Showing results: 1 - 15 of 41 items found.
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Honeywell Aerospace
Honeywell's trusted foundry of microelectronics provide strategically, radiation-hardened, integrated circuits and technology for aerospace systems and electrical designers to increase performance, reduce risks and ensure mission success in space and in other radiation-prone environments.
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Micran Co. Ltd.
Relates to the study and manufacture of very small electronic designs and components.
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Teledyne Defense Electronics
The key to any contract manufacturing project is the development, validation, and implementation of manufacturing processes that will guarantee the quality and reliability of your final product. Teledyne Advanced Electronic Solutions has over 50 years of experience in manufacturing leading edge microelectronic hybrids and modules and has implemented and perfected its core processes to ensure the success of your program.
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Das Test Haus
Services for ASIC houses and Integrated Device Manufacturers are IC Wafer / Final Test, IC assembly, Test Program development, product engineering, Flash / EEPROM programming, characterisation / capability studies, yield enhancement, design verification and failure / yield analysis. Das Test Haus are specialists for wafer test, low power, mixed signal and eeprom test.
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Bourns
We work in close collaboration with our customers to select the optimal package for an application utilizing the abundance of options, experience and technology from Bourns.
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Teledyne Defense Electronics
Teledyne e2v HiRel provides microelectronics packaging and products with a full range of packaging solutions from COTS to MIL-PRF-38534 compliant (Class H & K) qualifications. HiRel provides a one stop solution for your microelectronic assembly, evaluation, test and screening requirements. Our MCM packaging technology enable our customers to meet size, weight, power and cost (SWaPC) requirements without a sacrifice in performance. Our numerous certifications including AS9100, ISO 9001, and MIL-PRF-38534 Class H accreditation, all of which are integral factors in our company-wide initiative to deliver high-reliability microelectronic devices that meet our customers' stringent requirements. We are a DOD Trusted Source for Microelectronics Packaging, Assembly, and Test.
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Machine Vision Products
Machine Vision Products, Inc. has extensive experience in a wide range of Microelectronics and Packaging applications. MVP works with the world’s leading manufacturers on a global basis. From multiple die and wire technologies to leadframe, ball grid array and surface inspection applications, MVP has the widest applications toolbox of any AOI provider. MVP takes pride in the fact that they supply many complex inspection solutions to diverse industries such as Automotive, Telecoms, Medical Devices, Military, and Space. MVP’s 900 Series is the base platform upon which all Microelectronics and Packaging inspection solutions are based. The 900 series 2D capabilities provide metrology and defect detection using a propriety Quad-Color lighting, Telecentric optics and resolutions down to 1um. 3D height measurement capabilities allow for in-line high speed inspection of Dies, paste deposition, positional accuracy, volume and height with a resolution down to 1.13um.
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Evans Analytical Group®
EAG's Microelectronics Test and Engineering lab network provides semiconductor and electronics design firms worldwide with test, debug, and early engineering support to help you with new product introduction. We actively service a broad range of semiconductor and electronics companies worldwide. Services include ATE testing, Reliability testing and qualification, ESD testing, Failure Analysis, FIB Circuit Edit and Debug. for both ICs and systems
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Spectromatch Gloss -
Sheen Instruments
The new portable Spectrophotometer combines the latest and most advanced technology in micro-electronics and colorimetry.
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AMI P300 -
Nordson Corporation
The FastLine P300 Acoustic Microscope is specifically designed for accelerated throughput, semiautomated screening of microelectronic devices on the manufacturing floor.
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Nexus IBE Series -
Veeco Instruments Inc
Etch precise, complex features for high-yield production of discrete microelectronic devices and components with the NEXUS® Ion Beam Etch (IBE) Systems.
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Peaceful Thriving Enterprise Co Ltd
The device use microelectronic technology to monitor the variation of current, which helps technician to protect the automobile circuit from current overloading during the maintenance.
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Honeywell Aerospace
Honeywell’s space portfolio is made up of highly innovative products that span human space missions, launch vehicles, microelectronics and satellite payload and bus technology.
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Bemco Inc.
Originally developed for testing microelectronic devices for use in military and aerospace electronic systems, Bemco Vertical Thermal Shock Chambers are widely used for screening and quality evaluation of smaller electronic parts.
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Teledyne e2v
Systems used in high-performance, safety-critical or mission-critical applications need to incorporate superior microelectronics technology. Often the hardware required is not readily available off the shelf, as particular characteristics or constraints exist that mean a bespoke solution will be necessary. That can add considerable complexity to development projects, so partnering with a recognized specialist in this area is advised.By engaging with Teledyne e2v Semiconductors, you are benefitting from decades’ worth of microelectronics experience - gaining access to a unique to the market one-stop-shop which is capable of developing the technology needed for even the most demanding situations.