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Product
Infrared Camera for CO Detection and Electrical Inspections
FLIR GF346
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The FLIR GF346 optical gas imaging camera detects carbon monoxide (CO) and 17 additional gases without the need to interrupt your plant's production process. CO emissions can be a significant threat to primary steel manufacturing operations; even the slightest leak in a vent stack or pipe can have a devastating effect. With the FLIR GF346, inspectors can scan large areas from a safe distance, pinpointing leaks in real-time, reducing repair down-time, and providing repair verification.
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Product
Automation Systems
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We design automated systems applying innovation and creativity, adding value to the production processes of our clients and partners. Due to the synergies obtained between our engineering teams, we develop integral automation projects, with improved, more efficient and optimized industrial processes.
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Product
Wafer Lifetime Measurement with Photoluminescence Detector
WCT-120PL
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Measure the calibrated carrier-recombination lifetime of a silicon wafer using both the standard method and the photoluminescence meth
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Product
Boresight Systems
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Boresight is a process to align optical axis of single system or a series of optical or electro-optical systems with a certain reference optical axis or mechanical axis. Proper boresight is particularly critical in case of multi-sensor electro-optical surveillance systems built from a series of systems like thermal imager, VIS/NIR camera, SWIR camera, laser range finder, laser pointer.
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Product
Wafer Mapping Sensor
M-DW1
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Panasonic Industrial Devices Sales Company of America
To provide better safety and improved sensing accuracy, Panasonic studied the requirements for future Wafer Mapping Sensors to ultimately develop the LED Beam Reflective Type Wafer Mapping Sensor, M-DW1. This Sensor uses LEDs as a light source for safe operation and a 2-segment receiving element for higher accuracy in wafer detection.
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Product
Automated Optical Inspection
AOI
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No complex assembly process is complete without the ability to inspect and characterize the many different components used. ficonTEC’s fully automated INSPECTIONLINE systems acquire high-resolution pictures of the surfaces of interest and performs optical inspection based on the user’s criteria. For example, facet inspection of laser diodes, QC for coatings, surface inspection, top/bottom/side-wall inspection of semiconductor chips, and die sorting are just some of the many inspection tasks performed routinely by ficonTEC’s suite of inspection tools. As for all of ficonTEC’s systems, a modular approach permits the inspection platform to equipped with additional features – automatic tray handling and various feeding philosophies, testing capabilities (e.g. LIV), top/bottom chip inspection, and in-situ labelling.
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Product
Defect Inspection and Review
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KLA’s defect inspection and review systems cover the full range of yield applications within the chip and wafer manufacturing environments, including incoming process tool qualification, wafer qualification, research and development, and tool, process and line monitoring. Patterned and unpatterned wafer defect inspection and review systems find, identify and classify particles and pattern defects on the front surface, back surface and edge of the wafer. This information allows engineers to detect, resolve and monitor critical yield excursions, resulting in faster yield ramp and higher production yield.
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Product
Multi-Mission System
Improved Shadow® Tactical Unmanned Aircraft Systems
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With more than 30 years of unmanned aircraft systems (UAS) experience, Textron Systems' Shadow® is the most reliable and capable tactical UAS to help you accomplish your missions. The battle-proven system has surpassed 1.25M hours in flight, supporting global military operations for countless U.S. troops and their allies. Our multi-mission systems are paired with Textron Systems' interoperable Universal Ground Control Station (UGCS) and remote products for collaboration across the battle space.
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Product
Magnetic Particle Inspection Systems for Non-Destructive Testing (NDT)
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VERIFY SURFACE AND SUBSURFACE STRUCTURAL INTEGRITY IN: Industrial Crankshafts, Ferrous Parts, Aircraft Components, Landing Gear Components.
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Product
Advanced 3D Automatic X-Ray Inspection
V810 S2EX
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V810 is "3D Automatic X-ray inspection System" that corresponds to the double side mounting SMT-PCB that is not able to be checked by a transmission-type X-ray machine. It has the ability to detect a wide range of defects, and It have 100% complete defect detection capability in the Hip-defective.And, it is the inspection machine of world's highest level that combines the ability of the ultra-fast test speed and the lowest false call positives further.
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Product
Fiber End-Face Inspection Interferometer
CLEAVEMETER 3D
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The CLEAVEMETER 3D™ is a non-contact interferometer designed for inspecting the end-faces of cleaved or polished optical fibers with cladding diameters of 125 µm to 1200 µm. It gives immediate and precise information on important end-face properties such as flatness, perpendicularity, hackles and dust. Based on the NYFORS CLEAVEMETER 3D™ design, in addition to producing sharp fringe patterns it also generates three-dimensional images of the cleaved fiber end.
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Product
Survey Systems
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Pair the Smart Chamber with a gas analyzer of your choosing and connect using your mobile device or laptop via the built-in Wi-Fi web server. See live flux data with a LI-COR gas analyzer or connect to a third-party analyzer and the chamber will log GPS and ancillary data for your flux measurements.
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Product
3D Inspection Software
Metrolog X4
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Metrolog X4 architecture is designed not only to benefit from current computer and OS technologies (Windows 64-bit, and multiprocessor PCs) that significantly increase the performances and throughput of your Metrology software, but is also aimed at simplifying your day-to-day measurement work. Metrolog X4 is a perfect Point Cloud software able to analyze large data size. High Performances in Point Cloud analysis: Large Data file import (CAD files, Point clouds, ...)
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Product
Wireless Crane Systems & Crane Systems
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Ningbo Yaheng Electronic Technology Co.,Ltd
YEAHEVER Wireless Crane Systems & Crane Systems
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Product
System
SYS-28
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This 28" box coater has a separately ventable top chamber, to allow for faster parts changes and increased productivity. It also is equipped with our FTC-620 flip controller. The flip and rotation motors can be seen on the top. This system uses a Varian tri-scroll pump and a bottom mounted 16" APD cryopump.
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Product
In System Programmers
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In-circuit serial programming, also known as in-system programming (ISP) or in-circuit programming (ICP) enables programming and reprogramming of microcontrollers, serial EEPROMs and flash memories already soldered on a target PCB.
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Product
IR Inspection System
EVG®20
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The EVG 20 offers a fast inspection method, especially for fusion bonded wafers. A live imageof the entire wafer via IR transmission supports void detection down to a radius of 0.5 mm. The infrared inspection system is a perfect match for fusion bonding processes either as the stand-alone EVG 20 tool or as a station in EVG''s integrated bonding systems.
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Product
Test System
DA-1 ATS
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The DA-1 ATS is an economical Commercial-Off-The Shelf (COTS) build-to-print tester. The test station is compliant with the published drawing package. The system does not include software.
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Product
Sola-Check System
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Flexible and technically superior solution for measuring UV lamps output with spectroradiometer readings. The Sola Scope accurately measures UV light in the range 240nm to 470nm with clear data on both the intensity and wavelength of the UV source. It can be used as a single key operation radiometer or as a high-powered analysis tool supporting graphical analysis.
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Product
Development System
FE-C450
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* Emulates Dallas Semiconductors DS89C450 * 62K Code Memory * Real-Time Emulation * Frequency up to fmax at 5V * Windows Debugger For C/C++ And Assembler * 44-PLCC Emulation Header * Target Board and Programmer Included * RS-232 or USB Interface * 64K C/ASM and 8K C++ Included
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Product
Telemetering System
ZET 7172
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ZET 7172 telemetering system is used to provide wireless access to the instrument line segment using radio channel.
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Product
Automated Optical Inspection
K Series3D
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K Series and K Series3D are the reference in Automated Optical Inspection (AOI), allowing 2D and 3D inspection with very low false calls rate, for both pre-reflow and post-reflow. They are the most powerful gatekeepers to guarantee high quality level for the assembled PCB.
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Product
Intel Systems
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NextComputing appliances and Intel processors are both built at the boundaries of technology and make amazing experiences possible. Leverage these combined solutions to customize your ultimate solution for professional grade computing at lightning speed.
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Product
2D/3D Wafer Metrology System
7980
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Chroma 7980 provides accurate and reliable profile information. 7980 adopts new BLiS technology and specially designed platform to achieve 2D/3D nanoscale measurement.
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Product
Digital Ultrasonic Inspection, Information, storage, and retrieval system
ULTRAPROBE® 3000
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he Ultraprobe 3000 is a digital ultrasonic inspection, information, storage, and retrieval system that comfortably fits in the palm of your hand.
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Product
System Controllers
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Kratos Defense & Security Solutions, Inc.
- Precise and accurate six-axis tracking control- An easy-to-use graphical user interface accessible from anywhere on the network- Optional integrated control capabilities and hardware, such as an integrated spectrum analyzer, beacon receiver, uplink power control, auto acquisition, carrier monitoring & logging, and much more
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Product
Wafer Auto Line Integration
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The line is used for semiconductor wafer grinding. It carries out material matching and distribution, automatic loading and unloading, auto focusing and positioning and many other functions. The grinding precision is 2μm(3-sigma). It is also capable of collecting and analyzing real-time production data and interfacing with MES system.
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Product
Hardware-Software System
Shock Impact Recorder
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This system is complex of recording instruments intended for measurement and recording of shock impact parameters produced by shock testing machines.
