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Wafer Bonding Systems
ith over 15 years experience in designing and manufacturing precision wafer bonding equipment, EVG wafer bonding systems are well recognized in setting industry standards for the MEMS production industry. Besides supporting wafer level and advanced packaging, 3D interconnects and MEMS fabrication, the EVG500 series wafer bonding systems can be configured for R&D, pilot-line or volume production. They accommodate the most demanding applications by bonding under high vacuum, precisely controlled fine vacuum, temperature or high pressure conditions. Multiple bonding methods including anodic, thermo compression, glass-frit, epoxy, UV and fusion bonding are covered. Based on a unique modular bond chamber design the EVG500 series allow for an easy technology transfer from R&D to high volume production.
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Bond Inspection
Increasingly thin wires, finer pitches, as well as more applications of thick wire for higher capacities are among the current trends in wire bonding. At the same time, the requirements for robust and defect-free bonds are increasing, for example in assistance systems in the automotive sector and in RF modules in the 5G mobile communications network. This makes reliable inspections extremely important.
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AC Hipot w/ Ground Bond Test Capability
HypotULTRA® Series
In a world where data is king, HypotUTLRA improves traceability with on-board data storage and allows you to automate hipot testing with a variety of communication interfaces. Increase efficiency with our direct barcode scanner connection and intuitive touch screen interface. Models 7804 and 7854 are a 4-in-1 solution with the addition of 40A AC Ground Bond test capability added to HypotULTRA's already impressive feature list. HypotULTRA is a dielectric analyzer designed to take your production line to the next level.
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Scott Internal Bond Impact Tester
The Scott Internal Bond Impact Tester is used to determine tear resistance (Elmendorf). A sample is torn with the help of the pendulum device starting from a predetermined cut. The work required for a tear of a given length is measured.
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Bond Force Measurement And Calibration Systems
BFS-20
Based on its design and easy handling it can be used also on other brands to measure the bond force.
