Showing results: 46 - 52 of 52 items found.
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ELMA Electronic, Inc.
Elma offers a comprehensive range of standard, modified standard and custom packaging solutions with integrated backplane, power and cooling for; 19" rack-mount, test/development, and field deployable applications. Supporting the full range of VITA, PICMG and Small Form Factor architectures Elma has configurations based on VME, VME64x, OpenVPX, AdvancedTCA, CompactPCI, CompactPCI-Serial and COM Express.
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ELMA Electronic, Inc.
Packaging solutions engineered using modular design methodology providing countless combinations of card slot count, backplane architecture, power, cooling, height and depth leading to reduced cost, lead-time and program risk. Standard options from 1U through 14U to house: VME, VME64x, OpenVPX, CompactPCI/CompactPCI-Serial and AdvancedTCA architectures. From commercial grade to MIL-STD applications, Elma’s packaging solutions provide your systems the protection you need.
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Vadatech Inc
VadaTech has one of the most extensive portfolios of A/D and D/A converters in the industry, in a range of form factors and a variety of channel and sampling rate options to meet all your data acquisition needs. Our ADC and DAC are widely used in high energy physics, military, aerospace and industrial applications thanks to variants based on MicroTCA.4, MicroTCA.0, FMC, OpenVPX and AdvancedTCA (ATCA).
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AMC113 -
Vadatech Inc
AMC113 is VadaTech second generation PCIe expansion module. The AMC113 is a high-speed 20Gbps bridge from the host PCIe bus to VadaTech’s other carrier and Rear Transition Module (RTM) products such as the ATC104/114/118/117/119, ART114, μTCA chassis, etc. The different carriers host different I/O modules such as PMC/PrPMC, AMC, PCI-X and PCIe edge modules. This concept allows any of the available I/O modules in these standard form factors to be integrated quickly and easily into an AdvancedTCA or μTCA subsystem.The AMC113 allows expansion among multiple μTCA chassis or
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W-IE-NE-R, Plein & Baus GmbH
To match the requirements of the next generation of “carrier grade” communication equipment the PCI Industrial Computer Manufacturers Group PICMG created in 2002 a new standard AdvancedTCA / ATCA. The ATCA crate backplanes are based mainly on 48V industrial power supplies. From this form factor evolve the Advanced Mezzanine Module carrier card AMC form factors defined in AMC.3 in types of single or double width.
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DP7000 -
Guzik Technical Enterprises
The DP 7000 Digital Processor with 40/100G Ethernet or 169G Interlaken protocol compatible MPO/MTP® Optics, designed for evolving markets such as Real-Time Stream Processing for High-speed Data-acquisition (DAQ), High Performance Computing (HPC), Machine Learning, Data Center Infrastructure, AI Processing and Network applications. The board is 8U form factor, 322.25 mm x 280 mm x 6 HP (L x W x H), single slot AXIe or AdvancedTCA® blade, ideal for multi-slot 19″ rack mount system integration. In AXIe form factor it provides up-to Gen3 PCIe® backplane connectivity.
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PCI113 -
Vadatech Inc
PCI113 is VadaTech second generation PCIe expansion module. The PCI113 is a high-speed 20Gbps bridge from the host PCIe bus to VadaTech’s carrier and Rear Transition Module (RTM) products such as the ATC104/114/118/117/119, ART114, μTCA chassis, etc. The different carriers host different I/O modules such as PMC/PrPMC, AMC, PCI-X and PCIe edge modules. This concept allows any of the available I/O modules in these standard form factors to be integrated quickly and easily into an AdvancedTCA or μTCA subsystem. The PCI113 allows expansion among multiple μTCA chassis or expansion into other chassis that are not ATCA or μTCA based.The PCI113 is a single module PCIE based on the PCISIG specification. The PCI113 provides a PCIe x4 link infiber/copper via front panel QSFP. The dual front I/O allows expansion into two separate systems independently. The upstream port must not have spread spectrum PCIe clock enabled.
