Showing results: 76 - 90 of 1320 items found.
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Q-400 -
Dantec Dynamics A/S
The Digital 3D Image Correlation System Q-400 is an optical measuring device for true full-field, non-contact, three-dimensional measurement of shape, displacements and strains on components and structures made from almost any material.The Q-400 system is used for determination of three-dimensional material properties in tensile, torsion, bending or combined tests. In addition, deformation and strain analysis can be applied to fatigue tests, fracture mechanics, FEA validation, and much more.
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Hydra3D -
Teledyne e2v
Hydra3D is a 832 x 600 pixel resolution Time-of-Flight (ToF) CMOS image sensor, designed with Teledyne e2v’s proprietary CMOS technology, enabling the next generation of 3D vision systems. Hydra3D includes a 10µm three-tap cutting-edge pixel, which provides very fast transfer times for customers seeking the highest levels of 3D imaging performance, including high depth resolution, high speed and flexible operation conditions.
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L3Harris Geospatial Solutions, Inc
Accurately and reliably monitoring the Earth is critical to many geophysical and geospatial applications. However, most sensors cannot capture data at night or through clouds, dust or smoke.
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SpyderCUBE™ -
Datacolor AG
Accelerate RAW processing by taking one reference shot under any light condition to set the white balance, exposure, black level and brightness right from the start for your entire series of photos.
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LMK 6 -
TechnoTeam Bildverarbeitung GmbH
The LMK 6 is TechnoTeam's luminance measurement camera and used in many ways as a standalone measuring device. It is designed to be compact and lightweight and can be used in almost any light measurement application. As it is one of TechnoTeam's core products it is also used in our other camera based measurement systems.
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GeoPod -
Jacobs
Capturing the highest quality mapping imagery requires a partnership of high-tech tools and industry-leading talent. This is where GeoPodTM thrives, thanks to its potent combination of cutting-edge technology, seamless hardware integration and pioneering software, and the focused recruitment of leading experts and specialists. The result: a proven, integrated system that uniquely enables geographically distributed imagery mapping of the highest grade, accuracy and reliability.
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Cheetah Series -
Xenics
The Cheetah 640 series is based on a cooled, in-house developed InGaAs detector with a 640 x 512 pixel resolution. The Cheetah 640 camera with single-stage TE-cooled detector offers high frame rates of either 400 Hz, 800 Hz or 1700 Hz while the version with three-stage TE-cooled detector offers a frame rate of up to 110 Hz. The camera comes with a CameraLink interface.
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TopoStitch -
Image Metrology A/S
topoStitch™ offers the easiest and most accurate way to stitch topographic or greyscale images from Scanning Probe Microscopes (SPM’s), profilers, interferometers, confocal microscopes or any other instrument type. All images are placed automatically according to stage position coordinates when stored in the image files. Otherwise, the Grid Layout Wizard helps to lay out images in seconds. topoStitch™ even offers advanced snapping and semi transparent rendering, which makes it easy to place and adjust images manually.
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Xcelera-HS PX8 -
Teledyne DALSA
The Xcelera-HS PX8 has been built within Teledyne DALSA’s Trigger-to-Image Reliability technology framework. Trigger-to-Image Reliability leverages Teledyne DALSA’s hardware and software innovations to control, monitor and correct the image acquisition process from the time that an external trigger event occurs to the moment the data is sent to the host, providing traceability when errors do occur and permitting recovery from those errors.
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ViTec Co. Ltd
To develop a complex for visual inspection of electronic components (other micro-objects) in order to identify visual defects, record the resulting image and transfer information for processing.
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EduDIC -
Dantec Dynamics A/S
EduDIC is a complete Digital Image Correlation (DIC) measurement system, designed as a simple and convenient educational training tool for academic courses in experimental solid mechanics. This easy-to-use system allows academic instructors to effectively present the optical measurement technique of DIC for materials testing to the engineers and scientists of tomorrow.
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ProcVision -
Gidel
Gidel’s Vision Pro Development Kit is an optimal solution for developing,validating, demonstrating and evaluating Image Processing (IP) andpipeline designs on FPGA.The suite is designed to provide a complete and convenient envelop enablingthe developer to focus strictly on the proprietary image processingdesign. The entire Vision Pro flow is within a single FPGA, independentof the final target application(s). The Vision Pro flow is composedof a pipeline that streams simulated data to the user image processingdesign under test (DUT) and then captures the design’s output streamfor displaying, storing, analysis and/or co-processing on host software.The entire process is performed on a single FPGA without the need foradditional peripheral connectivity or tools.Vision Pro suite is plug-and-play enabling the developer to begin at oncethe IP design development and validation. A simple design example providesthe developer immediate hands-on familiarization with the systemflow and supporting tools. The final design can be ported to any IntelFPGA device or other vendors’ devices (FPGA or ASIC) by replacing basiclibraries. To significantly reduce compilation time, initial design developmentmay be on a small FPGA device and later compiled for the targetdevice(s). The target implementation may use any FPGA board. For a fullImaging/Vision system solution, Gidel offers a number of off-the-shelfgrabbers and FPGA accelerators that are designed to utilize these imageprocessing blocks and Gidel Imaging Library (GIL).
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Teledyne e2v
EM (Electron Multiplication) is a technology that uses on-chip gain in the charge domain to effectively eliminate read noise from an image sensor. This enables advanced ultra-low light applications that require extreme sensitivity at fast frame rates such as adaptive optics and lucky imaging™.The combination of Teledyne e2v’s back-thinning technology and anti-reflection coatings enables industry leading quantum efficiency that can be optimised for applications in the visible, UV or NIR wavelength ranges.