Interposers
interconnect between one connection to another.
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DDR4 X16, 2-Wing, Small KOV, BGA Interposer For Logic Analyzers
W4636A
The W4636A DDR4 x16 – 2 wing BGA interposer for 96 ball DDR4 DRAM is designed for data rates up to and including 2.4 Gb/s. The W4636A probes all ADD/CMD/CNTRL and partial DQ/DQS, and it is designed for minimal KOV for space limited systems under test. The W4636A is the least expensive DDR4 BGA interposer for a logic analyzer.
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VPX Interposer
VPX850
The PCIE850 provides a complete test and debug solution for PCI Express Bus. Interposers and probes connect to the PCIE850 providing access to PCI Card, AMX, XMC and VPX systems.
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Test & Burn-In Socket for Devices up to 13mm Square
CSP/MicroBGA
Test & Burn-In Socket. Socket is easily mounted and removed to & from the BIB due to solderless pressure mount compression spring probes which, are accurately located by two molded plastic alignment pins and mounted with four stainless steel screws. Standard molded socket format can accommodate any device package of 13mm or smaller, by using machined (for small quantities) or custom molded (for large quantities) pressure pads and interposers.
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DDR3 X16 Non-Stacked DRAM BGA Interposer For Logic Analyzers
W3636A
The W3636A DDR4 x16 BGA interposer allows you to gain signal access to the DDR3 signals critical to your debug and validation effort through a logic analyzer. The probe works in existing designs and eliminates the need for up-front planning or redesign. The probe connects directly to the balls of the DDR3 x16 non-stacked DRAM or with an optional 3rd party socket (not provided) enabling operation and acquisition of high-speed DDR3 signals without impacting the performance of your design.
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DDR4 MSO Probes
The DDR4 DIIM and SO-DIMM Mixed Signal Interposers connect Address, Command and Control signals of a DDR4 bus to the Keysight V-Series Oscilloscopes with the MSO option. These interposers also provide accessibility to DDR4 signals for convenient analog probing. The user can then easily observe both the digital and analog representation of the DDR4 Address, Command and Control bus. Solder down N5541A analog probes purchased separately from Keysight Technologies.
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XMC Interposer
XMC850
The PCIE850 provides a complete test and debug solution for PCI Express Bus. Interposers and probes connect to the PCIE850 providing access to PCI Card, AMX, XMC and VPX systems.
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PCI Express 4.0 Test Platform
The PCI Express 4.0 Test Platform provides a convenient means for testing PCIe 4.0 add-in cards with an internal interposer and power supplies. The Summit Z416 Test Platform provides the platform for the Summit Z416 to act as a host emulator, and provides a general purpose test backplane and interposer for testing Gen4, Gen3, Gen2 or Gen1 hosts and devices. It supports SMBus and other sideband signals.
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LPDDR3 178-ball BGA Interposer For Logic Analyzers
W3301A
The W3301A LPDDR3 rigid BGA interposer for LPDDR3 178-ball DRAM enables capture of simultaneous read and write traffic at data rates in excess of 1866 Mb/s. E5406A Soft Touch probes and U4201A cables connect the W3301A LPDDR3 BGA interposer into the U4164A logic analyzer module. The W3301A LPDDR3 178-ball rigid BGA interposer allows signal access to the LPDDR3 signals critical to your debug and validation effort through a U4164A logic analyzer. The probe works in existing designs and eliminates the need for up-front planning or redesign. The probe connects directly to the balls of the DRAM using a LPDDR3 178-ball riser (included) or an optional 3rd party socket (not provided), enabling operation and acquisition of LPDDR3 signals.
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PCIe 4.0 Test Platform
PXP-400A
The Teledyne LeCroy PXP-400A Test Platform provides a convenient means for testing PCIe 4.0 cards with a self-contained portable and powered passive backplane. The PXP-400A provides power required for both cards under test, and an interposer can be used for connection to a protocol analyzer.
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PCI Express® 5.0 Interposer
OCP NIC 3.0
The Summit product family includes a wide variety of Interposer systems, designed to reliably capture serial data traffic while minimizing perturbations in the serial data stream. Probes include interposers, which are designed to capture data traffic crossing the PCI Express card connector interface, and MidBus probes, which are designed to capture traffic flowing within a PCB.
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Flat Flex Test Fixtures
Z-AXIS Flex Circuit Test Fixtures are used to connect flex circuits to test equipment. 20,000 plus cycles. Using the Z-Axis Elastomeric Connector Interposer, the connection to the OEM FFC connector becomes permanent and is thereby saved from over-use.
