Deep Packet Inspection
check to examine data within a packet. Also known as: DPI
-
Product
3D Automated Optical Inspection System
EAGLE 3D 8800 SERIES
-
EAGELE 3D 8800 AOI applies 8-way projection for 3Dmeasurements to all models, minimizing shadow effectserrors and performing 100% 2D&3D examinations simultaneouslyin all FOV areas.
-
Product
Auto Macro Wafer Defect Inspection
EagleView
-
EagleView automated macro defect semiconductor wafer inspection system provides industry leading throughput, defect detection accuracy, and wafer classification for semiconductor manufacturing. EagleView systems have inspected over 100 million semiconductor wafers worldwide. The EagleView macro defect inspection tool resolves many of the problems and pitfalls of manual and micro wafer inspection by automating and standardizing semiconductor wafer inspection processes while creating complete images of every wafer in the cassette. Unlike manual micro defect wafer inspection, EagleView’s automated wafer inspection is always consistent, tireless, reliable, and fast. EagleView helps find macro defects while there’s still time to take corrective action.
-
Product
NUV-PL SiC Defect Inspection System
VS6845E
-
Industrial Vision Technology Pte Ltd.
Comply with IEC63068-3 Standard: Test method for defects using photoluminescence, Model VS-6845 SiC Wafer defect inspection system has capability on Non-destructive recognition criteria of defects in silicon carbide homoepitaxial wafer for power devices.
-
Product
Enclosure, 50 Module, Hinged Cover Plate, 4" Deep
410112199
Enclosure
The Enclosure for the 50 module ITA is made of aluminum, painted black and secured to the ITA by eight socket head cap screws (included). The top of the enclosure is a hinged cover plate with quarter turn hardware that provides easy access to the ITA’s wiring when required.
-
Product
Foreign Matter Inspection Device For FPDs
HS-930
-
By adopting our original optical technology, we achieve an inspection speed of about 30% up (compared to HS-830). Improved the front / back judging ability to thin substrates.
-
Product
Post Wire and Die Bond Inspection Machine
IV-E1700
-
IV-E1700 is a post wire and die bond inspection machine that is known for having a proven, effective and patented 2D+3D Inspection system. This product is best used to weed out defects with data collection for process improvement and reports for SPC quality Control.
-
Product
Defect Inspection Systems
-
Candela® defect inspection systems detect and classify a wide range of critical defects on compound semiconductor substrates (GaN, GaAs, InP, sapphire, SiC, etc.) and hard disk drives, with high sensitivity at production throughputs.
