Computer
Devices that accept and process data in accordance with a stored program, generating results. (atis.org)
See Also: Raspberry Pi, Microprocessor
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Compact Thermal Camera
FLIR C3-X
The FLIR C3-X makes it easier than ever to inspect for hidden problems, document repairs, and share evidence with customers. Featuring a 128 × 96 pixel thermal sensor, MSX® (Multi-Spectral Dynamic Imaging), a 5-megapixel visual camera, and LED flashlight, the C3-X is an affordable inspection tool for electrical/mechanical, building, and maintenance applications. Directly upload and store images to the FLIR Ignite™ cloud, where you can organize and back up files. Instantly share images with customers or create professional reports from a mobile device or computer.
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Isolated Digital Input/Output Cards
PCI-IIRO-8 and PCI-IIRO-16
The PCI-IIRO-8 and PCI-IIRO-16 are low-cost, half-size cards that provide isolated input and output for PCI-Bus computers. The cards have eight or sixteen optically-isolated digital inputs for AC or DC control signals and eight or sixteen electro-mechanical relay outputs. PCI-IIRO-8 occupies four consecutive eight-bit registers in I/O space. PCI-IIRO-16 occupies eight consecutive eight-bit registers in I/O space.
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Product Co. Computer Vision For Elevator Displays
The elevator industry needed a modern solution, as elevator riders do not lose their sense of time and place while they areon their way up and down. The system screens pull interactive and panoramic views of the city that open as the elevator climbs higher.
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COM Express® Basic Size Type 6 Module with Up to Hexacore 8th Gen Intel Core™ 8000 Series and Intel Xeon® Processors (formerly codename: Coffee Lake-H)
Express-CF/CFE
The Express-CF/CFE is the first COM Express® COM.0 R3.0 Basic Size Type 6 module supporting the Hexa-core (6 cores) 64-bit 8th Generation Intel® Core™ and Xeon® processor (codename “Coffeelake-H”) with Mobile Intel® QM370, HM370, CM246 Chipset.
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Medical Box PC Featuring The 12th/13th/14th Gen Intel® Core™ I3/i5/i7/i9 Processor, With Support For MXM GPU Module With Embedded NVIDIA RTX GPU And Thunderbolt™ 4 Port
MLB-3100 with NVIDIA MXM GPU
- ADLINK MXM graphics module support (type A/B, up to 120W TDP based on power supply)- 12th/13th/14th Gen Intel® Core™ i3/i5/i7/i9, Celeron® processor- Dual SODIMM for up to 64GB DDR5 non-ECC memory (depending on CPU)- 1x HDMI 2.0, 5x DisplayPort (1 from CPU, 4 from MXM)- 1x M.2 E-key supporting 1630 or 2230 for Wi-Fi/Bluetooth module, 1x M.2 M-key supporting 2242 or 2280 for SATA/PCIe storage module, 1x M.2 M-key supporting 2242 or 2280 for NVMe & frame grabber- Reliable Molex 24V DC-in connector- 2x 2.5GbE Intel® I225-LM Ethernet Controller
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Flight-Certifiable SBC
SBC314C
The SBC314C flight-certifiable single board computer is engineered in accordance with DO-178C and DO-254 and is available with supporting artifacts. It delivers great and proven performance thanks to the Power Architecture T2081 processor, and its diverse I/O set brings high functionality to the small form factor. The integrated XMC site allows even more connectivity, including high-density MIL-STD-1553 and ARINC 429 data bus communications as well as avionics discrete I/O through our RAR15CX flight-certifiable mezzanine.
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PICMG 1.3 Half-Size Single Board Computers
PICMG 1.3 half-size Single Board Computers (SBC) suit multiple single board computer requirements. The slot SBC cards offer high speed and wide bandwidth computing platforms, with plug & play, providing flexibility in various industrial applications.
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COM Express Rev. 3.1 Basic Size Type 6 Module with 13th Gen Intel® Core™ Mobile Processor
Express-RLP
ADLINK’s Express-RLP COM Express Type 6 Basic size module is based on 13th Gen Intel® Core™ mobile processor (formerly codenamed Raptor Lake-P) and is the first COM Express utilizing Intel’s advanced hybrid architecture (with up to 6 Performance-cores and 8 Efficient-cores) offered with industrial-grade/real-time option to provide superior performance for edge IoT innovations across varied power ranges — at 15W/28W/45W TDP.
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GPIB-USB-HS, USB, IEEE 488 GPIB Instrument Control Device
780570-01
USB, IEEE 488 GPIB Instrument Control Device - The GPIB‑USB‑HS is an IEEE 488 controller device for computers with USB slots. The GPIB‑USB‑HS achieves maximum IEEE 488.2 performance. With no GPIB cable required for instrument connection, you can use the Hi‑Speed USB port to control up to 14 programmable GPIB instruments. This device is completely IEEE 488.2 compatible. The device includes a license for the NI‑488.2 driver software, providing maximum reliability for connecting to third-party instruments with GPIB.
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SMARC Short Size Module with NXP i.MX 8M Mini SoC
LEC-IMX8MM
ADLINK LEC-IMX8MM, the first SMARC revision 2.1 compliant module offering superior power efficiency, is based on the low-power NXP i.MX 8M Mini processor (dual or quad core Arm Cortex-A53) with integrated Vivante GC NanoUltra graphics for improved processing capabilities. The LEC-IMX8MM is your ideal, cost-effective solution for various general-purpose edge and IoT applications.
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CompactRIO Controller
CompactRIO Controllers are embedded controllers with a real-time processor and a user-programmable FPGA. They range from full rugged systems to single-board RIO products that serve as single board computers (SBCs) and system on modules (SOMs).
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COM Express® Compact Size Type 2 Module with Intel Atom® E3800 Series or Intel® Celeron® Processor SoC (formerly codename: Bay Trail)
cExpress-BT2
The cExpress-BT2 is a COM Express COM.0 R2.1 Type 2 module supporting Intel Atom® processor E3800 Series and Intel® Celeron® N2930/J1900 processor SoC (codename: Bay Trail).
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COM Express Basic Size Type 6 Module with 7th Gen Intel® Core™ 7000 Series and Intel® Xeon® Processors (formerly codename: Kaby Lake)
Express-KL/KLE
The Express-KL/KLE is a COM ExpressR COM.0 R2.1 Basic Size Type 6 module supporting the 64-bit 7th Generation Intel Core and Xeon processor E3 (codename "Kaby Lake-H”) with Mobile IntelR QM175, HM175, CM238 Chipset. The Express-KL/KLE is specifically designed for customers who need excellent graphics performance and high-level processing performance in a long product life solution.
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RS-422/485 Serial Communication Card
PCI-COM-1S
The PCI-COM-1S is a single port asynchronous serial communications card that can be installed in any 3.3V or 5V PCI slot computer. The card meets the MD1 PCI Low Profile Specification and is just 4.7 inches long. For low profile systems please use P/N LPCI-COM-1S for the card to be shipped with a low profile bracket.
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SMARC Short Size Module with NXP i.MX 8M
LEC-iMX8M
- Quad Arm® Cortex®-A53 and Cortex-M4- Cryptographic co-processor for end-to-end IOT security- Full 4K UltraHD resolution HDMI 2.0a and dual channel LVDS- Two MIPI-CSI-2 camera inputs- 2x GbE LAN (optional TSN support), USB 3.0/2.0 and OTG- Standard or rugged support: 0°C to 60°C or -40°C to 85°C- 15 year product availability
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R3
R3 - 19'' Rack Mountable DAQ SystemRack mountable DAQ system built into standard PC computer chassis and integrated SIRIUS data acquisition slices. Ready for simple and inexpensive upgrade of PC components.
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AI Computer
The GVC1001 is an ultra-high performance graphics, vision and AI computer aimed at SWaP-sensitive platforms primarily within ground vehicles, aviation, naval, and industrial platforms.
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Medical Box PC Featuring The 12th/13th/14th Gen Intel® Core™ I3/i5/i7/i9 Processors, With Support For MXM GPU Module With Embedded NVIDIA RTX GPU And Thunderbolt™ 4 Port
MLB-3102 with NVIDIA MXM GPU
- ADLINK MXM graphics module support (type A/B, up to 120W TDP based on power supply)- 12th/13th/14th Gen Intel® Core™ i3/i5/i7/i9, Celeron® processor- Dual SODIMM for up to 64GB DDR5 non-ECC memory (depending on CPU)- 1x HDMI 2.0, 5x DisplayPort (1 from CPU, 4 from MXM)- 1x M.2 E-key supporting 1630 or 2230 for Wi-Fi/Bluetooth module, 1x M.2 M-key supporting 2242 or 2280 for SATA/PCIe storage module, 1x M.2 M-key supporting 2242 or 2280 for NVMe & frame grabber- Reliable Molex 24V DC-in con...show more -
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COM Express Mini Size Type 10 Module with Intel Atom® E3800 Series SoC or Celeron Processors (formerly Bay Trail)
nanoX-BT
The nanoX-BT is a COM Express COM.0 R2.1 Type 10 module supporting Intel Atom® processor E3800 Series and Intel® Celeron® N2930/J1900 processor SoC (codename: Bay Trail).
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SMARC Short Size Module With Qualcomm® QRB5165 Series Octa-Core SoC
LEC-RB5N
- Qualcomm® Kryo™ 585 CPU (8x Arm Cortex-A77 cores)- Qualcomm® Hexagon™ Tensor Accelerator (HTA) running up to 15 TOPS- 4K HDMI/MIPI DSI display, MIPI CSI cameras- 2x PCIe x2 Gen3- 2x GbE Ethernet- 2x USB 3.1/2.0 and 4x USB 2.0- GPIO/SD and UFS- 5VDC +/-5% voltage input
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COM-HPC Server Type Size D Module with Intel® Xeon® D-2700 Processor (formerly codename: Ice Lake-D)
COM-HPC-sIDH
ADLINK’s COM-HPC-sIDH COM-HPC Server Type Size D module is based on the Intel® Xeon® D-2700 processor and features integrated high-speed Ethernet for up to 8x 10G or 4x 25G combined with 32 PCIe Gen4 lanes for instantaneous responsiveness and performance. Equipped with Intel® TCC, Deep Learning Boost (VNNI), and AVX-512 technologies for optimal, accelerated AI performance, and support for Time Sensitive Networking (TSN), it offers precise control for hard-real-time workloads across all networked devices.
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Edge Gateway
EPC-R4760
EPC-R4760 is an ARM based Box Computer powered by Qualcomm ARM® Cortex®-A53 APQ8016 processor that supports full HD display and intergrades on board wireless solution – Wi-Fi, BT and GPS. EPC-R4760 also features in mini PCIe, M.2, and SIM card slots for expanding connectivity capability, like 3G, 4G/LTE modules. Equipped with complete Android, Linux and Win10 IoT core BSPs, this box computer enables customers to easily develop unique application on specific OS.
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Multi-Channel (Up to Four) MIL-STF-1760 Interface Board for Conduction Cooled PCI Mezzanine Card Compatible Computers
EXC-1553ccPMC/Px(S)-1760
The EXC-1553ccPMC/Px(S)-1760 is a multi-channel (up to four) MIL-STD-1760 interface board for conduction cooled PCI Mezzanine Card compatible computers. In addition, Checksum, SRQ bit and Header Words are supported on each channel. Multi Function:Each channel operates simultaneously as a Bus controller and/or multiple (up to 32) Remote Terminals, or as a Triggerable Bus Monitor. In addition, error injection (BC and RT modes), error detection (all modes) and cableless internal loopback are suppor...show more -
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Photometers
S 1000
Universal high-precision instruments for the measurement of illuminance E with system photometer heads for laboratory applications in automated measuring systems with computer control.
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Rugged PC Compatible
SYS-427X
WINSYSTEMS’ SYS-427X is a rugged, fanless industrial computer with the Intel® Apollo Lake-I SOC quad-core processor. Its compact size, low power, and extended operational temperature make it a great fit for rugged embedded systems in the industrial control, transportation, energy, and IIoT markets. In addition to the standard system configuration, three optional configurations are available, adding WiFi 6, CAN Bus, or both.
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COM Express Rev. 3.1 Basic Size Type 7 Module with AMD Embedded Ryzen™ V3000
Express-VR7
ADLINK’s Express-VR7 COM Express Type 7 Basic size module is based on AMD Embedded Ryzen™ V3000 series processor. Offering up to 8 cores and 16 threads at 15W/45W TDP, the module exhibits the best performance per watt in its class, along with 14x PCIe Gen4 lanes with enterprise level reliability and extreme rugged temperature option (-40°C to 85°C).
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OSM R1.1 Size-L Module Based On NXP® I.MX93 Series Processor
OSM-IMX93
The OSM-IMX93 is an OSM R1.1 Size-L module featuring NXP® i.MX93 series processor with 2-core Arm Cortex-A55 & M33. With its in-SoC Arm Ethos U-65 microNPU, the module is made for edge solutions needing on-device AI processing at ultra-low power.
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COM Express Basic Size Type 7 Module with Intel Atom® C3000 SoC
Express-DN7
The Express-DN7 is a COM Express® COM.0 R3.0 Basic Size Type 7 module supporting the 64-bit Intel Atom® C3000 processor (formerly “Denverton-NS”) system-on-chip (SoC). 16 CPU cores with 31W TDP and integrated 10G Ethernet make the Express-DN7 especially suited for customers who need excellent computing performance with low power consumption, such as edge computing applications, in a long product life solution.
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COM Express® Basic Size Type 6 Module with Hexacore Mobile 9th Gen Intel® Xeon®, Core™, Pentium® and Celeron® Processors
Express-CFR
The Express-CFR is COM Express® COM.0 R3.0 Basic Size Type 6 module supporting the Hexa-core (6 cores) 64-bit 9th Generation Intel® Core™ and Xeon® processor (codename “Coffeelake Refresh-H”) with Mobile Intel® QM370, HM370, CM246 Chipset.
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COM Express Compact Size Type 6 Module with 6th Gen Intel® Core™ i7/i5/i3 and Celeron® 3955U Processors (formerly codename Sky Lake)
cExpress-SL
The cExpress-SL is a COM Express® COM.0 R2.1 Type 6 Compact size module featuring the 64-bit 6th Generation Intel® Core™ i7/i5/i3 and Intel® Celeron® Ultra-Low TDP processors (formerly Sky Lake-U") with CPU, memory controller, graphics processor and I/O hub on a single chip. Leveraging the benefits provided by the 6th generation Intel® Core™ and Celeron® System-on-Chip, the cExpress-SL is specifically designed for customers who need optimum processing and graphics performance with suitable power consumption using Intel® Configurable TDP in a long product life solution.
