging, 3D interconnects and MEMS fabrication, the EVG500 series wafer bonding systems can be configured for R&D, pilot-line or volume production. They accommodate the most demanding applications by bonding under high vacuum, precisely controlled fine vacuum, temperature or high pressure conditions. Multiple bonding methods including anodic, thermo compression, glass-frit, epoxy, UV and fusion bonding are covered. Based on a unique modular bond chamber design the EVG500 series allow for an easy technology transfer from R&D to high volume production.

  • Universal Signal Conditioner

    Model UDA - tecsis LP

    Model UDA is a universal signal conditioner and amplifier designed for use with all full bridge, strain gage-based transducers. Model UDA turns the analog signal into a user-selectable output of ±5Vdc, ±10Vdc, or 4-20mA. This versatile unit features selectable excitation of 2.5 or 5.0Vdc bridge voltage and has a wide DC power input range from 11 to 28Vdc to adapt to a variety of installations. Model UDA includes a wide zero and span adjustment range and a symmetry adjustment for applications requiring precision in both tension and compression. The configurable low pass filter actively removes unwanted high frequency signal components. The unit is housed in a rugged DIN-mountable enclosure with screw terminals to provide connection for power, analog output, shunt calibration, and sensor signals.

  • Machine Vision Camera - 0.4 MP, 291 FPS, Sony IMX287, Color

    Blackfly S GigE - Teledyne FLIR

    The Blackfly® S leverages the industry’s most advanced sensors in an ice-cube form factor. It is packed with powerful features enabling you to easily produce the exact images you need and accelerate your application development. This includes both automatic and precise manual control over image capture and on-camera pre-processing. On-camera features including IEEE1588 clock synchronization and full compatibility with popular third-party software supporting GigE Vision, gives system designers the tools to quickly develop innovative solutions. GigE models featuring Lossless Compression (LLC) are also available with higher maximum frame rates and lower bandwidth requirements, helping maximize output without compromising image quality. The Blackfly S is available in GigE, USB3, cased, and board-level versions.

  • High Temperature Self-Supporting Furnace Extensometers (1200 C)

    Model 3448 - Jinan Testing Equipment IE Corporation

    Epsilon developed this unique high temperature extensometer for testing metals, ceramics, and composites at the high temperatures produced by furnaces and induction heating systems. A combination of features make these extensometers easier to use and better in performance than other similar high temperature extensometers.The units are held on the specimen by light, flexible ceramic fiber cords. These make the extensometer self-supporting on the specimen. No furnace mounting brackets are required. The side load on the test sample is greatly reduced because of the self-supporting design and light weight of the sensor. Most materials testing furnaces with a side cut-out for an extensometer will readily accept a Model 3448. For induction heating systems, a different ceramic cord placement allows the extensometer to easily pass between the coils.The combination of radiant heat shields and convection cooling fins allow this model to be used at specimen temperatures up to 1200℃ (2200°F) without any cooling. An optional tiny air fan does enhance stability at the highest temperatures and is recommended for the highest accuracy and for tests with small elongations. The fan comes with a magnetic base for support so it can be mounted at any convenient location near the extensometer. Fan cooling is not generally needed for induction heated systems. High purity alumina ceramic rods are used. These are available in lengths as required to fit your furnace. A spare set is included with every extensometer. Specify chisel, vee chisel or conical contact points as desired.Most units operate equally well in tension and compression. Thus tensile, compression and cyclic tests like low cycle fatigue can all be performed with a single unit.For vacuum furnaces, special models are available. Epsilon can also provide a radiant heat transfer cooled version. This requires that the extensometer module be surrounded by a water cooled enclosure with a front slot for the ceramic rods.

  • Paper & Packaging Testing Equipment

    Dongguan Amade Instruments Technology Co., Ltd

    Packaging testing equipment are intended to measure the resistance of corrugated containers to various crushes and burst at given conditions, applied to bursting strength test, ring crush test, edge crush test, flat crush test, pin adhesion test, puncture strength test, bending stiffness test, corrugating medium test, compression test, damp-proof test etc. As corrugated boxes assume the important responsibility of loading and protecting goods playing an inevitable role in modern logistics, so the properties of corrugated boards have to be mastered by manufacturers and users prior to use. The physical performances which are measured by a series of testings are core factors for judging the quality of packaging boxes. Paper testing items mainly include quantification, thickness measurement, whiteness, smoothness,breaking elongation, burst resistance, folding resistance, stiffness, tearability, degree of sizing, etc.

  • 6U VPX FPGA Cards

    Curtiss-Wright Defense Solutions

    FPGAs have revolutionized the way digital signal processing (DSP) subsystems are configured. With a large number of gates, hardware multipliers, and high-speed serial interfaces, FPGAs enable sophisticated applications, including radar, signal intelligence, and image processing, which rely on repetitive processing that can be expressed in highly parallel form. FPGAs perform exceptionally well in FFTs, pulse compression, filters, and digital up/down converters. In deployed systems, an FPGA's technical advantage translates to smaller, lower power, and lower-cost systems. Our COTS 6U VPX FPGA cards include multiple FPGAs, a wide complement of I/O functionality and are engineered to succeed in the most demanding applications. When supercomputing processing performance is required, HPEC systems meet the most demanding rugged deployed application needs by combining the highest performance FPGAs, GPGPUs, processors, and networking modules available.

  • Spectrum Analysis

    S95090B - Keysight Technologies

    The S95090B spectrum analyzer (SA) measurement software adds high-performance microwave spectrum analysis to PXI VNAs. With fast stepped-FFT sweeps resulting from optimized data processing, the SA software application provides quick spurious searches over broad frequency ranges. The S95090B software uses the PXI network analyzer's test and reference receivers to complete simultaneous spectrum measurements. Multi-channel SA measurements leverage the PXI VNA's internal swept-signal generators for efficient measurements of spurious signals emanating from mixers and frequency converters. The S95090B spectrum analyzer software application employs source-power and receiver-response calibration as well as fixture de-embedding, providing in-fixture and on-wafer spectrum measurements with the highest level of accuracy. Optional external attenuators should be connected with the VNA’s test ports to avoid receiver compression when measuring large signals.

  • High Temperature Clip-On Gages (700 C)

    Model 7641 - Jinan Testing Equipment IE Corporation

    These COD gages use a high-temperature capacitive sensor and do not require any cooling. They will operate up to the maximum temperature limit of most environmental chambers used in materials testing. The Model 7641 is ideal for determination of fracture mechanics parameters such as JIC, KIC, R-curve, fatigue crack growth rate (da/dN), and testing to standards such as E1820, E399, E647, etc. All units can be displaced slightly in compression for ease of installation. The COD gage is supplied with the advanced DT6229 controller. The standard output is 0-10VDC analog signal, factory calibrated with the COD gage. This system provides a number of functional enhancements, including: high speed digital output, built in calibration and tare functions, analog and digital filters, and more. The 7641 is readily interfaced with most existing test controllers, and may be directly connected to a data acquisition system or chart recorder, or directly to a PC. The 7641 may be used for strain controlled tests such as JIC.

  • Universal Tensile Testing Machines

    Dongguan Amade Instruments Technology Co., Ltd

    Universal tensile testing machines are testing equipment that are used to conduct mechanical testings of static load, tensile, compression, bending, shearing, tearing, stripping, applied to plastic sheets, pipes, tapes, rubbers, electric wires, springs, sponges, fibers etc. Tensile test is performed to measure and analyze the physical performances of different types of materials and finial products, playing an important role in developing new materials and controlling products quality. From the perspective of function, universal tensile testing(UTM) machine is an omnipotent instrument Just as the name implies. Clamps or fixtures are interchangeable on the basis of different test pieces, enabling various testings to be carried out on one tensile testing instrument. Options of single-column stand or twin-column stand can be available based on the specimen’s tensile/compressive force and dimension. Computerized tensile tester is preferred rather than microprocessor version If users want testing results including curve graphics between time, force and displacement.

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