Sapphire
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Product
Edge Grinding Machines
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The requirement for the wafer quality is getting higher and the condition of wafer edge is getting more important. The edge grinders “W-GM series” process edge grinding of various kind of materials such as Silicon, sapphire and SiC.As a solution for that, Our W-GM series are highly rated among manufactures of silicon, compound materials and other wafer shaped materials. Wafer edge grinding machine also draws the attention as a solution for the yield loss due to the knife edge of device wafer in the back end process. In the semiconductor manufacturing process, from the wafer manufacturing to the device manufacturing, the quality improvement of wafer edge is necessary in recent years.We make proposals that achieve the improvement of quality, CoO and yield with our machine.
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Product
Defect Inspection Systems
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Candela® defect inspection systems detect and classify a wide range of critical defects on compound semiconductor substrates (GaN, GaAs, InP, sapphire, SiC, etc.) and hard disk drives, with high sensitivity at production throughputs.
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Product
Pressure Sensors
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ESI Technology manufacture a wide range of pressure sensors using a variety of different technologies. Pressure transducers (voltage output), pressure transmitters (milliamp output), panel meters, accessories. Silicon-on-Sapphire technology and a titanium diaphragm combine to make the new Gold Standard in pressure sensing. Custom pressure measurement solutions have been integral to ESI’s success. All aspects of design and manufacture are done in-house at our UK facility. Impressive quality at an affordable price. So if you don’t see what you are looking for, just ask.
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Product
High Rigid Grinder
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High-rigidity grinder is the device to grind the hard and brittle materials such as sapphire and Sic substrates that are considered to be hard-to-cut materials.
