CSP
Test connector assemblies that mate with the pads on an integrated circuit's chip size packaging.
See Also: WLCSP
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Product
DC Power Supply
CSP-2
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● A wide range selectable to meet various application● 230K~300Khr. MTBF● RoHS version in option● Compact size with DIN rail mounting
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Product
Standard 1.90 (53.90) - 8.00 (226.80) High Frequency Probe
CSP-40B-012
High Frequency Probe
Nominal Impedance (Ohms): 50Dielectric VTE Rating (k VAC): 1Bandwidth @ -1dB (GHz): 6.00Return Loss @ -20dB (GHz): 2.30Test Center (mil): 250Test Center (mm): 6.35Full Travel (mil): 200Full Travel (mm): 5.08Full Travel Remark: Shield: 275 (6.99) including travel of probesRecommended Travel (mil): 133Recommended Travel (mm): 3.38Recommended Travel Remark: Shield: 211 (5.36) including travel of probesOverall Length (mil): 1,151Overall Length (mm): 29.24
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Product
Test & Burn-In Socket for Devices up to 13mm Square
CSP/MicroBGA
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Test & Burn-In Socket. Socket is easily mounted and removed to & from the BIB due to solderless pressure mount compression spring probes which, are accurately located by two molded plastic alignment pins and mounted with four stainless steel screws. Standard molded socket format can accommodate any device package of 13mm or smaller, by using machined (for small quantities) or custom molded (for large quantities) pressure pads and interposers.
